The reliability analysis, based on the reliability index method, of two dimensional slopes is generalized by taking Sarma′s acceleration as the performance function. That is to say, a general expression of the perfo...The reliability analysis, based on the reliability index method, of two dimensional slopes is generalized by taking Sarma′s acceleration as the performance function. That is to say, a general expression of the performance function is given under various kinds of slice methods, even under various shapes of slice partition, beyond the traditional vertical slice method. A simple example shows explicitly the relationship of four commonly used slice methods in the slope reliability analysis. It is also found that the results of the reliability analysis are basically consistent with those of the stability analysis based on Sarma′s method.展开更多
The swelling of SU-8 mold is one of the most important factors influencing the dimensional accuracy of a metal mieropart produced by ultra-violet lithography galvanik abformung（UV-LIGA）. The isolation belt struc- tu...The swelling of SU-8 mold is one of the most important factors influencing the dimensional accuracy of a metal mieropart produced by ultra-violet lithography galvanik abformung（UV-LIGA）. The isolation belt struc- ture is usually employed to enhance the dimensional accuracy of electroformed metal mieropart. However, noble metal is wasted because the isolation belt is filled with metal when noble metal mieroparts are fabricated. There- fore, a semi-isolation belt structure is presented to save noble metal. Furthermore, a high current density is also introduced to shorten the eleetroforming time, and thus the dimensional accuracy of electroformed gold micropart is improved by using the electrolyte jet. The experimental results indicate that both the semi-isolation belt and the high current density can help to enhance the dimensional accuracy of electroformed gold micropart. Its dimen- sional error is only 5 μm at the current density of 0. 6 A/dm2 while the semi-isolation belt structure is used.展开更多
随着电子设备的广泛应用,印刷电路板(Printed Circuit Board,PCB)在电子制造行业中具有重要意义.然而,由于制造过程中的不完美和环境因素的干扰,PCB上可能存在微小的缺陷.因此,开发高效准确的缺陷检测算法对于确保产品质量至关重要.针对...随着电子设备的广泛应用,印刷电路板(Printed Circuit Board,PCB)在电子制造行业中具有重要意义.然而,由于制造过程中的不完美和环境因素的干扰,PCB上可能存在微小的缺陷.因此,开发高效准确的缺陷检测算法对于确保产品质量至关重要.针对PCB微小缺陷检测问题,本文提出了一种基于多维注意力机制的高精度PCB微小缺陷检测算法.为降低网络的模型参数量和计算量,引入部分卷积(Partial Convolution,PConv),将ELAN(Efficient Layer Aggregation Network)模块设计为更加高效的P-ELAN,同时,为增强网络对微小缺陷的特征提取能力,引入多维注意力机制(Multi-Dimensional Attention Mechanism,MDAM)的全维动态卷积(Omni-dimensional Dynamic Convolution,ODConv)并结合部分卷积,设计了POD-CSP(Partial ODconv-Cross Stage Partial)和POD-MP(Partial ODconv-Max Pooling)跨阶段部分网络模块,提出了OD-Neck结构.最后,本文基于(Youo Only Look Once version 7,YOLOv7)提出了对小目标更加高效的YOLO-POD模型,并在训练阶段采用一种新颖的Alpha-SIoU损失函数对网络进行优化.实验结果表明,YOLO-POD的检测精确率和召回率分别达到了98.31%和97.09%,并在多个指标上取得了领先优势,尤其是对于更严格的(mean Average Precision at IoU threshold of 0.75,mAP75)指标,比原始的YOLOv7模型提高28%.验证了YOLO-POD在PCB缺陷检测性能中具有较高的准确性和鲁棒性,满足高精度的检测要求,可为PCB制造行业提供有效的检测解决方案.展开更多
文摘The reliability analysis, based on the reliability index method, of two dimensional slopes is generalized by taking Sarma′s acceleration as the performance function. That is to say, a general expression of the performance function is given under various kinds of slice methods, even under various shapes of slice partition, beyond the traditional vertical slice method. A simple example shows explicitly the relationship of four commonly used slice methods in the slope reliability analysis. It is also found that the results of the reliability analysis are basically consistent with those of the stability analysis based on Sarma′s method.
基金Supported by the National Natural Science Foundation of China(91023018)~~
文摘The swelling of SU-8 mold is one of the most important factors influencing the dimensional accuracy of a metal mieropart produced by ultra-violet lithography galvanik abformung（UV-LIGA）. The isolation belt struc- ture is usually employed to enhance the dimensional accuracy of electroformed metal mieropart. However, noble metal is wasted because the isolation belt is filled with metal when noble metal mieroparts are fabricated. There- fore, a semi-isolation belt structure is presented to save noble metal. Furthermore, a high current density is also introduced to shorten the eleetroforming time, and thus the dimensional accuracy of electroformed gold micropart is improved by using the electrolyte jet. The experimental results indicate that both the semi-isolation belt and the high current density can help to enhance the dimensional accuracy of electroformed gold micropart. Its dimen- sional error is only 5 μm at the current density of 0. 6 A/dm2 while the semi-isolation belt structure is used.
文摘随着电子设备的广泛应用,印刷电路板(Printed Circuit Board,PCB)在电子制造行业中具有重要意义.然而,由于制造过程中的不完美和环境因素的干扰,PCB上可能存在微小的缺陷.因此,开发高效准确的缺陷检测算法对于确保产品质量至关重要.针对PCB微小缺陷检测问题,本文提出了一种基于多维注意力机制的高精度PCB微小缺陷检测算法.为降低网络的模型参数量和计算量,引入部分卷积(Partial Convolution,PConv),将ELAN(Efficient Layer Aggregation Network)模块设计为更加高效的P-ELAN,同时,为增强网络对微小缺陷的特征提取能力,引入多维注意力机制(Multi-Dimensional Attention Mechanism,MDAM)的全维动态卷积(Omni-dimensional Dynamic Convolution,ODConv)并结合部分卷积,设计了POD-CSP(Partial ODconv-Cross Stage Partial)和POD-MP(Partial ODconv-Max Pooling)跨阶段部分网络模块,提出了OD-Neck结构.最后,本文基于(Youo Only Look Once version 7,YOLOv7)提出了对小目标更加高效的YOLO-POD模型,并在训练阶段采用一种新颖的Alpha-SIoU损失函数对网络进行优化.实验结果表明,YOLO-POD的检测精确率和召回率分别达到了98.31%和97.09%,并在多个指标上取得了领先优势,尤其是对于更严格的(mean Average Precision at IoU threshold of 0.75,mAP75)指标,比原始的YOLOv7模型提高28%.验证了YOLO-POD在PCB缺陷检测性能中具有较高的准确性和鲁棒性,满足高精度的检测要求,可为PCB制造行业提供有效的检测解决方案.
