Recalescence Velocity and Microstructure Evolution of Deeplyundercooled Cu_(65)Ni_(35) Alloy

The Cu_(65)Ni_(35) alloy liquid was undercooled by the fluxing method,and the rapid solidification structure was obtained by natural cooling.The solidification interface migration information of Cu_(65)Ni_(35) alloy liquid in rapid solidification stage was photographed with the help of high-speed camera,and the recalescence velocity was calculated.The microstructure evolution of the alloy was systematically studied by observing the microstructure morphology and taking photos on the metallographic microscope.By analyzing the evolution of dendrite grain size and microstructure microhardness with undercoolingand relying on electron backscatter diffraction(EBSD)technology,the grain refinement mechanism of microstructure under high undercooling and low undercooling is finally confirmed.

Recalescence Behavior, Solidification Characteristics and Microstructure Transformation of Rapidly Solidified Undercooled Cu-based Alloys

The undercooled solidification microstructures of Cu55Ni45,Cu55Ni43Co2,and Cu60Ni38Co2 Cu-base alloys were obtained by fluxing method.Using infrared temperature measuring device,the law of the change of the recalescence degree with the increase of the undercooling during rapid solidification was studied.At the same time,high-speed camera was used to capture and photograph the images of solid/liquid interface migration during rapid solidification of undercooled melt,and the morphology evolution of solidification front was discussed.Finally,the microstructure morphology and transformation process of the Cubased alloys were systematically analyzed.It is found that the microstructure morphology of the alloys goes through the same evolution process and appeared two grain refinement phenomena,that is,“coarse dendrite-equiaxed grain-oriented fine dendrite-equiaxed grain”.But its characteristics undercoolingΔT_(1),ΔT_(2),and critical undercoolingΔT^(*)varies.Electron backscatter diffraction(EBSD)and transmission electron microscopy(TEM)were used to characterize the grain refinement structure with high undercooling.EBSD results show that the grain refinement structure with high undercooling presents a very high proportion of high angle grain boundaries,the grain orientation is random and there is no high strength texture,and a large number of annealing twins,which indicates that recrystallization occurs in the structure.TEM results show that dislocation network and stacking fault density are relatively low in most areas of grain refinement structure with high undercooling,which can confirm the theory that stress induces recrystallization of the structure.

RECALESCENCES AND SOLIDIFICATION MICROSTRUCTURE OF HIGHLY UNDERCOOLED Ni_(68)B_(21)Si_(11) ALLOY

One,two and three recalescence events in the solidification of highly undercooled Ni_68B_21Si_11 alloy melt and the conditions of undercooling together with the effect on solidification morphologies were revealed.The solidification morphologies of the undercooled alloy may be examined in the light of two aspects,i.e,growth of either Ni_3B,Ni_6Si_2B and Ni_2B ternary eutectic or dendrite cluster with Ni_3B as leading phase.When the degree of undercooling below 200 or over 310 K,the alloy solidifies to accompany one recalescence only, and the crystals grow according to the first mode of solidification.While undercooling at other temperatures,two or three events of recalescence may occur and the dendrite cluster may so- lidify.

RECALESCENCE BEHAVIOUR AND SOLIDIFICATION STRUCTURE OF HIGHLY UNDERCOOLED Ni-32.5%Sn EUTECTIC ALLOY

Large undercoolings up to 395K (0.28TE) are obtained for 15g samples of Ni-32.5%Sn eutectic alloy by superheating the alloy melt to 108-700K above its eutectic temperature and consequently destroying most of the inherent heterogeneous nuclei. The recalcscence phenomenon and its dependence on undercooling and on crystal nuclcation and growth, as well as its relationship to solidification microstructures are studied. The crystalli/ation fraction during recalcsccnce is also calculated. Experiments reveal that recalcscence degree increases with undercooling when the latter is below a certain critical value∧Te, but it decreases as undercooling increases above A 7'( (under present conditions∧Te= 245K, i. c. 0.17TE). The greater the recalescencc degree, the larger the proportion of anomalous eutectic in solidified structures. It is inferred that anomalous eutectic is the product of rapid solidification while lamellar eutectic forms at much slower nuclcation rate and growth velocity.

Refinement Mechanism of Microstructure of Undercooled Nickel Based Alloys

Through the use of purification and recirculation superheating techniques on molten glass,the Ni65Cu33Co2 alloy was successfully undercooled to a maximum temperature of 292 K.High-speed photography was employed to capture the process of interface migration of the alloy liquid,allowing for an analysis of the relationship between the morphological characteristics of the alloy liquid solidification front and the degree of undercooling.Additionally,the microstructure of the alloy was examined using metallographic microscopy,leading to a systematic study of the microscopic morphological characteristics and evolution laws of the refined structure during rapid solidification.The research reveals that the grain refining mechanism of the Ni-Cu-Co ternary alloy is consistent with that of the binary alloy(Ni-Cu).Specifically,under low undercooling conditions,intense dendritic remelting was found to cause grain refinement,while under high undercooling conditions,recrystallization driven by accumulated stress and plastic strain resulting from the interaction between the liquid flow and the primary dendrites caused by rapid solidification was identified as the main factor contributing to grain refinement.Furthermore,the study highlights the significant role of the Co element in influencing the solidification rate and reheat effect of the alloy.The addition of Co was also found to facilitate the formation of non-segregated solidification structure,indicating its importance in the overall solidification process.

Mechanism in Solidification of a Ternary Nickel Based Alloy

The experiment employed the use of melt purification and cyclic superheating technique to achieve maximum undercooling of Ni65Cu31Co4 alloy at 300K.Simultaneously,high-speed photography techniques were used to capture the process of alloy liquid phase interface migration,and analyzed the relationship between the shape characteristics of the front end of alloy solidification and undercooling.The microstructure of the alloy was observed through metallographic microscopy,and the micro-morphological characteristics and evolution of the rapidly solidified microstructure were systematically studied.It is found that the grain refinement mechanism of Ni-Cu-Co ternary alloy is similar to that of Ni-Cu binary alloy.Grain refinement at low undercooling is caused by intense dendritic remelting,while grain refinement at high undercooling is attributed to recrystallization,driven by the stress and plastic strain accumulated from the interaction of liquid flow and primary dendrites caused by rapid solidification.It also shows that the addition of the third element Co plays a significant role in solidification rate and re-ignition effect.

Effect of Co on Solidification Characteristics and Microstructural Transformation of Non-equilibrium Solidified Cu-Ni Alloys

Non-equilibrium solidification structures of Cu55Ni45 and Cu55Ni43Co2 alloys were prepared by the molten glass purification cycle superheating method.The variation of the recalescence phenomenon with the degree of undercooling in the rapid solidification process was investigated using an infrared thermometer.The addition of the Co element affected the evolution of the recalescence phenomenon in Cu-Ni alloys.The images of the solid-liquid interface migration during the rapid solidification of supercooled melts were captured by using a high-speed camera.The solidification rate of Cu-Ni alloys,with the addition of Co elements,was explored.Finally,the grain refinement structure with low supercooling was characterised using electron backscatter diffraction(EBSD).The effect of Co on the microstructural evolution during nonequilibrium solidification of Cu-Ni alloys under conditions of small supercooling is investigated by comparing the microstructures of Cu55Ni45 and Cu55Ni43Co2 alloys.The experimental results show that the addition of a small amount of Co weakens the recalescence behaviour of the Cu55Ni45 alloy and significantly reduces the thermal strain in the rapid solidification phase.In the rapid solidification phase,the thermal strain is greatly reduced,and there is a significant increase in the characteristic undercooling degree.Furthermore,the addition of Co and the reduction of Cu not only result in a lower solidification rate of the alloy,but also contribute to the homogenisation of the grain size.

Effect of Static Mgnetic Fields on the Recalescence Behavior of Undercooled Co-Sn Liquid

The recalescence behavior of undercooled Co-Sn alloys under static magnetic fields was investigated using glass slag fluxing technique in a 12T superconducting magnet.Results indicated that the nucleation temperature and the highest temperature after recalescence of undercooled melt can be affected by the static magnetic field.The undercooling for Co-Sn alloys keep unchanged when a strong magnetic field was applied while the recalescence extent was reduced. With the increasing Co content for Co-Sn eutectic systems,the effect of the magnetic field on the recalescence was strengthened.We find that the magnetic field has very limited effect on the nucleation temperature on alloys while the highest temperature after recalescence is affected by the field depending on the magnetization difference of the undercooled melt before and after solidification.

Solidification process and microstructure evolution of bulk undercooled Co-Sn alloys

A series of Co-Sn alloys with Sn content ranging from 12% to 32%（mole fraction） were undercooled to different degrees below the equilibrium liquidus temperature and the solidification behaviors were investigated by monitoring the temperature recalescence and examing the solidification microstructures.A boundary clearly exists,which separates the coupled growth zone from the decoupled growth zone of eutectic phases for the alloys with Sn content ranging from 14% to 31%（mole fraction）.The other Co-Sn alloys out of this content range are hard to be undercooled into the coupled growth zone in the experiment.It is found that the so-called non-reciprocal nucleation phenomenon does not happen in the solidification of undercooled Co-Sn off-eutectic alloys.

GRAIN REFINEMENT IN BULK UNDERCOOLED Ni-BASED ALLOY

Fluxing of 5 g bulk melt Ni77Si13B10 permits high undercoolings to be attained prior to nu-cleation onset.Investigations of grain refinement in the bulk undercooled alloy as a function ofundercooling,recalescence behavior and cooling rate have been reported.A significant inhomo-geneity of reduction in grain size of a bulk sample is observed,which is caused by the different so-lidification conditions:(1)recalescence process,and(2)the followed plateau in which the heatrelease and extraction rates are equal.It is concluded that the homogeneous refined microstructurecan be achieved if the initial undercooling prior to nucleation,or cooling rate after recalescence isfurther increased.

SOLIDIFICATION MECHANISM OF UNDERCOOLEDSINGLE PHASE ALLOYS

The solidification behavior of bulk undercooled Ni50Cu50 alloy was systematically investigated. Double recalescences were discovered for the first time in a single phase Ni-Cd alloy, in which there is no solid phase transition at elevated temperature. When the alloy melt was undercoolcd below the solidus temperature, the effect of nonequilibrium solidification could make the solid with the norminal composition C0 of the alloy nucleate and grow till tempemture approached To (the temperuture at which the free enengies of solid and liquid with C0 are equal). Following it, the nucleation and growth of the solid with more high melting point component were required, so the secondary recalescence took place. The concentration distribution in crystals was also analysed.

Peritectic solidification under high undercooling conditions

The solidification characteristics of highly undercooled Cu-7.77% Co peritectic alloy has been examined by glass fluxing technique. The obtained undercoolings vary from 93 to 203 K(0.14 T_L). It is found that the a(Co) phase always nucleates and grows preferentially, which is followed by peritectic transformation. This means that the peritectic phase cannot form directly, even though the alloy melt is undercooled to a temperature far below its peritectic point. The maximum recalescence temperature measured experimentally decreases as undercooling increases, which is lower than the thermodynamic calculation result owing to the actual non-adiabatic nature of recalescence process. The dendritic fragmentation of primary α(Co) phase induced by high undercooling is found to enhance the completion of peritectic transformation. In addition, the LKT/BCT dendrite growth model is modified in order to make it applicable to those binary alloy systems with seriously curved liquidus and solidus lines. The dendrite