Status of research on non-conventional technology assisted single-point diamond turning

With the increasing use of difficult-to-machine materials in aerospace applications,machining requirements are becoming ever more rigorous.However,traditional single-point diamond turning(SPDT)can cause surface damage and tool wear.Thus,it is difficult for SPDT to meet the processing requirements,and it has significant limitations.Research indicates that supplementing SPDT with unconventional techniques can,importantly,solve problems due to the high cutting forces and poor surface quality for difficult-to-machine materials.This paper first introduces SPDT and reviews research into unconventional techniques for use with SPDT.The machining mechanism is discussed,and the main advantages and disadvantages of various methods are investigated.Second,hybrid SPDT is briefly described,which encompasses ultrasonic-vibration magnetic-field SPDT,ultrasonic-vibration laser SPDT,and ultrasonic-vibration cold-plasma SPDT.Compared with the traditional SPDT method,hybrid SPDT produces a better optical surface quality.The current status of research into unconventional techniques to supplement SPDT is then summarized.Finally,future development trends and the application prospects of unconventional assisted SPDT are discussed.

Scratching and Turning Experiments on Machinability of Optical Glass SF6 in Diamond Cutting Process

To improve the machinability of optical glass and achieve optical parts with satisfied surface quality and dimensional accuracy, scratching experiments with increasing cutting depth were conducted on glass SF6 to evaluate the influence of cutting fluid properties on the machinability of glass. The sodium carbonate solution of 10.5% concentration was chosen as cutting fluid. Then the critical depths in scratching experiments with and without cutting fluid were examined. Based on this, turning experiments were carried out, and the surface quality of SF6 was assessed. Compared with the process of dry cutting, the main indexes of surface roughness decrease by over 70% totally. Experimental results indicated that the machinability of glass SF6 can be improved by using the sodium carbonate solution as cutting fluid.

Microscratch of copper by a Rockwell C diamond indenter under a constant load

The scratch test is used for quality control mostly in phenomenological ways,and whether fracture toughness can be obtained from this test is still a matter of debate requiring further elucidation.In this paper,values of the fracture toughness of copper obtained by different scratch-based approaches are compared in order to examine the applicability of scratch-based methodologies to characterize the fracture toughness of soft metals.The scratch response of copper to a Rockwell C diamond indenter is studied under a constant normal load condition.The variations of penetration depth,residual depth,and residual scratch width with applied normal load are quantified from spherical to sphero-conical contact regimes by piecewise functions.A newly proposed size effect law is found to be the most suitable for scratch-based approaches to characterizing the fracture toughness of soft metallic materials with significant plasticity.A simple expression relating the nominal stress to the penetration depth is proposed for the spherical contact regime and gives almost the same value of fracture toughness.The residual scratch width provides useful information on pile-up of material and on the spherical tip radius of the indenter.It is found that the values of the fracture toughness obtained from the microscratch test are influenced by the data range for analysis.

钨合金超声辅助划擦试验及仿真研究

目的揭示钨合金在超声辅助磨削加工下的材料去除行为。方法通过超声辅助划擦试验与有限元仿真相结合的方式,分析超声振动作用对材料表面形貌、截面轮廓、划擦力、温度、塑性应变及应变率的影响,探究超声振动作用下的材料去除和表面创成机理。结果钨合金在划擦过程中发生严重的塑性变形,在划痕两侧出现由耕犁作用而形成的隆起现象。超声辅助划擦形成的划痕表面鳞刺更少且未出现犁沟现象,且划痕深度相较于普通划擦增大14.1%,划痕宽度增大39%。随着划擦深度的增加,试验划擦力与仿真划擦力均线性增大,且仿真值与试验值误差为18.1%,验证了有限元仿真模型的有效性。超声振动作用下的划擦力呈周期性变化特征,使平均划擦力降低了43.2%。此外,仿真结果表明,超声辅助划擦相较于普通划擦,温度最高降低50%,表面塑性应变最高降低20%,超声冲击过程中材料的塑性应变率相较于普通划擦提高1个数量级,分离过程中塑性应变率最大降低2个数量级。结论超声振动作用可以有效降低划擦过程中的划擦力和划擦区域温度,增大冲击过程中材料的瞬时应变率,改善压头的切屑黏附现象,从而抑制划擦表面鳞刺的生成和犁沟的形成,改善表面质量。此外,超声振动作用还可以有效提高材料去除率。

基于单颗金刚石划擦的单向C_(f)/SiC复合材料去除机理

为研究单向C_(f)/SiC复合材料划擦去除机理,采用单颗金刚石磨粒开展准静态划擦试验,分析不同压痕载荷下划擦材料的声发射信号变化,结合SEM形貌分析材料的去除行为和划擦去除机理。试验结果表明:声发射信号强度随着压痕载荷增加而增强,相同参数下SB方向信号值更大,信号波动更剧烈。结合声发射信号与SEM形貌分析,得出材料在不同方向的划擦去除行为,材料以脆性去除为主,SA方向纤维以拉伸断裂和纤维拔出为主,SB方向纤维主要断裂方式为弯曲断裂和剪切断裂。根据SEM形貌分析,阐述去除行为的形成过程,即解释材料划擦去除机理。

单颗金刚石磨粒划擦2D SiC_(f)/SiC复合材料实验

为了揭示2D SiC_(f)/SiC复合材料的磨削去除机理,根据2D SiC_(f)/SiC复合材料的编织结构特点,分别在2D SiC_(f)/SiC纤维的编织表面(woven surface,WS)和叠加表面(stacking surface,SS)沿0°、45°和90°方向开展单颗金刚石磨粒划擦实验,测量其划擦力和划痕深度,并观察划痕表面形貌。结果表明:在WS0(纤维编织表面的0°方向)上SiC_(f)/SiC材料的去除方式主要为纵向纤维(纤维轴向与进给速度方向一致)的剪切、拉伸、弯曲断裂和横向纤维(纤维轴向与进给速度方向垂直)的剪切、弯曲断裂;在WS45(纤维编织表面的45°方向)上主要为纤维的剪切、弯曲、拉伸断裂;在SS0(纤维叠加表面的0°方向)上主要为法向纤维(纤维轴向垂直于划擦表面)的延性去除、剪切、弯曲断裂,纵向纤维的剪切、拉伸、弯曲断裂;在SS90(纤维叠加表面的90°方向)上主要为法向纤维的延性去除、剪切、弯曲断裂和横向纤维的剪切、弯曲、拉伸断裂。由于SiC纤维的各向异性,不同方向、不同断裂形式有不同的力学性能,剪切断裂所需要的力最小,拉伸断裂所需要的力最大。在相同划擦深度下,因WS0、WS45、SS0、SS90方向上断裂形式的不同和剪切、弯曲、拉伸断裂所占的比例不同,其划擦力大小依次为FSS0>FWS45>FSS90>FWS0。且磨粒切入复合材料后随着裂纹的扩展和相互贯通,SiC基体会一起被剥离去除,部分基体受到挤压去除后再次被磨粒划擦去除形成延性划痕。2D SiC_(f)/SiC复合材料切削时宜选择WS0方向,而尽量避开SS0方向。

Enhancement of surface wettability via micro-and nanostructures by single point diamond turning

Studies on surface wettability have received tremendous interest due to their potential applications in research and industrial processes. One of the strategies to tune surface wettability is modifying surface topography at micro-and nanoscales. In this research, periodic micro-and nanostructures were patterned on several polymer surfaces by ultra-precision single point diamond turning to investigate the relationships between surface topographies at the micro-and nanoscales and their surface wettability. This research revealed that single-point diamond turning could be used to enhance the wettability of a variety of polymers, including polyvinyl chloride(PVC), polyethylene 1000(PE1000), polypropylene copolymer(PP) and polytetrafluoroethylene(PFTE), which cannot be processed by conventional semiconductor-based manufacturing processes. Materials exhibiting common wettability properties(θ≈ 90°) changed to exhibit "superhydrophobic" behavior(θ > 150°). Compared with the size of the structures, the aspect ratio of the void space between micro-and nanostructures has a strong impact on surface wettability.

Deformation Analysis of Micro/Nano Indentation and Diamond Grinding on Optical Glasses

The previous research of precision grinding optical glasses with electrolytic in process dressing （ELID） technology mainly concentrated on the action of ELID and machining parameters when grinding, which aim at generating very ＂smoothed＂ surfaces and reducing the subsurface damage. However, when grinding spectrosil 2000 and BK7 glass assisted with ELID technology, a deeply comparative study on material removal mechanism and the wheel wear behaviors have not been given yet. In this paper, the micro/nano indentation technique is initially applied for investigating the mechanical properties of optical glasses, whose results are then refereed to evaluate the machinability. In single grit diamond scratching on glasses, the scratching traces display four kinds of scratch characteristics according to different material removal modes. In normal grinding experiments, the result shows BK7 glass has a better machinability than that of spectrosil 2000, corresponding to what the micro/nano indentation vent revealed. Under the same grinding depth parameters, the smaller amplitude of acoustic emission （AE） raw signals, grinding force and grinding force ratio correspond to a better surface quality. While for these two kinds of glasses, with the increasing of grinding depth, the variation trends of the surface roughness, the force ratio, and the AE raw signals are contrary, which should be attributed to different material removal modes. Moreover, the SEM micrographs of used wheels surface indicate that diamond grains on the wheel surface after grinding BK7 glass are worn more severely than that of spectrosil 2000. The proposed research analyzes what happened in the grinding process with different material removal patterns, which can provide a basis for producing high-quality optical glasses and comprehensively evaluate the surface and subsurface integrity of optical glasses.

A Fast Tool Servo System for Fabrication of Micro-structured Surfaces on A Diamond Turning Machine

A fast tool servo (FTS) system is developed for the fabrication of non-rotationally symmetric micro-structured surfaces using single-point diamond turning machines.The constructed FTS employs a piezoelectric tube actuator (PZT) to actuate the diamond tool and a capacitive probe as the feedback sensor.To compensate the inherent nonlinear hysteresis behavior of the piezoelectric actuator,Proportional Integral (PI) feedback control is implemented.Besides,a feed-forward control based on a simple feed-forward predictor has been added to achieve better tracking performance.Experimental results indicate that error motions in the performance of the system caused by hysteresis can be reduced greatly and the micro-structured surface is successfully fabricated by implementing the FTS.

Analysis and Prediction of Effect of Turning Marks Diffraction on Image Quality of Optical System

Single-point diamond turning (SPDT) is widely used in the machining of infrared materials and metal-based mirrors. Diamond tips can scratch material, replicate the shape of the tip, and create annular turning marks on optical surfaces, which can have unpredictable adverse effects on imaging. In order to predict the effect of turning marks diffraction on the degradation of imaging quality, a model of the influence of SPDT processing parameters on the reduction of system imaging MTF under the influence of ideal grating turning marks diffraction was established. The results show that the depth of the turning mark will lead to the decline of MTF, especially the low frequency information. Finally, a method is proposed to reduce the effect of turning marks diffraction through changing the processing parameters. .

单颗金刚石划擦Ta12W的试验研究

采用单颗钎焊单晶金刚石划擦Ta12W,跟踪观察了金刚石的磨损形貌,测量了划擦过程的力信号以及力比的变化,监测了磨损过程中的声发射信号变化,提取不同磨损阶段的声发射信号,进行频谱和功率谱分析.结果表明：划擦过程中金刚石的磨损可分为初期、稳定和剧烈磨损三个阶段,三个阶段的划擦力和力比明显不同.划擦声发射信号频谱主要分布在0-170 k Hz之间,功率谱峰值主频分布在7.8-27.3 k Hz之间,金刚石磨损的加剧使声发射信号峰值主频由高频向低频趋近,并且功率谱峰值随之增加.

垂直于工件平面的二维超声振动辅助磨削单晶硅表面形成机制的试验研究

通过单晶硅磨削试验以及单颗金刚石磨粒划擦试验,分析垂直于工件平面的二维椭圆超声振动磨削单晶硅的表面形成机制。椭圆超声振子由压电陶瓷晶体与金属弹性体粘接制成,其伸缩模态和弯曲模态频率相同,当输入具有一定相位差的两个交流电压信号时产生二维椭圆振动。试验结果表明,由于二维椭圆振动的施加改变了单晶硅的材料去除机制,加工表面质量明显提高,表面粗糙度显著降低,磨削沟槽变浅而宽,切屑变厚而短,单晶硅材料延性域去除比例增加;通过改变超声振动振幅与磨削深度之间大小关系,可实现磨削刃对工件的连续性接触去除和断续性接触去除两种模式的转变。

切向载荷作用下氮化硅陶瓷崩碎损伤规律与机理

针对工程陶瓷的崩碎损伤,应用单颗粒划痕实验系统研究了切向载荷作用下Si3N4陶瓷的崩碎损伤特征和机理。比较了损伤位置、切入深度、切向速度和金刚石磨粒磨损等因素对陶瓷崩碎损伤的影响,应用3D激光测量显微镜观测了崩碎损伤表面的三维形貌,应用扫描电镜分析了崩碎损伤机理。结果表明:出口崩碎损伤是陶瓷崩碎损伤的主要形式;切入深度越大,切向速度越小,金刚石颗粒磨损越多,崩碎损伤就越严重。出口崩碎损伤的中心剖面线具有显著的阶梯形分形特征,其扩展演化规律可由逾渗理论和裂纹扩展的最小阻力原理解释。在切向载荷作用下,入口崩碎损伤在金刚石磨粒的碰撞下主要以穿晶断裂为主;内部崩碎损伤在金刚石磨粒的挤压和切割下主要以破碎和铲除的形式发生断裂;而出口崩碎损伤主要以沿晶断裂为主。

单颗粒金刚石划擦Si_3N_4陶瓷的磨削力研究

为揭示磨削加工中砂轮单个磨粒对工程陶瓷划擦力的作用规律,利用单颗粒金刚石磨具划擦实验来模拟砂粒实际磨削过程。分析单颗粒金刚石的划擦力产生机理,认为划擦力是由磨粒对试件的挤压力和摩擦力构成。采用不同磨削刃顶锥角与尖端圆弧半径的自制金刚石颗粒,改变划擦深度与试件进给速度,探讨金刚石颗粒磨削刃特征、划擦实验参数对Si3N4陶瓷试件划擦法向力与切向力的影响。结果发现,试件法向划擦力随磨削刃特征参数和划擦用量增大而增加;切向划擦力随磨削刃尖端圆弧半径逐渐递减,与顶锥角和划擦用量保持递增关系。

单颗金刚石划擦玻璃的实验研究

本文利用自行制备的单颗粒金刚石工具划擦普通玻璃,观察不同划擦深度的划痕形貌并进行统计分析,同时采集和分析了划擦过程中的磨削力。实验结果表明,划痕的实际宽度与理论宽度有相同的变化趋势。随着切深的增加,实际宽度与理论宽度趋于比较恒定的比值。当划擦磨粒不变时,单颗磨粒的法向磨削力和切向磨削力都随着划痕长度的增加而线性增加。

不同圆角半径金刚石划擦单晶SiC过程中的材料去除机理研究

以单晶碳化硅(Si C)作为加工对象,通过不同尖端圆角半径的圆锥型金刚石磨粒划擦试验观察了单晶Si C的去除过程,并采用FEM与SPH耦合算法模拟仿真了三种不同尖端圆角半径的单颗磨粒划擦Si C过程中的材料去除过程,试验结果与模拟结果基本一致。在此基础上,采用仿真手段从最大等效应力和接触力的角度分析了三种不同尖端圆角半径对单晶碳化硅材料脆塑转变过程材料去除机理的影响。仿真结果表明:随着尖端圆角半径的增加,弹塑性变形-塑脆临界的转变点趋近于0.14μm,而且纯粹的塑性变形模式逐渐消失;脆塑临界去除模式所占的区域逐渐变长,由脆塑临界-脆性去除的转变点的深度也在不断变深;脆塑转变过程中的微裂纹的长度及粗细程度逐渐增加,材料破坏的形式也逐渐升级。

纳米压痕法研究金刚石薄膜的力学性能

用热丝化学气相沉积法在硅基体上制备了大面积硼掺杂金刚石薄膜,硼的浓度大约为2×10^(20)/cm3。利用纳米压痕仪及其附件研究了薄膜和纳米划擦有关的力学性能。结果表明:薄膜具有较高的硬度,平均硬度约为30GPa,弹性模量约为419GPa;薄膜与基体的结合强度较高,薄膜发生剥落的第一次破坏力大约是4N。比较而言,薄膜中心区域的硬度高于边缘,结合强度则相反。

金刚石砂轮的CO_2脉冲激光修锐研究

利用ＣＯ２激光对树脂结合剂金刚石砂轮片的表面进行了扫描试验，对扫描前后砂轮片的表面三维形貌进行了测试分析，研究了激光脉冲频率和占空比等参数的影响。结果表明，尽管平均扫描能量密度一定，但频率和占空比对修锐效果均会产生影响，其中频率的影响更为显著。同时，通过使用铝工件和砂轮片的相对刻划试验，对不同扫描条件下刻划时的切向力与法向力之比进行了对比分析，发现由于该力比可以有效地反映出砂轮片的切削性能，因此可以用来对修锐效果进行定量评价。

单颗粒金刚石划擦工程陶瓷的断裂强度研究

为揭示磨削加工中砂轮单个磨粒对工程陶瓷断裂强度的作用规律,利用单颗粒金刚石磨具划擦模拟砂粒实际磨削过程。采用不同顶锥角与尖端圆弧半径的自制金刚石颗粒,改变划擦用量和冷却工况,划擦几种典型陶瓷材料表面并分析颗粒划擦作用对试件断裂强度的影响。结果发现,试件划擦后断裂强度随磨粒顶锥角和尖端圆弧半径的增大而提高;随工作台进给速度和划擦深度增加逐渐降低;与湿式划擦相比,干式划擦使陶瓷试件断裂强度趋于劣化。该变化规律符合磨削加工对试件强度特性的影响机制,证明单颗粒金刚石划擦试验的有效性。

金刚石磨粒与蓝宝石接触形式对其磨损性能的影响

利用单颗金刚石磨粒划擦蓝宝石工件,跟踪检测磨粒以点、线、面等三种接触形式划擦蓝宝石过程中的磨损体积、表面形貌、划擦力与力比等的磨损变化特征.研究结果表明:接触方式对金刚石磨粒的耐磨性具有显著的影响,三种情况下都可在金刚石后部观察到片状解理形貌;磨损的加剧使金刚石磨粒划擦力与力比出现一定程度的减小.