Effects of cold rolling path on recrystallization behavior and mechanical properties of pure copper during annealing

The recrystallization behavior,grain boundary characteristic distribution,and mechanical properties of pure Cu sheets that were subjected to different cold rolling paths,and then annealed at 400°C for 10,30,60,and 420 min,were investigated.Different rolling paths changed the grain boundary orientations of cold-rolled copper,causing recrystallized grains to nucleate and grow in an oriented manner.However,the evolution of the texture indicated that cold-rolled copper with different rolling paths did not show an obvious preferred orientation after annealing.The RD-60 specimen exhibited the smallest grain size(6.6μm).The results indicated that the grain size and low-ΣCSL grain boundaries worked together to provide RD-60 samples with appropriate mechanical properties and high plasticity.The yield strength,ultimate tensile strength,and elongation of RD-60 sample were 81 MPa,230 MPa,and 49%,respectively.These results could provide guidance for tuning the microstructures and properties of pure Cu foils,as well as designing fabrication routes for pure Cu foils through processes such as rolling and drawing.

Effect of processing route on grain refinement in pure copper processed by equal channel angular extrusion

An experimental study of the microstructures in pure copper billets processed by 8 passes of equal channel angular extrusion （ECAE） via an extended range of processing routes with a 90° die is carried out. Each processing route is defined according to the inter-pass billet rotation angle （χ）, which varies from 0° to 180°. According to the generation of high-angle boundaries and reduction of grain size by electron backscatter diffraction （EBSD） measurements, the grain refinement is found to be most efficient for route with χ=90°and least efficient with χ=180°, among the seven routes studied. This trend is supported by supplementary transmission electron microscopy （TEM） measurements. Comparison of the EBSD and TEM data reveals the importance of considering the non-equiaxity of grain structures in quantitative assessment of microstructural differences in ECAE-processed materials.

Primary-transient creep and anelastic backflow of pure copper deformed at low temperatures and ultra-low strain rates

Creep and anelastic backflow behaviors of pure copper （4N Cu） with grain size dg=40 μm were investigated at low temperatures of T〈0.3Tm （Tm is melting point） and ultra-low creep rates of ε≤1×10^-10 s^-1 by a high strain-resolution measurement （the helicoid spring specimen technique）. Analysis of creep data was based on the scaling factors of creep curves instead of the conventional extrapolated steady-state creep rate. Power-law creep equation is suggested to be the best for describing the primary transient creep behavior, because the pre-parameter does not apparently change with elapsed time. The observed anelastic strains are 1/6 of the calculated elastic strains, and linear viscous behavior was identified from the logarithm plot of the anelastic strain rate versus anelastic strain （slope equals 1）. Therefore, the creep anelasticity is suggested to be due to the unbowing of there-dimensional network of dislocations.

Effect of pulse magnetic field on solidification structure and properties of pure copper

The application of pulse magnetic field to metal solidification is an advanced technique which can remarkably refine solidification structure. In this paper, the effect of pulse magnetic field on solidification structure, mechanical properties and conductivity of pure copper was experimentally investigated. The results showed that the solidification structure transformed from coarse columnar crystal to fine globular crystal with increasing pulse voltage. Increasing pulse voltage also improved the tensile strength. However, with the increase of pulse voltage, the elongation and electrical resistivity firstly decreased, then increased when the pulse voltage beyond a critical value. Moreover, in some conditions, pulse magnetic field can simultaneously improve the conductivity and mechanical property of pure copper.

Effects of microrolling parameters on the microstructure and deformation behavior of pure copper

Microrolling experiments and uniaxial tensile tests of pure copper under different annealing conditions were carried out in this paper. The effects of grain size and reduction on non-uniform deformation, edge cracking, and microstructure were studied. The experimen- tal results showed that the side deformation became more non-uniform, resulting in substantial edge bulge, and the uneven spread increased with increasing grain size and reduction level. When the reduction level reached 80% and the grain size was 65 μm, slight edge cracks occurred. When the grain size was 200 μm, the edge cracks became wider and deeper. No edge cracks occurred when the grain size was 200 μm and the reduction level was less than 60%; edge cracks occurred when the reduction level was increased to 80%. As the reduction level increased, the grains were gradually elongated and appeared as a sheet-like structure along the rolling direction; a fine lamellar structure was obtained when the grain size was 20 lam and the reduction level was less than 60%.

Electrolytic Sampling from Pure Copper and Common Brasses Ⅰ: Calculation of the Mass Dissolved from the Samples according to Faraday's Law

In a procedure for electrolytic dissolving pure copper and common brasses, the approximate electrochemical mole mass(k) of the sample was determined in accordance with the brand of the sample, a stitable electrolyte was selected to make the current efficiency equal to 100%, and then the dissolved mass of samples was calculated according to Faraday's law(m=klt).Three representative samples were sampled by the electrolytic dissolution method and the calculated dissolved amounts were equal to the values by weighing the anode.The cxperimental results of zinc and copper in the anode liquor are in agreement with certified values.

Microstructure and mechanical properties of laser welded joints of pure copper and 304 stainless steels

A continuous wave diode laser with an output power of 2.8 kW was used to join pure copper and 304 stainless steel with a thickness of 1 mm. The focused laser beam with a diameter of O. 8 mm was irradiated on the copper side of the butt joints. In process of laser welding, effects of processing primary parameters on tensile strength of the joints were investigated. The interfacial characterizations of the joints were investigated by metallographic microscope, scanning electron microscope （SEM） and energy dispersive X-ray spectroscope （EDS）. The results showed that the element diffusion and solution occur and metallurgical bonding was achieved between pure copper and 304 stainless steel. The maximum tensile strength of the joints was 209 MPa when the laser power of welding was 2. 4 kW and welding speed was 12 mm/s.

Microstructure and properties of pure iron/copper composite cladding layers on carbon steel

In the present study, pure iron/copper composite metal cladding was deposited onto carbon steel by tungsten inert gas welding. The study focused on interfacial morphological, microstructural, and mechanical analyses of the composite cladding layers. Iron liquid–solid-phase zones were formed at copper/steel and iron interfaces because of the melting of the steel substrate and iron. Iron concentrated in the copper cladding layer was observed to exhibit belt, globule, and dendrite morphologies. The appearance of iron-rich globules indicated the occurrence of liquid phase separation（LPS） prior to solidification, and iron-rich dendrites crystallized without the occurrence of LPS. The maximum microhardness of the iron/steel interface was lower than that of the copper/steel interface because of the diffusion of elemental carbon. All samples fractured in the cladding layers. Because of a relatively lower strength of the copper layer, a short plateau region appeared when shear movement was from copper to iron.

A gradient nano/micro-structured surface layer on copper induced by severe plasticity roller burnishing

In order to investigate a gradient nano/micro-structured surface layer on pure copper produced by severe plasticity roller burnishing （SPRB） and grain refinement mechanism, the microstructure characteristics and material properties of sample at various depths from the topmost surface were investigated by SEM, TEM, XRD, OM etc. The experimental results show that the gradient nano/micro-structure was introduced into the surface layer of over 100μm in thickness. The remarkable increase in hardness near the topmost surface was mainly attributed to the reduced grain size. The equiaxed nano-sized grains were in random orientation and the most of their boundaries were low-angle grain boundaries （LAGBs）. The coarse grains are refined into the few micro-sized grains by dislocation activities;deformation twinning was found to be the primary form for the formation of submicron grains;the formation of nanostructure was dominated by dislocation activities accompanied with rotation of grains in local region.

Establishment of size-dependant constitutive model of micro-sheet metal materials

The inherent mechanism of size effect in micro-sheet material behavior of plastic forming was explained by the surface layer model and theory of metal crystal plasticity. A size-dependant constitutive model based on the surface layer model was established by introducing the scale parameters and modifying the classical Hall-Petch equation. The influence of the geometric dimensions and the grain size on the flow behavior of the material was discussed using the new material constitutive model. The results show that, the flow stress decreases while the sheet metal thickness decreases when the grain size keeps constant, and the micro-sheet metal with a larger grain size is more easily to be influenced by the size effects. The material constitutive model established is validated by the stress-strain curve of the micro-sheet metal with different thicknesses derived from the tensile experiments. The rationality of the material model is verified by the fact that the calculation results are consistent with the experimental results.

纯铜杆件局部受控的动态拉伸试验(英文)

在所发明的一种基于一级气体炮的高速冲击拉伸试验装置(HSTF)上,于多根纯铜杆件上安装特制夹具,控制试件不同的局部延伸,得到试件不同阶段的实验结果,取得冲击拉伸杆颈缩与断裂"凝固化"了的过程信息,揭示了纯铜试件在冲击拉伸下动态断裂过程的不同阶段.对于回收的纯铜试件,进行了扫描电镜分析.将Ragab提出的在轴对称颈缩区域中心放置特征空穴的简化模型从准静态推广到动态,旨在预测纯铜杆件在冲击拉伸下的局部化颈缩与断裂.

Effects of lanthanum addition on microstructure and mechanical properties of as-cast pure copper

As-cast Cu-La alloys with La contents in the range of 0–0.32 wt.% were fabricated by vacuum melting method. The effects of La on microstructure and mechanical properties of as-cast pure copper were investigated using optical microscopy（OM）, scanning electronic microscopy（SEM）, transmission electron microscopy（TEM）, X-ray diffraction（XRD） and tensile test. The results showed that La had obvious effects on the solidification microstructure and the grain refinement of as-cast pure copper. With the increase of La content, the ultimate tensile strength, the yield strength and the microhardness increased gradually, but the elongation increased first and then decreased while La content exceeded 0.089 wt.%. The improvement of mechanical properties was attributed to the effect of grain refinement strengthening, solid solution strengthening, second phase strengthening and purifying. However, excessive adding La would deteriorate the elongation owing to the excessive Cu6 La phases.

Dissimilar Joining of Pure Copper to Aluminum Alloy via Friction Stir Welding

In this study, the dissimilar friction stir welding （FSW） butt joints between aluminum alloy 5754-H114 and commerciallypure copper were investigated. The thickness of welded plates was 4 mm and the aluminum plate was placed on theadvancing side. In order to obtain a suitable flow and a better material mixing, a 1-mm offset was considered for thealuminum plate, toward the butt centerline. For investigating the microstructure and mechanical properties of FSWedjoints, optical microscopy and mechanical tests （i.e., uniaxial tensile test and microhardness） were used, respectively.Furthermore, the analysis of intermetallic compounds and fracture surface was examined by scanning electron microscopyand X-ray diffraction. The effect of heat generation on the mechanical properties and microstructure of the FSWed jointswas investigated. The results showed that there is an optimum amount of heat input. The intermetallic compounds formedin FSWed joints were A14Cu9 and AI2Cu. The best results were found in joints with 1000 rpm rotational speed and100 mm/min travel speed. The tensile strength was found as 219 MPa, which reached 84% of the aluminum base strength.Moreover, maximum value of the microhardness of the stir zone （SZ） was attained as about 120 HV, which was greatlydepended on the grain size, intermetallic compounds and copper pieces in SZ.

纯铜棒材三辊螺旋轧制过程数值模拟

三辊螺旋轧机适合于多品种、小批量、难变形材料的小尺寸管棒材开坯。通过对三辊螺旋轧制辊形设计和轧制过程进行研究,根据轧辊辊形计算方程,获得三辊螺旋轧机轧辊各段辊形参数。采用Simufact.Forming软件模拟了纯铜棒材三辊螺旋轧制过程。结果显示,纯铜棒材在三辊螺旋轧制过程中的变形规律为圆形—三角形—圆形的连续过程,轧件在变形段温度可达360℃左右,在轧辊与轧件接触区域内的最大应力为590MPa,最大等效塑性应变为3.8。轧辊在Z轴方向上所受最大载荷为43k N,而在X、Y轴方向上的最大载荷为350k N。Z方向的轴向力有助于铜棒的轴向咬入和抛出,X、Y方向的径向力主要起到减径和定径的作用。

Effect of Initial Grain Size on the Hot Deformation Behavior and Microstructural Evolution of Pure Copper

The influences of initial grain size(IGS)with 20μm and 50μm on the hot flow behavior and microstructural changes of pure copper were investigated using hot compression tests at a temperature range of 623–1073 K and strain rate range of 0.001–0.1 s^(-1).The effects of critical stress and corresponding critical strain were studied based on the internal and external processing parameters.The critical stress and strain decreased with increasing temperature and decreasing strain rate.The investigation results of the microstructure and true strain–stress diagrams showed that dynamic recovery,dynamic recrystallization(DRX),and twinning mechanisms were caused during the hot deformation of pure copper.Microstructure evolution indicated some DRXed fine-grain took place around grain boundary of hot deformed samples with IGS of 20μm whereas DRXed fine-grain took place in interior grains for samples with larger IGS.The results also showed that grain growth is also dependent on IGS as the grain growth rate for samples with the larger IGS is greater than the smaller IGS.The critical strain rate and the temperature were obtained at 0.01 s^(-1) and 973 K,respectively,for the sudden change in the grain growth rate.Also,twinning highly depended on IGS which almost did not happen in fine grain size while the volume fraction of twinning increased with increasing grain size.

Researches for higher electrical conductivity copper-based materials

Copper and copper-based materials are widely used in power electronics,auto-mobiles,mechanical manufacturing and high-tech manufacturing fields such as aerospace,telecommunications and integrated circuits owing to their compre-hensive advantages in mechanical,electrical conductivity and processing prop-erties.With the rapid development of technology,many emerging technical fields have introduced more challenging requirements for the electrical conductivity of copper.This article reviews the research status of high-conductivity copper-based materials and introduces three methods to improve electrical conductivity,including purification,alloying and addition of nanocarbon materials.We sum-marise the advantages,disadvantages and future development trends of methods for improving copper conductivity.The key to producing high-conductivity copper-based materials is development of low-cost,continuous and stable processes.

Nanosecond pulsed laser-assisted modified copper surface structure:Enhanced surface microhardness and microbial corrosion resistance

Microbiologically influenced corrosion(MIC) is an unavoidable problem in several industries. Copper(Cu)and its alloys are widely used engineering materials. However, MIC of Cu remains a persistent challenge to their performance and functional lifetime under aggressive environments. This study investigated nanosecond pulsed laser processing(LP), which may enhance the corrosion resistance of Cu. The microstructural evolution and corrosion behavior of LP-Cu in the presence of sulfate-reducing bacteria(SRB) were evaluated. Typical deformation-induced microstructural features of high-density dislocations were analyzed on the top surface of LP-Cu coupon. Electrochemical measurements suggested that LP-Cu coupons exhibited better corrosion resistance in SRB-inoculated solution compared with their original counterpart. The enhanced corrosion resistance by LP primarily resulted from the combined influences of compressive residual stress and work hardening in the surface. However, overlap percentage played a key role in improving corrosion resistance. LP produced optimal corrosion resistance at 50% overlap. Therefore, this study introduces a unique and an option for anticorrosion control in manufacturing processes and potentially implements it onto other materials to improve its microbial corrosion resistance through LP.

Multi-material additive manufacturing-functionally graded materials by means of laser remelting during laser powder bed fusion

Many processes may be used for manufacturing functionally graded materials.Among them,additive manufacturing seems to be predestined due to near-net shape manufacturing of complex geometries combined with the possibility of applying different materials in one component.By adjusting the powder composition of the starting material layer by layer,a macroscopic and step-like gradient can be achieved.To further improve the step-like gradient,an enhancement of the in-situ mixing degree,which is limited according to the state of the art,is necessary.In this paper,a novel technique for an enhancement of the in-situ material mixing degree in the melt pool by applying laser remelting(LR)is described.The effect of layer-wise LR on the formation of the interface was investigated using pure copper and low-alloy steel in a laser powder bed fusion process.Subsequent cross-sectional selective electron microscopic analyses were carried out.By applying LR,the mixing degree was enhanced,and the reaction zone thickness between the materials was increased.Moreover,an additional copper and iron-based phase was formed in the interface,resulting in a smoother gradient of the chemical composition than the case without LR.The Marangoni convection flow and thermal diffusion are the driving forces for the observed effect.