微电子抗辐射设计加固(Radiation Hardening By Design,RHBD)是指在电路设计中采用特殊版图或电路结构达到抗辐射电路的性能要求,且该电路应能使用标准商用生产线的工艺技术进行制造。论述了几种采用SiGe异质结双极晶体管(HBT)的逻辑电...微电子抗辐射设计加固(Radiation Hardening By Design,RHBD)是指在电路设计中采用特殊版图或电路结构达到抗辐射电路的性能要求,且该电路应能使用标准商用生产线的工艺技术进行制造。论述了几种采用SiGe异质结双极晶体管(HBT)的逻辑电路设计加固技术。展开更多
介绍了一种经过抗辐射设计加固的CMOS数字像素图像传感器,并提出了一种可以抵抗单粒子效应的使能检测单元。这个使能检测单元通过将信号传输给三个移位寄存器并判断寄存器输出是否一致来判断和屏蔽单粒子效应。实验结果表明:芯片的最大...介绍了一种经过抗辐射设计加固的CMOS数字像素图像传感器,并提出了一种可以抵抗单粒子效应的使能检测单元。这个使能检测单元通过将信号传输给三个移位寄存器并判断寄存器输出是否一致来判断和屏蔽单粒子效应。实验结果表明:芯片的最大信噪比和动态范围分别是54.15 d B和56.10 d B,使能检测单元可以屏蔽单粒子效应。展开更多
As integrated circuits scale down in size, a single high-energy ion strike often affects multiple adjacent logic nodes.The so-called single-event transient（SET） pulse quenching induced by single-event charge sharing...As integrated circuits scale down in size, a single high-energy ion strike often affects multiple adjacent logic nodes.The so-called single-event transient（SET） pulse quenching induced by single-event charge sharing collection has been widely studied. In this paper, SET pulse quenching enhancement is found in dummy gate isolated adjacent logic nodes compared with that isolated by the common shallow trench isolation（STI）. The physical mechanism is studied in depth and this isolation technique is explored for SET mitigation in combinational standard cells. Three-dimensional（3D） technology computer-aided design simulation（TCAD） results show that this technique can achieve efficient SET mitigation.展开更多
As technologies scale down in size, multiple-transistors being affected by a single ion has become a universal phenomenon, and some new effects are present in single event transients （SETs） due to the charge sharing...As technologies scale down in size, multiple-transistors being affected by a single ion has become a universal phenomenon, and some new effects are present in single event transients （SETs） due to the charge sharing collection of the adjacent multiple-transistors. In this paper, not only the off-state p-channel metal–oxide semiconductor field-effect transistor （PMOS FET）, but also the on-state PMOS is struck by a heavy-ion in the two-transistor inverter chain, due to the charge sharing collection and the electrical interaction. The SET induced by striking the off-state PMOS is efficiently mitigated by the pulse quenching effect, but the SET induced by striking the on-state PMOS becomes dominant. It is indicated in this study that in the advanced technologies, the SET will no longer just be induced by an ion striking the off-state transistor, and the SET sensitive region will no longer just surround the off-state transistor either, as it is in the older technologies. We also discuss this issue in a three-transistor inverter in depth, and the study illustrates that the three-transistor inverter is still a better replacement for spaceborne integrated circuit design in advanced technologies.展开更多
文摘介绍了一种经过抗辐射设计加固的CMOS数字像素图像传感器,并提出了一种可以抵抗单粒子效应的使能检测单元。这个使能检测单元通过将信号传输给三个移位寄存器并判断寄存器输出是否一致来判断和屏蔽单粒子效应。实验结果表明:芯片的最大信噪比和动态范围分别是54.15 d B和56.10 d B,使能检测单元可以屏蔽单粒子效应。
基金Project supported by the National Natural Science Foundation of China(Grant No.61376109)the Opening Project of National Key Laboratory of Science and Technology on Reliability Physics and Application Technology of Electrical Component,China(Grant No.ZHD201202)
文摘As integrated circuits scale down in size, a single high-energy ion strike often affects multiple adjacent logic nodes.The so-called single-event transient（SET） pulse quenching induced by single-event charge sharing collection has been widely studied. In this paper, SET pulse quenching enhancement is found in dummy gate isolated adjacent logic nodes compared with that isolated by the common shallow trench isolation（STI）. The physical mechanism is studied in depth and this isolation technique is explored for SET mitigation in combinational standard cells. Three-dimensional（3D） technology computer-aided design simulation（TCAD） results show that this technique can achieve efficient SET mitigation.
基金Project supported by the Key Program of the National Natural Science Foundation of China (Grant No. 61133007)the National Natural Science Foundation of China (Grant Nos. 61006070 and 61076025)
文摘As technologies scale down in size, multiple-transistors being affected by a single ion has become a universal phenomenon, and some new effects are present in single event transients （SETs） due to the charge sharing collection of the adjacent multiple-transistors. In this paper, not only the off-state p-channel metal–oxide semiconductor field-effect transistor （PMOS FET）, but also the on-state PMOS is struck by a heavy-ion in the two-transistor inverter chain, due to the charge sharing collection and the electrical interaction. The SET induced by striking the off-state PMOS is efficiently mitigated by the pulse quenching effect, but the SET induced by striking the on-state PMOS becomes dominant. It is indicated in this study that in the advanced technologies, the SET will no longer just be induced by an ion striking the off-state transistor, and the SET sensitive region will no longer just surround the off-state transistor either, as it is in the older technologies. We also discuss this issue in a three-transistor inverter in depth, and the study illustrates that the three-transistor inverter is still a better replacement for spaceborne integrated circuit design in advanced technologies.
