Mechanical properties of silicon nanobeams are of prime importance in nanoelectromechanical system applications. A numerical experimental method of determining resonant frequencies and Young＇s modulus of nanobeams by...Mechanical properties of silicon nanobeams are of prime importance in nanoelectromechanical system applications. A numerical experimental method of determining resonant frequencies and Young＇s modulus of nanobeams by combining finite element analysis and frequency response tests based on an electrostatic excitation and visual detection by using a laser Doppler vibrometer is presented in this paper. Silicon nanobeam test structures are fabricated from silicon-oninsulator wafers by using a standard lithography and anisotropic wet etching release process, which inevitably generates the undercut of the nanobeam clamping. In conjunction with three-dimensional finite element numerical simulations incorporating the geometric undercut, dynamic resonance tests reveal that the undercut significantly reduces resonant frequencies of nanobeams due to the fact that it effectively increases the nanobeam length by a correct value △L, which is a key parameter that is correlated with deviations in the resonant frequencies predicted from the ideal Euler-Bernoulli beam theory and experimentally measured data. By using a least-square fit expression including △L, we finally extract Young＇s modulus from the measured resonance frequency versus effective length dependency and find that Young＇s modulus of a silicon nanobeam with 200-nm thickness is close to that of bulk silicon. This result supports that the finite size effect due to the surface effect does not play a role in the mechanical elastic behaviour of silicon nanobeams with thickness larger than 200 nm.展开更多
Primary mirror is one of the key components in the space remote sensing system. To minimize the mass of the mirror without compromising its stiffness and decrease the deformation of the mirror surface at the different...Primary mirror is one of the key components in the space remote sensing system. To minimize the mass of the mirror without compromising its stiffness and decrease the deformation of the mirror surface at the different temperatures are the mainly two objects in the development of the primary mirror. Silicon carbide (SiC), the most promising optical material, was used as the material of the primary mirror with triangle lightmass structure in a Cassegrain system. By using finite element method, the properties of the SiC mirror were compared with that of the traditional Be mirror and fused silica mirror. The results of static, dynamic and thermo-mechanical analysis indicate that the deformation of the mirror surface caused by temperature field is much bigger than that caused by gravity field. The SiC mirror has the best overall properties, and the SiC material is much suitable for the primary mirror.展开更多
Silicon wafers are the most widely used substrates for semiconductors. The falling price of silicon wafers has created tremendous pressure on silicon wafer manufacturers to develop cost-effective manufacturing process...Silicon wafers are the most widely used substrates for semiconductors. The falling price of silicon wafers has created tremendous pressure on silicon wafer manufacturers to develop cost-effective manufacturing processes. A critical issue in wafer production is the waviness induced by wire sawing. If this waviness is not removed, it will affect wafer flatness and semiconductor performance. In practice, both lapping and grinding have been used to flatten wire-sawn wafers. Although grinding is not as effective as lapping in removing waviness, it has many other advantages over lapping (such as higher throughput, fully automatic, and more benign to environment) and has great potential to reduce manufacturing cost of silicon wafers. This paper presents a finite element analysis (FEA) study on grinding and lapping of wire-sawn silicon wafers. An FEA model is first developed to simulate the waviness deformation of wire-sawn wafers in grinding and lapping processes. It is then used to explain how the waviness is removed or reduced by lapping and grinding and why the effectiveness of grinding in removing waviness is different from that of lapping. Furthermore, the model is used to study the effects of various parameters including active-grinding-zone orientation, grinding force, waviness wavelength, and waviness height on the reduction and elimination of waviness. Finally, the results of pilot experiments to verify the model are discussed.展开更多
硅是植物生长的有益元素,也是人和其他动物生长发育、骨骼形成不可或缺的微量元素。在地球表层系统中,大多数的硅以硅酸盐矿物和石英的形式赋存于岩石之中。伴随着地表硅酸盐矿物的风化,硅可以水为载体不断向周边环境释放并参与到生物...硅是植物生长的有益元素,也是人和其他动物生长发育、骨骼形成不可或缺的微量元素。在地球表层系统中,大多数的硅以硅酸盐矿物和石英的形式赋存于岩石之中。伴随着地表硅酸盐矿物的风化,硅可以水为载体不断向周边环境释放并参与到生物地球化学循环中,为陆地和海洋生物提供所需的硅元素,维持生态系统健康,在全球物质循环中起着重要作用(Yang Jinling et al.,2018)。展开更多
For reducing the core loss of grain oriented silicon steel and improving its aging property, a new method, the LLSA by using Sb as the laser surface alloying element, was investigated, and at proper technique conditio...For reducing the core loss of grain oriented silicon steel and improving its aging property, a new method, the LLSA by using Sb as the laser surface alloying element, was investigated, and at proper technique conditions rather good result was obtained.展开更多
We present an accurate through silicon via （TSV） thermal mechanical stress analytical model which is verified by using finite element method （FEM）. The results show only a very small error. By using the proposed a...We present an accurate through silicon via （TSV） thermal mechanical stress analytical model which is verified by using finite element method （FEM）. The results show only a very small error. By using the proposed analytical model, we also study the impacts of the TSV radius size, the thickness, the material of Cu diffusion barrier, and liner on the stress. It is found that the liner can absorb the stress effectively induced by coefficient of thermal expansion mismatch. The stress decreases with the increase of liner thickness. Benzocyclobutene （BCB） as a liner material is better than SiO2. However, the Cu diffusion barrier has little effect on the stress. The stress with a smaller TSV has a smaller value. Based on the analytical model, we explore and validate the linear superposition principle of stress tensors and demonstrate the accuracy of this method against detailed FEM simulations. The analytic solutions of stress of two TSVs and three TSVs have high precision against the finite element result.展开更多
We investigated the deformation behaviors of Zr_65Cu_17.5Ni_10Al_7.5 in superplastic forming in silicon mould via numerical modeling and experiments. The data needed for the constitutive formulation were obtained from...We investigated the deformation behaviors of Zr_65Cu_17.5Ni_10Al_7.5 in superplastic forming in silicon mould via numerical modeling and experiments. The data needed for the constitutive formulation were obtained from compressive tests to establish a material library for finite-element simulation using a DEFORM 3D software. A constant speed forming process of a micro gear was modeled where the loading force, feature size and amount of deformation in the micro gear in silicon mould were analyzed in detail for the optimal requirements of micro gear forming and the protection of silicon mould. Guided by the modeling parameters, an amorphous metal micro gear was successfully obtained by our home-made superplastic forming system with the optimized parameters （temperature of 683 K, top speed of 0.003 mm/s until the load force reaching limiting value at 1960 N, and a gradually decelerating process for holding the force to the end）. Our work gives a good example for optimization of superplastic forming and fabrication of BMGs in microparts.展开更多
基金Project supported by the National Natural Science Foundation of China (Grant Nos. 41075026 and 61001044)the Open Re-search Fund of Key Laboratory of Microelectromechanical System of Ministry of Education,Southeast University,China (Grant Nos. 2009-03 and 2010-02)+1 种基金the Special Fund for Meteorology Research in the Public Interest,China (Grant No. GYHY200906037)the Priority Academic Program Development of Sensor Networks and Modern Meteorological Equipment of Jiangsu Provincial Higher Education Institutions
文摘Mechanical properties of silicon nanobeams are of prime importance in nanoelectromechanical system applications. A numerical experimental method of determining resonant frequencies and Young＇s modulus of nanobeams by combining finite element analysis and frequency response tests based on an electrostatic excitation and visual detection by using a laser Doppler vibrometer is presented in this paper. Silicon nanobeam test structures are fabricated from silicon-oninsulator wafers by using a standard lithography and anisotropic wet etching release process, which inevitably generates the undercut of the nanobeam clamping. In conjunction with three-dimensional finite element numerical simulations incorporating the geometric undercut, dynamic resonance tests reveal that the undercut significantly reduces resonant frequencies of nanobeams due to the fact that it effectively increases the nanobeam length by a correct value △L, which is a key parameter that is correlated with deviations in the resonant frequencies predicted from the ideal Euler-Bernoulli beam theory and experimentally measured data. By using a least-square fit expression including △L, we finally extract Young＇s modulus from the measured resonance frequency versus effective length dependency and find that Young＇s modulus of a silicon nanobeam with 200-nm thickness is close to that of bulk silicon. This result supports that the finite size effect due to the surface effect does not play a role in the mechanical elastic behaviour of silicon nanobeams with thickness larger than 200 nm.
文摘Primary mirror is one of the key components in the space remote sensing system. To minimize the mass of the mirror without compromising its stiffness and decrease the deformation of the mirror surface at the different temperatures are the mainly two objects in the development of the primary mirror. Silicon carbide (SiC), the most promising optical material, was used as the material of the primary mirror with triangle lightmass structure in a Cassegrain system. By using finite element method, the properties of the SiC mirror were compared with that of the traditional Be mirror and fused silica mirror. The results of static, dynamic and thermo-mechanical analysis indicate that the deformation of the mirror surface caused by temperature field is much bigger than that caused by gravity field. The SiC mirror has the best overall properties, and the SiC material is much suitable for the primary mirror.
文摘Silicon wafers are the most widely used substrates for semiconductors. The falling price of silicon wafers has created tremendous pressure on silicon wafer manufacturers to develop cost-effective manufacturing processes. A critical issue in wafer production is the waviness induced by wire sawing. If this waviness is not removed, it will affect wafer flatness and semiconductor performance. In practice, both lapping and grinding have been used to flatten wire-sawn wafers. Although grinding is not as effective as lapping in removing waviness, it has many other advantages over lapping (such as higher throughput, fully automatic, and more benign to environment) and has great potential to reduce manufacturing cost of silicon wafers. This paper presents a finite element analysis (FEA) study on grinding and lapping of wire-sawn silicon wafers. An FEA model is first developed to simulate the waviness deformation of wire-sawn wafers in grinding and lapping processes. It is then used to explain how the waviness is removed or reduced by lapping and grinding and why the effectiveness of grinding in removing waviness is different from that of lapping. Furthermore, the model is used to study the effects of various parameters including active-grinding-zone orientation, grinding force, waviness wavelength, and waviness height on the reduction and elimination of waviness. Finally, the results of pilot experiments to verify the model are discussed.
文摘硅是植物生长的有益元素,也是人和其他动物生长发育、骨骼形成不可或缺的微量元素。在地球表层系统中,大多数的硅以硅酸盐矿物和石英的形式赋存于岩石之中。伴随着地表硅酸盐矿物的风化,硅可以水为载体不断向周边环境释放并参与到生物地球化学循环中,为陆地和海洋生物提供所需的硅元素,维持生态系统健康,在全球物质循环中起着重要作用(Yang Jinling et al.,2018)。
基金National Natural Science FOundation of China! (No. 59974010).
文摘For reducing the core loss of grain oriented silicon steel and improving its aging property, a new method, the LLSA by using Sb as the laser surface alloying element, was investigated, and at proper technique conditions rather good result was obtained.
基金supported by the National Natural Science Foundation of China(Grant No.61334003)the Kunshan Innovation Institute of Xidian University
文摘We present an accurate through silicon via （TSV） thermal mechanical stress analytical model which is verified by using finite element method （FEM）. The results show only a very small error. By using the proposed analytical model, we also study the impacts of the TSV radius size, the thickness, the material of Cu diffusion barrier, and liner on the stress. It is found that the liner can absorb the stress effectively induced by coefficient of thermal expansion mismatch. The stress decreases with the increase of liner thickness. Benzocyclobutene （BCB） as a liner material is better than SiO2. However, the Cu diffusion barrier has little effect on the stress. The stress with a smaller TSV has a smaller value. Based on the analytical model, we explore and validate the linear superposition principle of stress tensors and demonstrate the accuracy of this method against detailed FEM simulations. The analytic solutions of stress of two TSVs and three TSVs have high precision against the finite element result.
基金Funded by the National Natural Science Foundation of China(Nos.51222508,51175211)
文摘We investigated the deformation behaviors of Zr_65Cu_17.5Ni_10Al_7.5 in superplastic forming in silicon mould via numerical modeling and experiments. The data needed for the constitutive formulation were obtained from compressive tests to establish a material library for finite-element simulation using a DEFORM 3D software. A constant speed forming process of a micro gear was modeled where the loading force, feature size and amount of deformation in the micro gear in silicon mould were analyzed in detail for the optimal requirements of micro gear forming and the protection of silicon mould. Guided by the modeling parameters, an amorphous metal micro gear was successfully obtained by our home-made superplastic forming system with the optimized parameters （temperature of 683 K, top speed of 0.003 mm/s until the load force reaching limiting value at 1960 N, and a gradually decelerating process for holding the force to the end）. Our work gives a good example for optimization of superplastic forming and fabrication of BMGs in microparts.
