目的:了解浙江畲族群体4个X染色体短串联重复序列(short tandem repeat,X-STR)基因座DXS7132、DXS6804、DXS6799、DXS9898的等位基因及基因型频率分布。方法:从无血缘关系的260名浙江畲族个体的抗凝血中提取DNA,进行PCR扩增,聚丙烯酰胺...目的:了解浙江畲族群体4个X染色体短串联重复序列(short tandem repeat,X-STR)基因座DXS7132、DXS6804、DXS6799、DXS9898的等位基因及基因型频率分布。方法:从无血缘关系的260名浙江畲族个体的抗凝血中提取DNA,进行PCR扩增,聚丙烯酰胺凝胶垂直电泳(PAGE)并银染。结果:4个基因座检出6、6、6、7个等位基因,4个基因座基因型频率分布(女性个体)均符合Hardy-Weignberg平衡(P>0.05);观测杂合度大于0.4759,多态信息含量均大于0.4663,女性个体识别力均大于0.7096,男性个体识别力均大于0.4147。结论:4个基因座均具有较高的遗传多态性,是较理想的遗传标记系统,为浙江畲族人群法医个体识别、亲子鉴定及遗传学研究提供依据。展开更多
Metallic carbon nanotubes （CNTs） have been proposed as a promising alternative to Cu interconnects in future integrated circuits （ICs） for their remarkable conductive, mechanical and thermal properties. Compact eq...Metallic carbon nanotubes （CNTs） have been proposed as a promising alternative to Cu interconnects in future integrated circuits （ICs） for their remarkable conductive, mechanical and thermal properties. Compact equiv alent circuit models for single-walled carbon nanotube （SWCNT） bundles are described, and the performance of SWCNT bundle interconnects is evaluated and compared with traditional Cu interconnects at different interconnect levels for through-silicon-via-based three dimensional （3D） ICs. It is shown that at a local level, CNT interconnects exhibit lower signal delay and smaller optimal wire size. At intermediate and global levels, the delay improvement becomes more significant with technology scaling and increasing wire lengths. For 1 mm intermediate and 10 mm global level interconnects, the delay of SWCNT bundles is only 49.49% and 52.82% that of the Cu wires, respec tively.展开更多
文摘目的:了解浙江畲族群体4个X染色体短串联重复序列(short tandem repeat,X-STR)基因座DXS7132、DXS6804、DXS6799、DXS9898的等位基因及基因型频率分布。方法:从无血缘关系的260名浙江畲族个体的抗凝血中提取DNA,进行PCR扩增,聚丙烯酰胺凝胶垂直电泳(PAGE)并银染。结果:4个基因座检出6、6、6、7个等位基因,4个基因座基因型频率分布(女性个体)均符合Hardy-Weignberg平衡(P>0.05);观测杂合度大于0.4759,多态信息含量均大于0.4663,女性个体识别力均大于0.7096,男性个体识别力均大于0.4147。结论:4个基因座均具有较高的遗传多态性,是较理想的遗传标记系统,为浙江畲族人群法医个体识别、亲子鉴定及遗传学研究提供依据。
基金supported by the National Natural Science Foundation of China(Nos.61234002,61006028,61204044)the National High-Tech Program of China(Nos.2012AA012302,2013AA011203)
文摘Metallic carbon nanotubes （CNTs） have been proposed as a promising alternative to Cu interconnects in future integrated circuits （ICs） for their remarkable conductive, mechanical and thermal properties. Compact equiv alent circuit models for single-walled carbon nanotube （SWCNT） bundles are described, and the performance of SWCNT bundle interconnects is evaluated and compared with traditional Cu interconnects at different interconnect levels for through-silicon-via-based three dimensional （3D） ICs. It is shown that at a local level, CNT interconnects exhibit lower signal delay and smaller optimal wire size. At intermediate and global levels, the delay improvement becomes more significant with technology scaling and increasing wire lengths. For 1 mm intermediate and 10 mm global level interconnects, the delay of SWCNT bundles is only 49.49% and 52.82% that of the Cu wires, respec tively.
