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Identification and evolution of interfacial structure of SiO2 glass ceramic/Ti-6AI-4V alloy joint bonded with AgCu/Ni interlayer 被引量:1
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作者 刘多 王美荣 +2 位作者 唐冬雁 马蔷 冯吉才 《China Welding》 EI CAS 2014年第3期37-41,共5页
AgCu/Ni composite interlayer was utilized to join SiO2 glass ceramic (74. 52% SiO2-23. 40% Al2 03 -2. 08 % K2 O, wt. % ) and Ti-6Al-4V alloy by eutectic reaction. Interface structures of the joints were identified b... AgCu/Ni composite interlayer was utilized to join SiO2 glass ceramic (74. 52% SiO2-23. 40% Al2 03 -2. 08 % K2 O, wt. % ) and Ti-6Al-4V alloy by eutectic reaction. Interface structures of the joints were identified by means of TEM analysis. This joining method contains three characteristic processes, which are the melting of AgCu eutectic alloy, eutectic reaction between interlayer and Ti-6Al-4V base material and active reaction of element Ti to SiO2 glass ceramic. It is different from traditional active brazing because active element Ti totally dissolves from Ti-6Al-4 V and reacts with SiO2 glass ceramic. SiO2 glass ceramic can be joined suecessfuUy to Ti-6Al-4 V alloy by this novel bonding method and the joint exhibits high shear strength, up to 110 MPa. 展开更多
关键词 CERAMIC Ti-6Al-4V alloy reaction joining microstructure interface
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