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Formation of the intermediate semiconductor layer for the Ohmic contact to silicon carbide using Germanium implantation
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作者 郭辉 王悦湖 +2 位作者 张玉明 乔大勇 张义门 《Chinese Physics B》 SCIE EI CAS CSCD 2009年第10期4470-4473,共4页
By formation of an intermediate semiconductor layer (ISL) with a narrow band gap at the metallic contact/SiC interface, this paper realises a new method to fabricate the low-resistance Ohmic contacts for SiC. An arr... By formation of an intermediate semiconductor layer (ISL) with a narrow band gap at the metallic contact/SiC interface, this paper realises a new method to fabricate the low-resistance Ohmic contacts for SiC. An array of transfer length method (TLM) test patterns is formed on N-wells created by P+ ion implantation into Si-faced p-type 4H- SiC epilayer. The ISL of nickel-metal Ohmic contacts to n-type 4H-SiC could be formed by using Germanium ion implantation into SiC. The specific contact resistance pc as low as 4.23×10-5Ω·cm2 is achieved after annealing in N2 at 800 ℃ for 3 min, which is much lower than that (〉 900℃) in the typical SiC metallisation process. The sheet resistance Rsh of the implanted layers is 1.5 kΩ/□. The technique for converting photoresist into nanocrystalline graphite is used to protect the SiC surface in the annealing after Ge+ ion implantations. 展开更多
关键词 SiC Ohmic contact Ge ion implantation intermediate semiconductor layer
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Express Methods for Measurement of Electroconductivity of Semiconductor Layered Crystal
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作者 FILIPPOV V. V. VLASOV A. N. 《Chinese Physics Letters》 SCIE CAS CSCD 2015年第11期114-117,共4页
We describe theoretically the grounded method of measuring the conductivity of anisotropic layered semiconductor materials. The suggested method implies the use of a four-probe testing device with a linear arrangement... We describe theoretically the grounded method of measuring the conductivity of anisotropic layered semiconductor materials. The suggested method implies the use of a four-probe testing device with a linear arrangement of probes. The final expressions for identifying the electrical conductivity are presented in the form of a series of analytic functions. The suggested method is experimentally verified, and practical recommendations of how to apply it are also provided. 展开更多
关键词 Express Methods for Measurement of Electroconductivity of semiconductor layered Crystal
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Valley polarization in transition metal dichalcogenide layered semiconductors:Generation,relaxation,manipulation and transport
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作者 马惠 朱耀杰 +4 位作者 刘宇伦 白瑞雪 张喜林 任琰博 蒋崇云 《Chinese Physics B》 SCIE EI CAS CSCD 2023年第10期1-14,共14页
In recent years,valleytronics researches based on 2D semiconducting transition metal dichalcogenides have attracted considerable attention.On the one hand,strong spin–orbit interaction allows the presence of spin–va... In recent years,valleytronics researches based on 2D semiconducting transition metal dichalcogenides have attracted considerable attention.On the one hand,strong spin–orbit interaction allows the presence of spin–valley coupling in this system,which provides spin addressable valley degrees of freedom for information storage and processing.On the other hand,large exciton binding energy up to hundreds of me V enables excitons to be stable carriers of valley information.Valley polarization,marked by an imbalanced exciton population in two inequivalent valleys(+K and-K),is the core of valleytronics as it can be utilized to store binary information.Motivated by the potential applications,we present a thorough overview of the recent advancements in the generation,relaxation,manipulation,and transport of the valley polarization in nonmagnetic transition metal dichalcogenide layered semiconductors.We also discuss the development of valleytronic devices and future challenges in this field. 展开更多
关键词 valley polarization nonmagnetic transition metal dichalcogenide layered semiconductors EXCITON
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Comparative coherence between layered and traditional semiconductors: unique opportunities for heterogeneous integration
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作者 Zhuofan Chen Xiaonan Deng +11 位作者 Simian Zhang Yuqi Wang Yifei Wu Shengxian Ke Junshang Zhang Fucheng Liu Jianing Liu Yingjie Liu Yuchun Lin Andrew Hanna Zhengcao Li Chen Wang 《International Journal of Extreme Manufacturing》 SCIE EI CAS CSCD 2023年第4期1-35,共35页
As Moore’s law deteriorates,the research and development of new materials system are crucial for transitioning into the post Moore era.Traditional semiconductor materials,such as silicon,have served as the cornerston... As Moore’s law deteriorates,the research and development of new materials system are crucial for transitioning into the post Moore era.Traditional semiconductor materials,such as silicon,have served as the cornerstone of modern technologies for over half a century.This has been due to extensive research and engineering on new techniques to continuously enrich silicon-based materials system and,subsequently,to develop better performed silicon-based devices.Meanwhile,in the emerging post Moore era,layered semiconductor materials,such as transition metal dichalcogenides(TMDs),have garnered considerable research interest due to their unique electronic and optoelectronic properties,which hold great promise for powering the new era of next generation electronics.As a result,techniques for engineering the properties of layered semiconductors have expanded the possibilities of layered semiconductor-based devices.However,there remain significant limitations in the synthesis and engineering of layered semiconductors,impeding the utilization of layered semiconductor-based devices for mass applications.As a practical alternative,heterogeneous integration between layered and traditional semiconductors provides valuable opportunities to combine the distinctive properties of layered semiconductors with well-developed traditional semiconductors materials system.Here,we provide an overview of the comparative coherence between layered and traditional semiconductors,starting with TMDs as the representation of layered semiconductors.We highlight the meaningful opportunities presented by the heterogeneous integration of layered semiconductors with traditional semiconductors,representing an optimal strategy poised to propel the emerging semiconductor research community and chip industry towards unprecedented advancements in the coming decades. 展开更多
关键词 heterogeneous integration van der Waals heterostructure post Moore era layered semiconductor transition metal dichalcogenide layered-traditional semiconductor heterostructure
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Measurement of residual stress in a multi-layer semiconductor heterostructure by micro-Raman spectroscopy 被引量:14
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作者 Wei Qiu Cui-Li Cheng +7 位作者 Ren-Rong Liang Chun-Wang Zhao Zhen-Kun Lei Yu-Cheng Zhao Lu-Lu Ma Jun Xu Hua-Jun Fang Yi-Lan Kang 《Acta Mechanica Sinica》 SCIE EI CAS CSCD 2016年第5期805-812,共8页
Si-based multilayer structures are widely used in current microelectronics. During their preparation, some inhomogeneous residual stress is induced, resulting in competition between interface mismatching and surface e... Si-based multilayer structures are widely used in current microelectronics. During their preparation, some inhomogeneous residual stress is induced, resulting in competition between interface mismatching and surface energy and even leading to structure failure. This work presents a methodological study on the measurement of residual stress in a multi-layer semiconductor heterostructure. Scanning electron microscopy(SEM), micro-Raman spectroscopy(MRS), and transmission electron microscopy(TEM) were applied to measure the geometric parameters of the multilayer structure. The relationship between the Raman spectrum and the stress/strain on the [100] and [110] crystal orientations was determined to enable surface and crosssection residual stress analyses, respectively. Based on the Raman mapping results, the distribution of residual stress along the depth of the multi-layer heterostructure was successfully obtained. 展开更多
关键词 Residual stress Multi-layer semiconductor heterostructure Micro-Raman spectroscopy(MRS) Strained silicon Germanium silicon
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Transforming a Two-Dimensional Layered Insulator into a Semiconductor or a Highly Conductive Metal through Transition Metal Ion Intercalation
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作者 严秀 甄伟立 +4 位作者 翁士瑞 张冉冉 朱文卡 皮雳 张昌锦 《Chinese Physics Letters》 SCIE CAS CSCD 2021年第5期89-93,共5页
Atomically thin two-dimensional(2D) materials are the building bricks for next-generation electronics and optoelectronics, which demand plentiful functional properties in mechanics, transport, magnetism and photorespo... Atomically thin two-dimensional(2D) materials are the building bricks for next-generation electronics and optoelectronics, which demand plentiful functional properties in mechanics, transport, magnetism and photoresponse.For electronic devices, not only metals and high-performance semiconductors but also insulators and dielectric materials are highly desirable. Layered structures composed of 2D materials of different properties can be delicately designed as various useful heterojunction or homojunction devices, in which the designs on the same material(namely homojunction) are of special interest because preparation techniques can be greatly simplified and atomically seamless interfaces can be achieved. We demonstrate that the insulating pristine ZnPS_3, a ternary transition-metal phosphorus trichalcogenide, can be transformed into a highly conductive metal and an n-type semiconductor by intercalating Co and Cu atoms, respectively. The field-effect-transistor(FET) devices are prepared via an ultraviolet exposure lithography technique. The Co-ZnPS_3 device exhibits an electrical conductivity of 8 × 10^(4) S/m, which is comparable to the conductivity of graphene. The Cu-ZnPS_3 FET reveals a current ON/OFF ratio of 1-05 and a mobility of 3 × 10^(-2 )cm^(2)·V^(-1)·s^(-1). The realization of an insulator, a typical semiconductor and a metallic state in the same 2D material provides an opportunity to fabricate n-metal homojunctions and other in-plane electronic functional devices. 展开更多
关键词 Transforming a Two-Dimensional layered Insulator into a semiconductor or a Highly Conductive Metal through Transition Metal Ion Intercalation
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Anti-Fowler Temperature Regime in Photoemission from <i>n</i>-Type Semiconductors with Surface Accumulation Layer
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作者 Michel Molotskii Klimentiy Shimanovich Yossi Rosenwaks 《Journal of Modern Physics》 2017年第7期1020-1028,共9页
According to the Fowler theory and numerous experiments the quantum efficiency for photoemission from conductors increases with temperature. Here we show that an opposite temperature dependence is also possible, when ... According to the Fowler theory and numerous experiments the quantum efficiency for photoemission from conductors increases with temperature. Here we show that an opposite temperature dependence is also possible, when the photoemission is from quasi-metallic surface accumulation layers of n-type semiconductors. This is due to the temperature dependence of the Fermi level energy in semiconductors. The Fermi level energy increases with decreasing temperature;this leads to a decrease of the semiconductor work function and consequently an increase of the quantum efficiency photoemission at constant value of absorbed light quanta of energy. We have calculated this effect for electron accumulation layer in n-GaN, induced by adsorption of positively charged cesium or barium ions. It is found that at low temperatures near liquid nitrogen, the quantum efficiency for photoemission increases to near 55%, which is comparable to the largest values, reported for any known photo-ca-thodes. This phenomenon may prove useful for efficient photo-cathodes operating at low temperatures. 展开更多
关键词 PHOTOEMISSION PHOTOCATHODE Electronic Accumulation layer N-TYPE semiconductor
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非层状二维CdSe的制备及厚度对带隙的影响
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作者 李婷 张文婷 +3 位作者 王红艳 李秀梅 雷子煊 夏晓凤 《原子与分子物理学报》 北大核心 2024年第5期153-158,共6页
二维半导体材料的天然带隙有望弥补石墨烯的零带隙缺陷,打破后者在场效应晶体管、开关器件、逻辑电路等领域的应用瓶颈. 相较于层状半导体材料,非层状半导体材料多以较强的离子键/共价键结合,且各向同性,因此要获取其二维结构存在一定挑... 二维半导体材料的天然带隙有望弥补石墨烯的零带隙缺陷,打破后者在场效应晶体管、开关器件、逻辑电路等领域的应用瓶颈. 相较于层状半导体材料,非层状半导体材料多以较强的离子键/共价键结合,且各向同性,因此要获取其二维结构存在一定挑战. 本论文通过化学气相沉积法实现了非层状CdSe在云母衬底上的二维各向异性生长. 详细表征了二维CdSe的微观形貌、晶体结构和光学特性等. 结果表明,样品具有显著的光致发光 (PL )效应,说明厚度减薄至纳米级时不会破坏CdSe的直接带隙属性. 此外,随着厚度减小,样品的PL峰逐渐蓝移. 为了进一步解释该现象,采用基于密度泛函理论的第一性原理计算方法,研究了不同厚度的CdSe的能带结构,结果显示均为直接带隙,且随厚度减小,带隙值增大,与实验现象吻合. 由此可知,通过生长参数调控二维CdSe的厚度,即可实现对其带隙的有效调控,这对相关光电器件的性能提升具有指导意义. 展开更多
关键词 非层状半导体材料 二维CdSe 化学气相沉积 带隙 第一性原理
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p型InGaAs薄层半导体欧姆接触特性分析
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作者 宋红伟 宋洁晶 秦龙 《微纳电子技术》 CAS 2024年第6期62-67,共6页
从电流在金属和半导体界面的拥堵效应出发,依据圆形传输线模型(CTLM)推导出适用于金属和薄层半导体间欧姆接触电阻率的表达式。利用四探针电阻测量法、高导电性下小电流密度测试法以及对薄膜电阻和传输线长度采用非线性拟合的方法获得... 从电流在金属和半导体界面的拥堵效应出发,依据圆形传输线模型(CTLM)推导出适用于金属和薄层半导体间欧姆接触电阻率的表达式。利用四探针电阻测量法、高导电性下小电流密度测试法以及对薄膜电阻和传输线长度采用非线性拟合的方法获得薄层半导体与金属之间高精度的欧姆接触电阻和电阻率测试结果。研究了Zn掺杂浓度和合金温度对p型InGaAs薄层半导体欧姆接触特性的影响。研究发现:在相同合金温度下,掺杂浓度为1.94×10^(19)cm^(-3)时,样品的欧姆接触电阻率小于掺杂浓度为1.52×10^(19)cm^(-3)的样品,即提高p型InGaAs薄层半导体Zn掺杂浓度有利于半导体和金属Ti/Pt/Au形成良好的欧姆接触;相同Zn掺杂浓度的p型InGaAs薄层半导体,在经过光刻、等离子体去胶、湿法腐蚀等前道工艺后,合金温度为410℃的样品欧姆接触电阻率小于合金温度为380℃的样品,即可通过提高合金温度改善半导体与金属之间的欧姆接触特性。 展开更多
关键词 欧姆接触特性 薄层半导体 掺杂浓度 合金温度
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Zn杂质诱导GaInP/AlGaInP红光半导体激光器量子阱混杂的研究
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作者 何天将 刘素平 +3 位作者 李伟 林楠 熊聪 马骁宇 《光子学报》 EI CAS CSCD 北大核心 2024年第1期1-12,共12页
在GaAs基GaInP/AlGaInP单量子阱结构外延片上分别使用磁控溅射设备生长ZnO薄膜和等离子增强化学气相沉积设备生长SiO2薄膜,以ZnO介质层作为Zn杂质诱导源,采用固态扩Zn的方式对激光器进行选择性区域诱导以制备非吸收窗口来提高器件的腔... 在GaAs基GaInP/AlGaInP单量子阱结构外延片上分别使用磁控溅射设备生长ZnO薄膜和等离子增强化学气相沉积设备生长SiO2薄膜,以ZnO介质层作为Zn杂质诱导源,采用固态扩Zn的方式对激光器进行选择性区域诱导以制备非吸收窗口来提高器件的腔面光学灾变损伤阈值,从而提高半导体激光器的输出功率和长期可靠性。在580~680℃、20~60 min退火条件下对Zn杂质诱导量子阱混杂展开研究,实验发现,ZnO/SiO2或ZnO/Si3N4复合介质层的采用比单一Zn介质层的杂质诱导蓝移量大,且在680℃、30 min的条件下获得了最大55 nm的蓝移量。分析结果表明,介质层所施加的压应变会将外延片表面GaAs层中Ga原子析出,促使Zn原子进入外延层中以诱导量子阱混杂。通过测量光致发光光谱发现发光强度并没有明显下降,可为后期器件制作提供借鉴。 展开更多
关键词 半导体激光器 量子阱混杂 复合介质层 蓝移 非吸收窗口
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Ⅲ族氮化物半导体及其合金的原子层沉积和应用
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作者 仇鹏 刘恒 +10 位作者 朱晓丽 田丰 杜梦超 邱洪宇 陈冠良 胡玉玉 孔德林 杨晋 卫会云 彭铭曾 郑新和 《物理学报》 SCIE EI CAS CSCD 北大核心 2024年第3期50-71,共22页
Ⅲ族氮化物半导体由于包含了宽的直接禁带宽度、高击穿场强、高电子饱和速度、高电子迁移率等优异的性质,自从发展以来便成为半导体领域中的一个热点.并且由于其禁带宽度可以从近紫外涵盖到红外区域,因此在传统半导体所难以实现的短波... Ⅲ族氮化物半导体由于包含了宽的直接禁带宽度、高击穿场强、高电子饱和速度、高电子迁移率等优异的性质,自从发展以来便成为半导体领域中的一个热点.并且由于其禁带宽度可以从近紫外涵盖到红外区域,因此在传统半导体所难以实现的短波长光电子器件领域,也具有广阔的应用前景.原子层沉积由于其特殊的沉积机制可以在较低的温度下实现Ⅲ族氮化物半导体的高质量制备,通过调整原子层沉积的循环比也可以方便地调整合金材料中的成分.发展至今,原子层沉积已经成为制备Ⅲ族氮化物及其合金材料的一种重要方式.因此,本文着重介绍了近期使用原子层沉积进行Ⅲ族氮化物半导体及其合金的沉积及应用,包括使用不同前驱体、不同方式、不同类型原子层沉积,在不同温度、不同衬底上进行氮化物半导体及其合金的沉积.随后讨论了原子层沉积制备的Ⅲ族氮化物材料在不同器件中的应用.最后总结了原子层沉积在制备Ⅲ族氮化物半导体中的前景和挑战. 展开更多
关键词 原子层沉积 氮化物半导体 薄膜生长
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退火对不同金属薄膜上的BN/MoS_(2)异质结构形貌、结构和电性能的影响
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作者 刘春泉 熊芬 +5 位作者 马佳仪 周锦添 蒋玉琳 贺紫怡 陈敏纳 张颖 《材料热处理学报》 CAS CSCD 北大核心 2024年第5期142-151,共10页
以过渡金属硫化物、氮化硼等二维层状材料为基础,研究了一种简单可靠的集成电路制造方法。在这项工作中,采用射频磁控溅射在室温下逐层制备了M/BN/MoS_(2)(M=Al、Ti、Mo和Ag)纳米薄膜,其中BN/MoS_(2)为未发生化学反应的异质结构,然后在... 以过渡金属硫化物、氮化硼等二维层状材料为基础,研究了一种简单可靠的集成电路制造方法。在这项工作中,采用射频磁控溅射在室温下逐层制备了M/BN/MoS_(2)(M=Al、Ti、Mo和Ag)纳米薄膜,其中BN/MoS_(2)为未发生化学反应的异质结构,然后在500℃进行退火。结果表明:所制备的金属(Al、Ti、Mo和Ag)、BN和MoS_(2)薄膜均匀连续,特别是BN/MoS_(2)异质结构界面清晰、结合紧密。退火后,顶层MoS_(2)薄膜颗粒大小、粗糙度和结晶性显著提高,且杂质减少甚至消失,其中Ag/BN膜基底上MoS_(2)薄膜结晶性最好,且出现了较大的片层状形态。电性能测试显示金属/BN和BN/MoS_(2)异质结构界面的肖特基势垒使得样品的I-V特性曲线呈明显的非线性。Ti基由于退火后氧化,电阻率最大,Mo基功函数最大,电阻率其次,Ag基功函数相对较低所以电阻率较低,而Al则由于低的功函数、结构匹配及载流子浓度等因素导致其电阻率最低。 展开更多
关键词 BN/MoS_(2)异质结构 金半接触 连续逐层沉积 退火 射频磁控溅射
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实现稳定光电化学水分解的自修复机制
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作者 冯超 李严波 《Chinese Journal of Catalysis》 SCIE CAS CSCD 2024年第5期158-170,共13页
随着全球经济的持续增长,人类社会对能源的需求也在不断攀升.然而,传统的化石燃料无法再生,并且由于其过度消耗而引发的环境问题日益凸显,这使得寻找清洁、可持续的能源替代品成为当务之急.其中,通过人工光合作用对太阳能进行转化和储... 随着全球经济的持续增长,人类社会对能源的需求也在不断攀升.然而,传统的化石燃料无法再生,并且由于其过度消耗而引发的环境问题日益凸显,这使得寻找清洁、可持续的能源替代品成为当务之急.其中,通过人工光合作用对太阳能进行转化和储存是一个理想的能源替代方案.光电化学(PEC)水分解技术可以将太阳能直接转化为氢能,并且在氢燃料的生产和燃烧过程中水是唯一的原料和产物,实现了“零碳”排放的紧密氢循环,整个过程被认为是绿色、可持续的.在过去几十年里,大量关于PEC水分解的研究被报道,尤其是在提高太阳能到氢气(STH)转换效率方面取得了较大的进展.然而,光电极在工况下的长期稳定性问题仍然是制约PEC水分解商业化的主要障碍.为了应对这一挑战,催化领域引入了自修复的概念,并将其扩展应用于提高光电极的稳定性,这为解决其稳定性问题提供了新的策略.因此,有必要对实现稳定PEC水分解的自修复机制进行综述.本文系统综述了不同半导体光吸收体、保护层和助催化剂在工况下的衰减机制.首先,重点探讨了窄带隙半导体材料,如硅基(n-Si或p-Si)或III-V族半导体(GaAs,InP等)在工况下的衰减机制.这些材料受到电解液化学腐蚀的影响,导致其理化性质不稳定.特别是在光照或外加偏压的作用下,腐蚀作用会进一步加剧,严重影响其性能.然后,分析了具有合适带隙的半导体材料的衰减机制.受热力学因素影响,非氧化物半导体,如金属硫化物/硒化物、氮化物、氧氮化物、磷化物等,容易被光生空穴氧化;而金属氧化物半导体,如Cu_(2)O,则容易被光生电子还原.此外,热力学上相对稳定的金属氧化物半导体,如BiVO_(4),受动力学因素影响易发生光腐蚀,导致光吸收物种的溶解和晶格结构的破坏.除了半导体材料本身,表面保护层受到寄生光吸收和针孔现象的限制,导致其保护效果降低.助催化剂同样面临着活性衰减和寄生光吸收带来的挑战,这些因素影响了光电极的整体效率和稳定性.为了应对这些挑战,本文总结了一系列具有自修复机制的损伤修复策略,包括光吸收材料和助催化剂中活性组分的内在自修复、半导体中缺陷位点的内在自修复、保护层中的外在自修复以及表面改性层中自修复薄膜的厚度自限性特征.实现这些自修复机制通常需要结合PEC水分解工况下提供的偏压或光电压,并在电解液中添加失活物种的离子源或额外的修复剂.工况下提供的偏压大小以及添加到电解质中的物种数量和浓度将直接决定PEC水分解的自修复能力.综上,自修复作为维持易腐蚀光电极稳定性的理想方式,具有极大的应用潜力.通过利用更先进的原位分析技术能够更深入地揭示光电极/电解质界面在工况下的动态演变规律,从而更好地从本质上了解PEC水分解系统的损伤机制.针对运行状态下损伤部位的针对性修复,可以建立动态稳定的损伤-修复机制,为实现人工光合作用系统的高效和长期稳定运行提供有力保障.展望未来,需要进一步深入剖析并完善自修复机制,使其成为催化系统开发的一般性设计原则,此外,还应积极探索将自修复机制扩展至更广泛的应用平台和场景中,为推动清洁能源领域的进一步发展贡献更多的解决方案. 展开更多
关键词 自修复 光电化学水分解 稳定性 半导体光吸收层 保护层 助催化剂
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Influence of Impurity Doping and γ-Irradiation on the Optical Properties of Layered GaSe Crystals 被引量:1
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《材料科学与工程(中英文B版)》 2012年第2期91-102,共12页
关键词 晶体表面 硒化镓 非掺杂 光学性质 电子显微镜 辐射 光致发光 晶体掺杂
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基于HTO的LDMOS器件结构及其热载流子注入退化研究
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作者 邵红 李永顺 +2 位作者 宋亮 金华俊 张森 《电子学报》 EI CAS CSCD 北大核心 2024年第5期1582-1590,共9页
为满足中低压消费电子的市场需求,小尺寸高密度Bipolar-CMOS-DMOS技术得到了蓬勃发展,低损耗和高可靠成为Bipolar-CMOS-DMOS技术中横向双扩散金属氧化物半导体场效应管(Lateral Double-diffused Metal-Oxide-Semiconductor field effect... 为满足中低压消费电子的市场需求,小尺寸高密度Bipolar-CMOS-DMOS技术得到了蓬勃发展,低损耗和高可靠成为Bipolar-CMOS-DMOS技术中横向双扩散金属氧化物半导体场效应管(Lateral Double-diffused Metal-Oxide-Semiconductor field effect transistor,LDMOS)设计的重点和难点.本文介绍了一种基于高温氧化层(High Temperature Oxidation layer,HTO)结构的LDMOS,并对其热载流子注入退化机制进行了研究分析,利用高温氧化层结构改善了传统浅槽隔离(Shallow Trench Isolation,STI)结构中氧化物台阶嵌入半导体内部对器件热载流子注入造成的不利影响,提高器件可靠性,同时还缩短了器件导通情况下的电流路径长度,降低损耗.此外本文还提出了对P型体区的工艺优化方法,利用多晶硅作为高能量离子注入的掩蔽层,改善阱邻近效应对器件鲁棒性的影响,同时形成更深的冶金结,可以辅助漂移区杂质离子耗尽,降低漂移区表面电场,在不需要额外增加版次的情况下提高了器件击穿电压.最终得到的基于HTO结构的LDMOS击穿电压为43 V,比导通电阻为9.5 mΩ·mm^(2),线性区电流在10000 s之后的退化量仅为0.87%. 展开更多
关键词 横向双扩散金属氧化物半导体场效应管 热载流子注入 高温氧化层 低损耗 高可靠性
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A NOVEL PHYSICAL-LAYER TRANSCEIVER USED IN USB2.0 SERIAL DATA LINK 被引量:1
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作者 Li Haoliang He Lenian Wang Zi Yan Xiaolang 《Journal of Electronics(China)》 2006年第5期736-740,共5页
The paper proposes a novel transceiver in physical layer for high-speed serial data link based upon Universal Serial Bus (USB) 2.0, comprising transmitter and receiver. In the design, transmitter contains pre-and-main... The paper proposes a novel transceiver in physical layer for high-speed serial data link based upon Universal Serial Bus (USB) 2.0, comprising transmitter and receiver. In the design, transmitter contains pre-and-main driver to satisfy slew rate of output data, receiver includes optimized topology to improve preci- sion of received data. The circuit simulation is based on Cadence’s spectre software and Taiwan Semiconduc- tor Manufacture Corporation’s library of 0.25μm mixed-signal Complementary Metal-Oxide Semiconductor (CMOS) model. The front and post-simulation results reveal that the transceiver designed can transmit and re- ceive high-speed data in 480Mbps, which is in agreement with USB2.0 specification. The chip of physi- cal-layer transceiver has been designed and implemented with 0.25μm standard CMOS technology. 展开更多
关键词 补充金属氧化物半导体收发器 CMOS 物理层 高速 通用连续总线
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Current spin polarization and spin injection efficiency in ZnO-based ferromagnetic semiconductor junctions
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作者 Gang JI Ze ZHANG +3 位作者 Yanxue CHEN Shishen YAN Yihua LIU Liangmo MEI 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2009年第2期153-160,共8页
[FeNi(3 nm)/Zn1-xCoxO(3 nm)]2/ZnO(d nm)/[Zn1-xCoxO(3 nm)/Co(3 nm)]2 (d=3 and 10) semiconductor junctions were prepared by magnetron sputtering system and photolithography. The spin valve effect was observe... [FeNi(3 nm)/Zn1-xCoxO(3 nm)]2/ZnO(d nm)/[Zn1-xCoxO(3 nm)/Co(3 nm)]2 (d=3 and 10) semiconductor junctions were prepared by magnetron sputtering system and photolithography. The spin valve effect was observed in these junctions because the utility of the ferromagnetic composite layers acted as soft and hard magnetic layers. The electrical detection was performed by measuring the magnetoresistance of these junctions to investigate the current spin polarization asc in the ZnO layer and the spin injection efficiency η of spin-polarized electrons. asc was reduced from 11.7% (and 10.5%) at 90 K to 7.31% (and 5.93%) at room temperature for d=3 (and d=10). And η was reduced from 39.5% (and 35.5%) at 90 K to 24.7% (and 20.0%) at room temperature for d=3 (and d=10). 展开更多
关键词 Spin injection Electrical detection MAGNETORESISTANCE Room temperature ferromagnetic semiconductor Ferromagnetic composite layers
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Direct Structural Evidences of Epitaxial Growth Ge<SUB>1-X</SUB>Mn<SUB>X</SUB>Nanocolumn Bi-Layers on Ge(001)
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作者 Thi Giang Le 《Materials Sciences and Applications》 2015年第6期533-538,共6页
Molecular Beam Epitaxy (MBE) system equipped with in-situ Reflection High-Energy Electron Diffraction (RHEED) has been used for (Ge, Mn) thin film growth and monitoring the surface morphology and crystal structure of ... Molecular Beam Epitaxy (MBE) system equipped with in-situ Reflection High-Energy Electron Diffraction (RHEED) has been used for (Ge, Mn) thin film growth and monitoring the surface morphology and crystal structure of thin films. Based on the observation of changes in RHEED patterns during nanocolumn growth, we used a real-time control approach to realize multilayer structures that consist of two nanocolumn layers separated by a Ge barrier layer. Transmission Electron Microscopy (TEM) has been used to investigate the structural properties of the GeMn nanocolumns and GeMn/Ge nanocolumns bi-layers samples. 展开更多
关键词 GeMn Diluted Magnetic semiconductors Muti-layers GeMn NANOCOLUMNS Thin Film Epitaxial Growth
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Influence of y-Irradiation on the Optical Properties of Pure or Impure Zn, Cd and Ge-Doped Layered InSe Crystals
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作者 Yuriy Zhirko Nikolay Skubenko +2 位作者 Volodymyr Dubinko Zakhar Kovalyuk Oleg Sydor 《材料科学与工程(中英文A版)》 2013年第3期162-174,共13页
关键词 晶体掺杂 照射 光学性质 光致发光光谱 杂质浓度 层状
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Application of an Al-doped zinc oxide subcontact layer on vanadium-compensated 6H–SiC photoconductive switches
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作者 周天宇 刘学超 +3 位作者 黄维 代冲冲 郑燕青 施尔畏 《Chinese Physics B》 SCIE EI CAS CSCD 2015年第4期241-245,共5页
Al-doped ZnO thin film (AZO) is used as a subcontact layer in 6H-SiC photoconductive semiconductor switches (PCSSs) to reduce the on-state resistance and optimize the device structure. Our photoconductive test sho... Al-doped ZnO thin film (AZO) is used as a subcontact layer in 6H-SiC photoconductive semiconductor switches (PCSSs) to reduce the on-state resistance and optimize the device structure. Our photoconductive test shows that the onstate resistance of lateral PCSS with an n+-AZO subcontact layer is 14.7% lower than that of PCSS without an n+-AZO subcontact layer. This occurs because a heavy-doped AZO thin film can improve Ohmic contact properties, reduce contact resistance, and alleviate Joule heating. Combined with the high transparance characteristic at 532 nm of AZO film, vertical structural PCSS devices are designed and their structural superiority is discussed. This paper provides a feasible route for fabricating high performance SiC PCSS by using conductive and transparent ZnO-based materials. 展开更多
关键词 photoconductive semiconductor switch SIC n+-AZO subcontact layer on-state resistance
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