Device Characteristics Comparison Between GaAs Single and Double Delta-Doped Pseudomorphic High Electron Mobility Transistors

The Al 0.24Ga 0.76As/In 0.22Ga 0.78As single delta-doped PHEMT (SH-PHEMT) and double delta-doped PHEMT (DH-PHEMT) are fabricated and investigated.Based on the employment of double heterojunction,double delta doped design,the DH-PHEMT can enhance the carrier confinement,increase the electron gas density,and improve the electron gas distribution,which is beneficial to the device performance.A high device linearity,high transconductance over a large gate voltage swing,high current drivability are found in DH-PHEMT.These improvements suggest that DH-PHEMT is more suitable for high linearity applications in microwave power device.

C band microwave damage characteristics of pseudomorphic high electron mobility transistor

The damage effect characteristics of GaAs pseudomorphic high electron mobility transistor(pHEMT)under the irradiation of C band high-power microwave(HPM)is investigated in this paper.Based on the theoretical analysis,the thermoelectric coupling model is established,and the key damage parameters of the device under typical pulse conditions are predicted,including the damage location,damage power,etc.By the injection effect test and device microanatomy analysis through using scanning electron microscope(SEM)and energy dispersive spectrometer(EDS),it is concluded that the gate metal in the first stage of the device is the vulnerable to HPM damage,especially the side below the gate near the source.The damage power in the injection test is about 40 dBm and in good agreement with the simulation result.This work has a certain reference value for microwave damage assessment of pHEMT.

Monolithic Integration of InGaP/AlGaAs/InGaAs Enhancement/Depletion-Mode PHEMTs

The monolithic integration of enhancement- and depletion-mode （E/D-mode） InGaP/AIGaAs/InGaAs pseudomorphic high electron mobility transistors （PHEMTs） with a 1.0μm gate length is presented. Epilayers are grown on SI GaAs substrates using MBE. For this structure, a mobility of 5410cm^2/（V · s） and a sheet density of 1.34 × 10^12 cm^-2 are achieved at room temperature. During the gate fabrication of E/D-mode PHEMTs,a novel twostep technology is applied. The devices with a gate dimension of 1μm × 100μm exhibit good DC and RF performances. Threshold voltages of 0. 2 and -0. 4V,maximum drain current densities of 300 and 340mA/mm,and extrinsic transconductances of 350 and 300mS/mm for E- and D-mode PHEMTs are obtained, respectively. The reverse gatedrain breakdown voltage is -14V for both E- and D-mode. Current-gain cutoff frequencies of 10. 3 and 12.4GHz and power-gain cutoff frequencies of 12.8 and 14.7GHz for E- and D-mode are reported, respectively.

Design of 35 GHz 1 Watt GaAs pHEMT Power Amplifier MMIC

By using 0.15 μm GaAs pHEMT （pseudomorphic high electron mobility transistor） technology,a design of millimeter wave power amplifier microwave monolithic integrated circuit （MMIC） is presented.With careful optimization on circuit structure,this two-stage power amplifier achieves a simulated gain of 15.5 dB with fluctuation of 1 dB from 33 GHz to 37 GHz.A simulated output power of more than 30 dBm in saturation can be drawn from 3 W DC supply with maximum power added efficiency （PAE） of 26%.Rigorous electromagnetic simulation is performed to make sure the simulation results are credible.The whole chip area is 3.99 mm2 including all bond pads.