Curvature Compensated CMOS Bandgap Reference with Novel Process Variation Calibration Technique

A lowtemperature coefficient（ TC） bandgap reference（ BGR） with novel process variation calibration technique is proposed in this paper. This proposed calibration technique compensating both TC and output value of BGR achieves fine adjustment step towards the reference voltage,while keeping optimal TC by utilizing large resistance to help layout match. The high-order curvature compensation realized by poly and p-diffusion resistors is introduced into the design to guarantee the temperature characteristic. Implemented in 180 nm technology,the proposed BGR has been simulated to have a power supply rejection ratio（ PSRR） of 91 dB@100 Hz. The calibration technique covers output voltage scope of 0. 49 V-0. 56 Vwith TC of 9. 45 × 10^（-6）/℃-9. 56 × 10^（-6）/℃ over the temperature range of-40 ℃-120 ℃. The designed BGR provides a reference voltage of 500 mV,with measured TC of 10. 1 × 10^（-6）/℃.

Quality of correlation in quantum information

A strong and stable correlation in quantum information is of high quality for quantum information processing.We define two quantities,selective average correlation and ripple coefficient,to evaluate the quality of correlation in quantum information in a time interval.As a new communication channel,Heisenberg spin chains are widely investigated.We select a two-qubit Heisenberg XXZs pin chain with Dzyaloshinskii-Moriya interaction in an inhomogeneous magnetic field as an example,and use the two quantities to evaluate the qualities of the correlation in quantum information with different measures.The result shows that,if the time evolutions are similar,there needs only evaluating one of them to know when the correlation has high quality for quantum information processing.

Grain Size Distribution and Interfacial Heat Transfer Coefficient during Solidification of Magnesium Alloys Using High Pressure Die Casting Process

The objective of this study is to predict grain size and heat transfer coefficient at the metal-die interface during high pressure die casting process and solidification of the magnesium alloy AM60. Multiple runs of the commercial casting simulation package, ProCASTTM, were used to model the mold filling and solidification events employing a range of interfacial heat transfer coefficient values. The simulation results were used to estimate the centerline cooling curve at various locations through the casting. The centerline cooling curves, together with the die temperature and the thermodynamic properties of the alloy, were then used as inputs to compute the solution to the Stefan problem of a moving phase boundary, thereby providing the through-thickness cooling curves at each chosen location of the casting, Finally, the local cooling rate was used to calculate the resulting grain size via previously established relationships. The effects of die temperature, filling time and heat transfer coefficient on the grain structure in skin region and core region were quantitatively characterized. It was observed that the grain size of skin region strongly depends on above three factors whereas the grain size of core region shows dependence on the interracial heat transfer coefficient and thickness of the samples. The grain size distribution from surface to center was estimated from the relationship between grain size and the predicted cooling rate. The prediction of grain size matches well with experimental results. A comparison of the predicted and experimentally determined grain size profiles enables the determination of the apparent interracial heat transfer coefficient for different locations.