期刊文献+
共找到5,232篇文章
< 1 2 250 >
每页显示 20 50 100
A comprehensive review of radiation effects on solder alloys and solder joints
1
作者 Norliza Ismail Wan Yusmawati Wan Yusoff +3 位作者 Nor Azlian Abdul Manaf Azuraida Amat Nurazlin Ahmad Emee Marina Salleh 《Defence Technology(防务技术)》 SCIE EI CAS CSCD 2024年第9期86-102,共17页
In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines r... In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solder alloys and solder joints in terms of microstructure and mechanical properties. In this paper, we evaluate the existing literature, including experimental studies and fundamental theory, to provide a comprehensive overview of the behavior of solder materials under radiation. A review of the literature highlights key mechanisms that contribute to radiation-induced changes in the microstructure, such as the formation of intermetallic compounds, grain growth,micro-voids and micro-cracks. Radiation is explored as a factor influencing solder alloy hardness,strength, fatigue and ductility. Moreover, the review addresses the challenges and limitations inherent in studying the effects of radiation on solder materials and offers recommendations for future research. It is crucial to understand radiation-induced effects on solder performance to design robust and radiationresistant electronic systems. A review of radiation effects on solder materials and their applications in electronics serves as a valuable resource for researchers, engineers, and practitioners in that field. 展开更多
关键词 Defence technology solder alloy solder joints Radiation-induced effect MICROSTRUCTURE Mechanical properties
下载PDF
A review of extreme condition effects on solder joint reliability:Understanding failure mechanisms
2
作者 Norliza Ismail Wan Yusmawati Wan Yusoff +2 位作者 Azuraida Amat Nor Azlian Abdul Manaf Nurazlin Ahmad 《Defence Technology(防务技术)》 SCIE EI CAS CSCD 2024年第11期134-158,共25页
Solder joint,crucial component in electronic systems,face significant challenges when exposed to extreme conditions during applications.The solder joint reliability involving microstructure and mechanical properties w... Solder joint,crucial component in electronic systems,face significant challenges when exposed to extreme conditions during applications.The solder joint reliability involving microstructure and mechanical properties will be affected by extreme conditions.Understanding the behaviour of solder joints under extreme conditions is vital to determine the durability and reliability of solder joint.This review paper aims to comprehensively explore the underlying failure mechanism affecting solder joint reliability under extreme conditions.This study covers an in-depth analysis of effect extreme temperature,mechanical stress,and radiation conditions towards solder joint.Impact of each condition to the microstructure including solder matrix and intermetallic compound layer,and mechanical properties such as fatigue,shear strength,creep,and hardness was thoroughly discussed.The failure mechanisms were illustrated in graphical diagrams to ensure clarity and understanding.Furthermore,the paper highlighted mitigation strategies that enhancing solder joint reliability under challenging operating conditions.The findings offer valuable guidance for researchers,engineers,and practitioners involved in electronics,engineering,and related fields,fostering advancements in solder joint reliability and performance. 展开更多
关键词 solder joint Extreme condition Failure mechanism Defence and military RELIABILITY
下载PDF
Preventing formation of intermetallic compounds in ultrasonic-assisted Sn soldering of Mg/Al alloys through pre-plating a Ni coating layer on the Mg substrate
3
作者 Yingzong Liu Yuanxing Li +1 位作者 Hui Chen Zongtao Zhu 《Journal of Magnesium and Alloys》 SCIE EI CAS CSCD 2024年第2期726-741,共16页
Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joi... Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals. 展开更多
关键词 Ultrasonic-assisted soldering Mg_(2)Sn Ni coating layer Shear strength
下载PDF
Effect of Mo and ZrO_(2)nanoparticles addition on interfacial properties and shear strength of Sn58Bi/Cu solder joint
4
作者 Amares SINGH Hui Leng CHOO +1 位作者 Wei Hong TAN Rajkumar DURAIRAJ 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2024年第8期2619-2628,共10页
The influence of Mo and ZrO_(2)nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated.The interfacial microstructures of Sn58Bi/Cu,Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(... The influence of Mo and ZrO_(2)nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated.The interfacial microstructures of Sn58Bi/Cu,Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints were analysed using a scanning electron microscope(SEM)coupled with energy dispersive X-ray(EDX)and the X-ray diffraction(XRD).Intermetallic compounds(IMCs)of MoSn_(2)are detected in the Sn58Bi+Mo/Cu solder joint,while SnZr,Zr_(5)Sn_(3),ZrCu and ZrSn_(2)are detected in Sn58Bi+ZrO_(2)/Cu solder joint.IMC layers for both composite solders comprise of Cu_(6)Sn_(5) and Cu_(3)Sn.The SEM images of these layers were used to measure the IMC layer’s thickness.The average IMC layer’s thickness is 1.4431μm for Sn58Bi+Mo/Cu and 0.9112μm for Sn58Bi+ZrO_(2)/Cu solder joints.Shear strength of the solder joints was investigated via the single shear lap test method.The average maximum load and shear stress of the Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints are increased by 33%and 69%,respectively,as compared to those of the Sn58Bi/Cu solder joint.By comparing both composite solder joints,the latter prevails better as adding smaller sized ZrO_(2)nanoparticles improves the interfacial properties granting a stronger solder joint. 展开更多
关键词 lead-free solder interfacial microstructure IMC layer thickness shear strength dislocation density ZrO_(2)nanoparticles Mo nanoparticles
下载PDF
A review of soldering by localized heating
5
作者 崔鹏 杨婉春 +3 位作者 彭飞 祝温博 杨帆 李明雨 《China Welding》 CAS 2023年第2期1-15,共15页
In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the therm... In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the thermal needs of different modules has become increasingly prominent,especially for small-size solder joints with high heat dissipation in high-power devices.Localized soldering is con-sidered a suitable choice to selectively heat the desired target while not affecting other heat-sensitive chips.This paper reviews several local-ized soldering processes,focusing on the size of solder joints,soldering materials,and current state of the technique.Each localized solder-ing process was discovered to have unique characteristics.The requirements for small-size solder joints are met by laser soldering,microres-istance soldering,and self-propagating soldering;however,laser soldering has difficulty meeting the requirements for large heat dissipation,microresistance soldering requires the application of pressure to joints,and self-propagating soldering requires ignition materials.However,for small-size solder junctions,selective wave soldering,microwave soldering,and ultrasonic soldering are not appropriate.Because the magnetic field can be focused on a tiny area and the output energy of induction heating is large,induction soldering can be employed as a significant trend in future research. 展开更多
关键词 localized soldering high heat dissipation small size induction soldering focused heating
下载PDF
Interfacial reaction behavior and mechanical properties of 5A06 Al alloy soldered with Sn-1Ti-xGa solders at a low temperature
6
作者 宋立志 肖勇 +2 位作者 奚邦富 李佳琪 张建 《China Welding》 CAS 2023年第2期23-31,共9页
Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were ... Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were investigated. The results showed that the Sn-1Tisolder broke the oxide film on the surface of the Al substrate and induced intergranular diffusion in the Al substrate. When Ga was added tothe solder, severe dissolution pits appeared in the Al substrate due to the action of Sn-1Ti-0.3Ga solder, and many Al particles were flakedfrom the matrix into the solder seam. Under thermal stress and the Ti adsorption effect, the oxide film cracked. With increasing solderingtime, the shear strength of 5A06 Al alloy joints soldered with Sn-1Ti and Sn-1Ti-0.3Ga active solders increased. When soldered for 90 min,the joint soldered with Sn-1Ti-0.3Ga solder had a higher shear strength of 22.12 MPa when compared to Sn-1Ti solder. 展开更多
关键词 5A06-Al alloy Sn-Ti-Ga solder low-temperature soldering interfacial reaction mechanical properties
下载PDF
Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration
7
作者 Qilong Guan Chunjin Hang +4 位作者 Shengli Li Dan Yu Ying Ding Xiuli Wang Yanhong Tian 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2023年第2期16-28,共13页
The spacecraft for deep space exploration missions will face extreme environments,including cryogenic temperature,intense radiation,wide-range temperature variations and even the combination of conditions mentioned ab... The spacecraft for deep space exploration missions will face extreme environments,including cryogenic temperature,intense radiation,wide-range temperature variations and even the combination of conditions mentioned above.Harsh environments will lead to solder joints degradation or even failure,resulting in damage to onboard electronics.The research activities on high reliability solder joints using in extreme environments can not only reduce the use of onboard protection devices,but effectively improve the overall reliability of spacecraft,which is of great significance to the aviation industry.In this paper,we review the reliability research on SnPb solder alloys,Sn-based lead-free solder alloys and In-based solder alloys in extreme environments,and try to provide some suggestions for the follow-up studies,which focus on solder joint reliability under extreme environments. 展开更多
关键词 Deep space exploration Extreme environments solder joints MICROSTRUCTURE ELECTRONICS RELIABILITY
下载PDF
Effect of Strain Rate on Tensile Behavior of Sn-9Zn-xAg-ySb;{(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} Lead-Free Solder Alloys
8
作者 Shihab Uddin Md. Abdul Gafur Mohammad Obaidur Rahman 《Materials Sciences and Applications》 CAS 2023年第4期273-283,共11页
The tensile properties of Sn-9Zn-xAg-ySb;{(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} lead-free solders were investigated. All the test samples were annealed at 150°C for 1 hour. The tests are carrie... The tensile properties of Sn-9Zn-xAg-ySb;{(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} lead-free solders were investigated. All the test samples were annealed at 150°C for 1 hour. The tests are carried out at room temperature at the strain rate of 4.17 × 10<sup>-3</sup> s<sup>-1</sup>, 20.85 × 10<sup>-3</sup> s<sup>-1</sup>, and 208.5 × 10<sup>-3</sup> s<sup>-1</sup>. It is seen that the tensile strength increases and the ductility decrease with increasing the strain rate over the investigated range. From the strain rate change test results, the strain sensitivity values are found in the range of 0.0831 to 0.1455 due to the addition of different alloying elements. 展开更多
关键词 Lead-Free solder Strain Rate Strain Sensitivity DUCTILITY Tensile Properties
下载PDF
大尺寸AlN活性金属焊接覆铜基板的界面结合机理 被引量:1
9
作者 许海仙 曾祥勇 +3 位作者 朱家旭 周泽安 张振文 汤文明 《电子元件与材料》 CAS 北大核心 2024年第5期573-577,584,共6页
基于190 mm×139 mm×0.635 mm的大尺寸AlN表面活性金属钎焊(AMB)覆铜板工艺制程,开展其界面显微组织、物相组成等的研究,确定钎焊界面结合机理,为制备大尺寸、低气孔、高剥离强度AlN-AMB覆铜板提供支持。结果表明,在大尺寸AlN-... 基于190 mm×139 mm×0.635 mm的大尺寸AlN表面活性金属钎焊(AMB)覆铜板工艺制程,开展其界面显微组织、物相组成等的研究,确定钎焊界面结合机理,为制备大尺寸、低气孔、高剥离强度AlN-AMB覆铜板提供支持。结果表明,在大尺寸AlN-AMB覆铜板钎焊过程中,Ag-Cu-Ti合金钎料中的Ag-Cu合金与Cu箔扩散溶合,形成强的冶金结合界面。同时,钎料中的活性Ti原子向AlN基板表面扩散,并与其反应,生成厚度为0.5~1μm的TiN反应层,形成强的反应结合界面。此外,钎料熔体难以填充基板的AlN晶界和凹坑,其中的Ti原子也不与Y-Al-O第二相颗粒反应,导致AlN基板表面TiN反应层不连续分布,形成气孔,降低大尺寸AlN-AMB覆铜板的界面结合强度及可靠性。 展开更多
关键词 氮化铝基板 活性金属钎焊 显微结构 相组成 AG-CU-TI钎料
下载PDF
Cu_(6)Sn_(5)纳米颗粒对SAC3005/Cu焊点形貌和性能的影响
10
作者 王彪 赵建华 +2 位作者 刘一澎 杨杰 严继康 《电子元件与材料》 CAS 北大核心 2024年第1期121-126,共6页
研究了添加Cu_(6)Sn_(5)纳米颗粒对SAC3005焊料焊点金属间化合物的形貌和性能的影响。采用湿化学法制备Cu_(6)Sn_(5)纳米颗粒,将Cu_(6)Sn_(5)纳米颗粒添加到SAC3005焊料中,经回流焊后,制备SAC3005-xCu_(6)Sn_(5)(x=0%,0.12%,0.18%,质量... 研究了添加Cu_(6)Sn_(5)纳米颗粒对SAC3005焊料焊点金属间化合物的形貌和性能的影响。采用湿化学法制备Cu_(6)Sn_(5)纳米颗粒,将Cu_(6)Sn_(5)纳米颗粒添加到SAC3005焊料中,经回流焊后,制备SAC3005-xCu_(6)Sn_(5)(x=0%,0.12%,0.18%,质量分数)复合焊点。采用金相显微镜对焊点的横断面进行观察,对焊点的横断面金属间化合物(IMCs)进行测量。采用ANSYS有限元软件对界面IMCs模型进行模拟,分析印刷电路板(PCB板)焊点失效机理。结果表明:添加Cu_(6)Sn_(5)纳米颗粒改性SAC3005/Cu焊点后的IMCs层厚度变薄。Cu_(6)Sn_(5)纳米颗粒的加入抑制了回流焊接过程中IMCs的生长,提高了焊点的可靠性。Cu_(6)Sn_(5)纳米颗粒的添加阻碍了Sn原子和Cu原子在界面处的扩散,抑制了Cu_(6)Sn_(5)IMCs的生长。添加质量分数为0.12%的Cu_(6)Sn_(5)纳米颗粒时抑制效果最好。焊点界面Cu_(6)Sn_(5)层和Cu_(3)Sn层是应力应变集中的地方,焊点交界处为焊点服役过程中的薄弱环节。 展开更多
关键词 Cu_(6)Sn_(5)纳米颗粒 SAC3005焊料 金属间化合物 可靠性
下载PDF
SnAgCu/SnBi混装焊点的热循环可靠性研究
11
作者 王凤江 董传淇 《江苏科技大学学报(自然科学版)》 CAS 2024年第2期31-35,共5页
Sn-Bi和Sn-Ag-Cu混装焊点是利用低熔点的Sn-58Bi锡膏将高熔点的Sn-3.0Ag-0.5Cu(SAC305)的小球回流焊接在印制电路板(PCB)上,从而实现高温芯片的低温焊接工艺.文中研究了SnAgCu/SnBi混装焊点在热循环条件下的可靠性并通过有限元模拟揭示... Sn-Bi和Sn-Ag-Cu混装焊点是利用低熔点的Sn-58Bi锡膏将高熔点的Sn-3.0Ag-0.5Cu(SAC305)的小球回流焊接在印制电路板(PCB)上,从而实现高温芯片的低温焊接工艺.文中研究了SnAgCu/SnBi混装焊点在热循环条件下的可靠性并通过有限元模拟揭示了混装焊点热循环可靠性的应变演变行为.热循环试验发现混装焊点的寿命要优于SAC305无铅焊点.有限元计算表明,结构混装焊点内SnBi钎料层的添加能够减小最大非弹性应变范围,从而提升混装焊点的热循环可靠性. 展开更多
关键词 混装焊点 无铅钎料 可靠性 热循环 有限元
下载PDF
基于焊层裂纹扩展的IGBT性能退化建模与分析
12
作者 康锐 陈玉冰 +2 位作者 文美林 张清源 祖天培 《系统工程与电子技术》 EI CSCD 北大核心 2024年第9期3031-3039,共9页
在疲劳载荷作用下,绝缘栅双极型晶体管(insulated gate bipolar transistor,IGBT)会发生结构损伤与性能退化,影响电力电子系统可靠性。对此,首先基于传热学理论推导焊层疲劳裂纹长度与热阻的关系,并以Darveaux模型表征IGBT焊层裂纹演化... 在疲劳载荷作用下,绝缘栅双极型晶体管(insulated gate bipolar transistor,IGBT)会发生结构损伤与性能退化,影响电力电子系统可靠性。对此,首先基于传热学理论推导焊层疲劳裂纹长度与热阻的关系,并以Darveaux模型表征IGBT焊层裂纹演化规律,提出一种IGBT性能退化模型及其待定系数的估计方法。其次,考虑实际工况的非平稳特征,利用响应面法建立IGBT变幅疲劳载荷模型,并基于雨流计数法与线性累积损伤准则实现IGBT性能退化量的评估。最后,以一款IGBT产品为例,实施功率循环试验,基于试验数据开展性能退化建模与分析,验证了模型与算法的有效性。 展开更多
关键词 绝缘栅双极型晶体管 退化建模 退化分析 焊层疲劳
下载PDF
陶瓷封装球栅阵列焊点失效机理研究
13
作者 翟芳 孙龙 李伟明 《电子产品可靠性与环境试验》 2024年第5期26-30,共5页
研究了陶瓷封装球栅阵列(CBGA)的焊点在长期使用后开裂的失效机理,提出了改善此类元器件焊点可靠性的有效措施。通过X-ray分析、显微剖切、扫描电镜和能谱分析(SEM&EDS)等手段,研究分析了CBGA封装器件焊点失效的机理与成因;基于失... 研究了陶瓷封装球栅阵列(CBGA)的焊点在长期使用后开裂的失效机理,提出了改善此类元器件焊点可靠性的有效措施。通过X-ray分析、显微剖切、扫描电镜和能谱分析(SEM&EDS)等手段,研究分析了CBGA封装器件焊点失效的机理与成因;基于失效机理,提出了针对性的改善措施,并验证了相关措施的有效性。研究结果表明,由于CBGA器件本体与印制板之间存在较大的热膨胀系数差异,导致焊点在长期使用后出现了热疲劳开裂失效,通过更换焊球类型以增加焊点高度可以显著地改善焊点的可靠性。 展开更多
关键词 陶瓷封装球栅阵列 焊点 失效机理 热疲劳
下载PDF
添加Sb对Sn-9Zn-3Bi/Cu钎料接头显微组织及力学性能的影响
14
作者 涂文斌 吴鸿燕 +3 位作者 梅琪 王韩冰 吴吉洋 颜文俊 《电子元件与材料》 CAS 北大核心 2024年第9期1154-1160,1166,共8页
采用钎料合金化研究添加Sb对Sn-9Zn-3Bi无铅焊点组织、熔点特性、润湿性、金属间化合物(IMC)厚度和剪切强度的影响。结果表明:钎料的熔点随Sb含量的增加而略微上升,钎料的铺展面积随Sb含量的增加从50.3 mm^(2)降低至36.6 mm^(2);添加Sb... 采用钎料合金化研究添加Sb对Sn-9Zn-3Bi无铅焊点组织、熔点特性、润湿性、金属间化合物(IMC)厚度和剪切强度的影响。结果表明:钎料的熔点随Sb含量的增加而略微上升,钎料的铺展面积随Sb含量的增加从50.3 mm^(2)降低至36.6 mm^(2);添加Sb虽然没有改变焊点处钎料基体和界面IMC的显微组织类型,但细化了焊点显微组织,且焊点界面处的IMC厚度从18.6μm降低至16.8μm。随着钎料中Sb含量从0增加到1.5%(质量分数),Sn-9Zn-3Bi/Cu接头剪切强度从22.7 MPa增加到29.8 MPa,剪切强度的提高是显微组织细化、固溶强化及界面处IMC厚度降低共同作用的结果。 展开更多
关键词 无铅钎料 SB 显微组织 剪切强度
下载PDF
PCB中耐高温有机可焊保护剂成膜机理及性能研究
15
作者 王跃峰 姜其畅 +3 位作者 马紫微 贾明理 苏振 孙慧霞 《电子科技大学学报》 EI CAS CSCD 北大核心 2024年第4期487-494,共8页
印制电路板铜焊盘表面生成耐高温有机可焊保护剂(HT-OSP)膜是克服无铅高温回流焊工艺并获得良好焊点的关键。选用2-[(2,4-二氯苯基)甲基]-1H-苯并咪唑(C_(14)H_(10)Cl_(2)N_(2))作为成膜剂,在铜层表面生成了HT-OSP膜。理论计算结合对比... 印制电路板铜焊盘表面生成耐高温有机可焊保护剂(HT-OSP)膜是克服无铅高温回流焊工艺并获得良好焊点的关键。选用2-[(2,4-二氯苯基)甲基]-1H-苯并咪唑(C_(14)H_(10)Cl_(2)N_(2))作为成膜剂,在铜层表面生成了HT-OSP膜。理论计算结合对比实验,研究C_(14)H_(10)Cl_(2)N_(2)分子与Cu原子反应生成HT-OSP膜机理。基于量子化学密度泛函理论,模拟C_(14)H_(10)Cl_(2)N_(2)分子与Cu^(+)之间的络合反应;利用红外光谱对HT-OSP膜中的特征官能团进行表征;借助X射线光电子能谱测试HT-OSP膜中Cu元素的化合价;设计对比实验分析Cu^(2+)对生成HT-OSP膜的影响。结果表明:HT-OSP膜生成机理是C_(14)H_(10)Cl_(2)N_(2)分子与Cu原子发生反应生成HT-OSP膜并沉积在铜层表面,Cu^(2+)通过络合反应促进HT-OSP膜生长。另外,HT-OSP膜的分解温度高达531℃,HT-OSP膜保护的铜层放置在自然环境中180天没有被氧化,证明HT-OSP膜具有优异的耐热性和抗氧化性。 展开更多
关键词 表面处理技术 耐高温有机可焊保护剂 成膜机理 密度泛函理论 印制电路板
下载PDF
Gd改性Ni-Cr钎料钎焊金刚石组织和性能研究
16
作者 徐东 金天 +1 位作者 王朋波 程战 《材料导报》 EI CAS CSCD 北大核心 2024年第19期177-181,共5页
本研究旨在减少钎焊金刚石的热损伤,提高钎焊金刚石的力学性能。采用Gd改性的Ni-Cr合金钎料,在1080℃保温5 min对金刚石进行真空感应钎焊试验,并利用SEM、EDS及XRD对钎料的微观组织和金刚石焊后界面微结构进行测试分析。结果表明,Gd的... 本研究旨在减少钎焊金刚石的热损伤,提高钎焊金刚石的力学性能。采用Gd改性的Ni-Cr合金钎料,在1080℃保温5 min对金刚石进行真空感应钎焊试验,并利用SEM、EDS及XRD对钎料的微观组织和金刚石焊后界面微结构进行测试分析。结果表明,Gd的添加提高了Ni-Cr合金钎料的力学性能,钎料中生成了两种新的稀土化合物(Gd_(2)Ni_(17)和GdNi_(5))。添加适量的Gd可提高金刚石的出露度,且钎焊接头中生成的新型Gd_(2)Ni_(17)化合物有利于减少钎焊金刚石的热损伤。此外,当Gd的添加量为0.8%时,金刚石的暴露量达到其自身高度的62.1%,力学性能测试证实使用该钎料钎焊的金刚石的静压强度和磨削性能高于使用纯镍铬合金钎焊的钻石。 展开更多
关键词 钎焊金刚石 Ni-Cr钎料 磨削性能 热损伤
下载PDF
电子封装高温焊料研究新进展 被引量:2
17
作者 马勇冲 甘贵生 +6 位作者 罗杰 张嘉俊 陈嗣文 李方樑 李乐奇 程大勇 吴懿平 《中国有色金属学报》 EI CAS CSCD 北大核心 2024年第2期357-387,共31页
随着先进封装和第三代半导体的快速发展,具有高熔化温度、耐持久温度考验的高温焊料逐渐成为学界追逐的热点,也成为推动电子产业无铅化和升级换代等“卡脖子”问题的瓶颈。本文综述了传统高温Sn-80Au和Pb-Sn焊料、IMC焊料、纳米及纳米-... 随着先进封装和第三代半导体的快速发展,具有高熔化温度、耐持久温度考验的高温焊料逐渐成为学界追逐的热点,也成为推动电子产业无铅化和升级换代等“卡脖子”问题的瓶颈。本文综述了传统高温Sn-80Au和Pb-Sn焊料、IMC焊料、纳米及纳米-微米混合焊料,提出未来高温焊料在成分上必将以金、银、铜、铝等金属或石墨烯、碳纳米管等轻质、高导热、高熔化温度的碳基材料及其复合材料为主流;在微观尺度上,纳-微米混合焊料既具有纳米焊料的温度效应,又具有颗粒选择的灵活性,能在一定程度上解决纳米焊料的氧化、团聚及烧结时的相转变等问题;基于颗粒焊料的多尺度、颗粒种类选择的多维度,具有低温快速制备、高温长期服役的IMC高温焊料也具有极大的前途。加速高温焊料研发,突破低温封装、高温服役的技术瓶颈,必将极大推动先进封装和功率封装的快速发展。 展开更多
关键词 电子封装 高温焊料 高导热率 纳-微米混合焊料 IMC焊料
下载PDF
基于度量学习的电路焊点缺陷检测方法
18
作者 刘少丽 戚慧志 +1 位作者 杜浩浩 邓超 《北京理工大学学报》 EI CAS CSCD 北大核心 2024年第6期625-634,共10页
针对目前电路焊点缺陷检测方法效率低、准确度差、焊点图像样本量小的问题,提出了一种基于度量学习的快速识别焊点缺陷的方法.首先利用工业相机搭配远心镜头获取焊点图像.通过挖掘焊点图像特征,设计交点检测法来分割焊接单元图像,制作... 针对目前电路焊点缺陷检测方法效率低、准确度差、焊点图像样本量小的问题,提出了一种基于度量学习的快速识别焊点缺陷的方法.首先利用工业相机搭配远心镜头获取焊点图像.通过挖掘焊点图像特征,设计交点检测法来分割焊接单元图像,制作焊点缺陷数据集.在此基础上,设计焊点图像全局特征与局部表征提取方法来对焊点的两类特征进行融合,并对注意力机制进行改进,加入到全局特征提取模块中.对焊点缺陷的检测实验结果表明该方法最终实现了准确率达到98.4%,满足焊点缺陷检测的实际生产要求. 展开更多
关键词 焊点检测 图像分割 深度学习 度量学习 特征融合
下载PDF
基于能量最小化的CCGA焊点形态仿真研究
19
作者 张威 刘坤鹏 +3 位作者 王宏 杭春进 王尚 田艳红 《电子与封装》 2024年第8期51-57,共7页
为了确定某陶瓷柱栅阵列(CCGA)器件实现高焊接可靠性时的工艺参数组合范围,并研究焊点形态随不同参数变化的规律,以钎料润湿角、钎料体积以及焊柱偏移量作为关键变量因素,利用基于能量最小化原理的Surface Evolver软件,计算了不同因素... 为了确定某陶瓷柱栅阵列(CCGA)器件实现高焊接可靠性时的工艺参数组合范围,并研究焊点形态随不同参数变化的规律,以钎料润湿角、钎料体积以及焊柱偏移量作为关键变量因素,利用基于能量最小化原理的Surface Evolver软件,计算了不同因素水平组合下的实际焊点形态,并对参数化建模过程进行了详细介绍。通过对比形态结果与焊点可接收标准,寻找能够产生合格焊点的参量范围,为实际焊点微连接生产工艺提供合理的工艺指导。 展开更多
关键词 封装技术 Surface Evolver 焊点形态 CCGA
下载PDF
化学镀Ni-P/Sn2.5Ag0.7Cu0.1RE微连接焊点热时效过程组织与性能
20
作者 张柯柯 侯瑞卿 +2 位作者 赵文嘉 张海洲 张超 《河南科技大学学报(自然科学版)》 CAS 北大核心 2024年第5期41-49,M0004,M0005,共11页
为探究化学镀Ni-P无铅焊点在热时效作用下的组织与性能,采用化学镀方法在T2紫铜表面制备Ni-P层,使用Sn_(2.5)Ag_(0.7)Cu_(0.1)RE钎料通过回流焊方法制备化学镀Ni-P无铅焊点。结果表明:微焊点Ni-P/钎缝过渡区域金属间化合物(IMC)初始组... 为探究化学镀Ni-P无铅焊点在热时效作用下的组织与性能,采用化学镀方法在T2紫铜表面制备Ni-P层,使用Sn_(2.5)Ag_(0.7)Cu_(0.1)RE钎料通过回流焊方法制备化学镀Ni-P无铅焊点。结果表明:微焊点Ni-P/钎缝过渡区域金属间化合物(IMC)初始组织为呈块状的(Ni,Cu)_(3)Sn_(4),平均厚度为1.5μm。在180℃条件下时效100 h过程中,微焊点Ni-P/钎缝过渡区(Ni,Cu)_(3)Sn_(4)IMC形貌逐渐转变为层状并增厚至3.3μm,微焊点剪切断裂位置由钎缝处向Ni-Sn-P/IMC交界处转移,断裂方式由韧性断裂转变为脆性断裂,相应微焊点的推剪力由初始的16 N下降11.9%。 展开更多
关键词 化学镀NI-P 微焊点 热时效 界面IMC 断裂
下载PDF
上一页 1 2 250 下一页 到第
使用帮助 返回顶部