Preventing formation of intermetallic compounds in ultrasonic-assisted Sn soldering of Mg/Al alloys through pre-plating a Ni coating layer on the Mg substrate

Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.

A review of soldering by localized heating

In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the thermal needs of different modules has become increasingly prominent,especially for small-size solder joints with high heat dissipation in high-power devices.Localized soldering is con-sidered a suitable choice to selectively heat the desired target while not affecting other heat-sensitive chips.This paper reviews several local-ized soldering processes,focusing on the size of solder joints,soldering materials,and current state of the technique.Each localized solder-ing process was discovered to have unique characteristics.The requirements for small-size solder joints are met by laser soldering,microres-istance soldering,and self-propagating soldering;however,laser soldering has difficulty meeting the requirements for large heat dissipation,microresistance soldering requires the application of pressure to joints,and self-propagating soldering requires ignition materials.However,for small-size solder junctions,selective wave soldering,microwave soldering,and ultrasonic soldering are not appropriate.Because the magnetic field can be focused on a tiny area and the output energy of induction heating is large,induction soldering can be employed as a significant trend in future research.

Interfacial reaction behavior and mechanical properties of 5A06 Al alloy soldered with Sn-1Ti-xGa solders at a low temperature

Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were investigated. The results showed that the Sn-1Tisolder broke the oxide film on the surface of the Al substrate and induced intergranular diffusion in the Al substrate. When Ga was added tothe solder, severe dissolution pits appeared in the Al substrate due to the action of Sn-1Ti-0.3Ga solder, and many Al particles were flakedfrom the matrix into the solder seam. Under thermal stress and the Ti adsorption effect, the oxide film cracked. With increasing solderingtime, the shear strength of 5A06 Al alloy joints soldered with Sn-1Ti and Sn-1Ti-0.3Ga active solders increased. When soldered for 90 min,the joint soldered with Sn-1Ti-0.3Ga solder had a higher shear strength of 22.12 MPa when compared to Sn-1Ti solder.

Effects of Sn element on microstructure and properties of Zn-Cu-Bi-Sn high-temperature solder

The microstructures and properties of the Zn-Cu-Bi-Sn(ZCBS) high-temperature solders with various Sn contents were studied using differential scanning calorimetry(DSC),scanning electron microscopy(SEM) and X-ray diffraction(XRD).The results indicate that the increase of Sn content can both decrease the melting temperature and melting range of ZCBS solders and it can also effectively improve the wettability on Cu substrate.The shear strength of solder joints reaches a maximum value with the Sn addition of 5%(mass fraction),which is attributed to the formation of refined β-Sn and primary ε-CuZn_5 phases in η-Zn matrix.However,when the content of Sn exceeds 5%,the shear strength decreases due to the formation of coarse β-Sn phase,which is net-shaped presented at the grain boundary.

Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration

The spacecraft for deep space exploration missions will face extreme environments,including cryogenic temperature,intense radiation,wide-range temperature variations and even the combination of conditions mentioned above.Harsh environments will lead to solder joints degradation or even failure,resulting in damage to onboard electronics.The research activities on high reliability solder joints using in extreme environments can not only reduce the use of onboard protection devices,but effectively improve the overall reliability of spacecraft,which is of great significance to the aviation industry.In this paper,we review the reliability research on SnPb solder alloys,Sn-based lead-free solder alloys and In-based solder alloys in extreme environments,and try to provide some suggestions for the follow-up studies,which focus on solder joint reliability under extreme environments.

Effect of Strain Rate on Tensile Behavior of Sn-9Zn-xAg-ySb;{(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} Lead-Free Solder Alloys

The tensile properties of Sn-9Zn-xAg-ySb;{(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} lead-free solders were investigated. All the test samples were annealed at 150°C for 1 hour. The tests are carried out at room temperature at the strain rate of 4.17 × 10-3 s-1, 20.85 × 10-3 s-1, and 208.5 × 10-3 s-1. It is seen that the tensile strength increases and the ductility decrease with increasing the strain rate over the investigated range. From the strain rate change test results, the strain sensitivity values are found in the range of 0.0831 to 0.1455 due to the addition of different alloying elements.

Effects of Zn addition on mechanical properties of eutectic Sn-58Bi solder during liquid-state aging

Interfacial reaction, tensile strength and creep resistance of Sn-58Bi-x Zn(x=0, 0.7, mass fraction, %) solder samples during liquid-state aging were investigated. The coarsening of Bi and the growth of Cu-Sn intermetallic compounds(IMCs) in Sn-58Bi-0.7Zn solder sample were both effectively suppressed. With the addition of 0.7% Zn, ultimate tensile strengths(UTSs) of the Sn-58 Bi solder slabs were respectively increased by 6.05% and 5.50% after reflow soldering and liquid-state aging, and those of the Cu/Sn-58Bi/Cu solder joints were also increased by 21.51% and 29.27%, respectively. The increase in strengthening effect of Cu/Sn-58Bi-x Zn/Cu solder joints could be attributed to the fracture surface which was changed from the Cu/IMC interface to the IMC/solder interface due to the finer Bi grain. Nanoindentation results revealed that the creep behavior of Sn-58Bi-0.7Zn solder was significantly improved compared with that of the eutectic Sn-58 Bi solder after reflow soldering and liquid-state aging.

Microstructure evolution and mechanical properties of ultrasonic-assisted soldering joints of 2024 aluminum alloys

Ultrasonic-assisted soldering of 2024 aluminum alloys using a filler metal of Zn-5Al alloy was investigated at the temperature of 400 ℃,which is lower than the solution strengthening temperature of Al-Cu alloys.The ultrasonic vibration with power of 200 W and vibration amplitude of 15 μm at the frequency of 21 kHz was applied on the top samples.The ultrasonic vibration promoted the dissolution of Al elements in the base metal.The reduction of volume fraction of the eutectic phases in the bonds was investigated by increasing ultrasonic vibration time.As the ultrasonic vibration time increased from 3 s to 30 s,the volume fraction of the eutectic phase in the bonds decreased from 12.9% to 0.9%,and the shear strength of the joints was up to 149-153 MPa,increased by 20%.The improvement of the mechanical properties of joints was discussed based on the modulus and hardness of the phases in the bonds and the fracture of the joints.

Effect of Sb content on properties of Sn-Bi solders

The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry （DSC）. The spreading test was carried out to characterize the wettability of Sn-Bi-Sb solders on Cu substrate. The mechanical properties of the solders/Cu joints were evaluated. The results show that the ternary alloy solders contain eutectic structure resulting from quasi-peritetic reaction. With the increase of Sb content, the amount of the eutectic structure increases. At a heating rate of 5 ℃/min, Sn-Bi-Sb alloys exhibit a higher melting point and a wider melting range. A small amount of Sb has an impact on the wettability of Sn-Bi solders. The reaction layers form during spreading process. Sb is detected in the reaction layer while Bi is not detected. The total thickness of reaction layer between solder and Cu increases with the increase of the Sb content. The shear strength of the Sn-Bi-Sb solders increases as the Sb content increases.

EFFECTS OF RARE EARTH ELEMENT LANTHANUM ON MICROSTRUCTURE AND PROPERTIES OF Ag-Cu-Ti SOLDER ALLOY

The effects of rare earth Lanthanum on the microstructure, the physical property and the microhardness of Ag-Cu-Ti solder alloy are studied. Experimental results indicate that the addition of Lanthanum can evidently improve the wettability and the microhardness of Ag-Cu-Ti solder alloy. Analysis results show that the increase in microhardness is related to the refining and uniform distribution of the intermetallic compounds. Proper content of Lanthanum added in Ag-Cu-Ti alloy solder can be controlled below 0.5% in mass percent.

Drop failure modes of Sn-3.0Ag-0.5Cu solder joints in wafer level chip scale package

To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.

Interfacial characteristics and microstructural evolution of Sn-6.5Zn solder/Cu substrate joints during aging

The influence of isothermal aging at 150 °C on the microstructural characteristics and microhardness of the Sn-6.5Zn solder/Cu joint was studied. The mechanisms for the formation and evolution of intermetallic compound （IMC） at the interface of the Sn-6.5Zn/Cu joint were also analyzed. The results indicate that a continuous layer consisting of CuZn and Cu5Zn8 IMCs is formed in the interface zone. As the aging time prolongs, the thickness of the IMC layer first increases and then decreases, and the continuous and compactable layer is destroyed due to the decomposition of the Cu-Zn IMC layer. A discontinuous layer of Cu6Sn5 IMC is present within the Cu substrate near the decomposed region. The interface becomes rough and evident voids form after aging. The microhardness of the interface increases owing to the application of aging.

Influence of rapid solidification on Sn-8Zn-3Bi alloy characteristics and microstructural evolution of solder/Cu joints during elevated temperature aging

The effects of rapid solidification on the microstructure and melting behavior of the Sn-8Zn-3Bi alloy were studied. The evolution of the microstructuraI characteristics of the solder/Cu joint after an isothermal aging at 150 ℃ was also analyzed to evaluate the interconnect reliability. Results showed that the Bi in Sn-8Zn-3Bi solder alloy completely dissolved in the Sn matrix with a dendritic structure after rapid solidification. Compared with as-solidified Sn-8Zn-3Bi solder alloy, the melting temperature of the rapid solidified alloy rose to close to that of the Sn-Zn eutectic alloy due to the extreme dissolution of Bi in Sn matrix. Meanwhile, the adverse effect on melting behavior due to Bi addition was decreased significantly. The interfacial intermetallic compound （IMC） layer of the solder/Cu joint was more compact and uniform. Rapid solidification process obviously depressed the formation and growth of the interfacial IMC during the high-temperature aging and improved the high-temperature stability of the Sn-8Zn-3Bi solder/Cu joint.

Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad

Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively.The influence of different heating methods as well as output power of diode-laser on shear force of micro-joints was studied and the relationship between the shear force and microstructures of micro-joints was analyzed.The results indicate that the formation of intermetallic compound Ag3Sn is the key factor to affect the shear force and the fine eutectic network structures of micro-joints as well as the dispersion morphology of fine compound Ag3Sn,in which eutectic network band is responsible for the improvement of the shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder.With the increases of output power of diode-laser,the shear force and the microstructures change obviously.The eutectic network structures of micro-joints soldered with diode-laser soldering method are more homogeneous and the grains of Ag3Sn compounds are finer in the range of near optimal output power than those soldered with IR reflow soldering method,so the shear force is also higher than that using IR reflow soldering method.When the output power value of diode-laser is about 41.0 W,the shear force exhibits the highest value that is 70% higher than that using IR reflow soldering method.

Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints

Composite solders were prepared by mechanically dispersing different volumes of nano-sized Ag particles into the Sn-0.7Cu eutectic solder. The effects of Ag particle addition on the microstructure of Sn-0.7Cu solder joints were investigated. Besides, the effects of isothermal aging on the microstructural evolution in the interfacial intermetallic compound （IMC） layer of the Sn-0.7Cu solder and the composite solder reinforced with 1vol% Ag particles were analyzed, respectively. Experimental results indicate that the growth rate of the interfacial IMC layer in the Ag particles reinforced composite solder joint is much lower than that in the Sn-0.7Cu solder joint during isothermal aging. The Ag particles reinforced composite solder joint exhibits much lower layer-growth coefficient for the growth of the IMC layer than the corresponding solder joint.

Preparation and Properties of Particle Reinforced Sn-Zn-based Composite Solder

Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ CusZn8 particles are formed and distributed uniformly in the composite solders. The strength and plasticity of the composite solders were improved, and creep resistance was considerably enhanced. The wettability of these composite solders is also better than that of Sn-9Zn.

Environmentally friendly solders 3-4 beyond Pb-based systems

Based on environmental considerations, global economic pressures, enacted by legislations in several countries, have warranted the elimination of lead from solders used in electronic applications. Sn3.5Ag, SnAgCu, and Sn0.7Cu have emerged among various lead-free candidates as the most promising solder alloys to be utilized in microelectronic industries. However, with the vast development and miniaturization of modern electronic packaging, new requirements such as superior service capabilities have been posed on lead-free solders. In order to improve the comprehensive property of the solder alloys, two possible approaches were adopted in the current research and new materials developed were patented. One approach was involved with the addition of alloying elements to make new ternary or quaternary solder alloys. Proper addition of rare earth element such as La and Ce have rendered solder alloys with improved mechanical properties, especially creep rupture lives of their joints. Another approach, the composite approach, was developed mainly to improve the service temperature capability of the solder alloys. Composite solders fabricated by mechanically incorporating various reinforcement particles to the solder paste have again exhibited enhanced properties without altering the existing processing characteristics. The recent progress and research efforts carried out on lead-free solder materials in Beijing University of Technology were reported. The effects of rare earth addition on the microstructure, processing properties, and mechanical properties were presented. The behaviors of various Sn-3.5Ag based composite solders were also explicated in terms of the roles of reinforcement particles on intermetallic growth, steady-state creep rate, the onset of tertiary creep, as well as the overall creep deformation in the solder joints. Thermomechanical fatigue (TMF) behavior of the solder alloys and composite solders were investigated with different parameters such as ramp rate, dwell time, etc. The damage accumulation features and residual mechanical properties of the thermomechanically-fatigued composite solder joints were compared with non-composite solder joints. To match the lead-free alloys, various types of water soluble no-clean soldering flux have also been developed and their properties were presented.

Influences of Ag and Au Additions on Structure and Tensile Strength of Sn-5Sb Lead Free Solder Alloy

It is important, for electronic application, to decrease the melting point of Sn-5Sb solder alloy because it is relatively high as compared with the most popular eutectic Pb-Sn solder alloy. Adding Au or Ag can decrease the onset melting temperature （233℃） of this alloy to 203,5℃ and 216℃, respectively. The results indicate that the Sn-5Sb-i.5Au alloy has very good ultimate tensile strength （UTS）, ductility, and fusion heat, which are better than both those of the Sn-5Sb-3.SAg and Sn-5Sb alloys. The formation of intermetallic compounds （IMCs） AuSn4 and Ag3Sn enhanced the SbSn precipitates in the solidification microstructure microstructure stability, while retained the formation of thus significantly improved the strength and ductility For all alloys, both UTS and yield stress （σy） increase with increasing strain rate and decrease with increasing temperature in tensile tests, but changes of ductility are generally small with inconsistent trends.

Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition

The Sn-Cu-Ni-Ge solder is a strong challenger to the Sn-Ag-Cu（SAC） solders as a replacement for the Sn-Pb eutectic solder. This research investigated the effects of addition of Ag, Bi, In, and Sb on the physical properties of the Sn-0.6 Cu-0.05 Ni-Ge（SCNG） lead-free solder and the interfacial reaction with the Cu substrate. The melting behavior, microstructure, tensile strength, and wettability of the SCNG-x（x=Ag, Bi, In, Sb） solders were examined. The findings revealed that the introduction of Ag, Bi, In, and Sb minimally altered the solidus temperature, liquidus temperature, and tensile strength of the solder. However, the cooling behavior and solidified microstructure of the solder were affected by the concentration of the alloying elements. The wettability of the SCNG solder was improved with the doping of the alloying elements except Sb. The thickness of intermetallic layer was increased by the addition of the alloying elements and was related to the cooling behavior of the solder. The morphology of intermetallic layer between the SCNG-x solders and the Cu substrate was different from that of the typical SAC solders. In conclusion, alloying the SCNG solder with Ag, Bi, In or Sb is able to improve particular properties of the solder.

An exPerimental study of effect of solder joint geometry on thermal cycle life in SMT

The geometry of solder joint in SMT is one of the important factors whichdetermine the solder joint reliability. In this study, a type of solder joint specimen has beendesigned and is subjected to thermal cycling to failure between -55 ℃ to +125 ℃ with a 36℃/min heating and cooling rate and 10 min temperature holding times. The solder jointgeometry is castellated and controlled with different solder fillet shape and stand off height.A statistical analysis of the scattered thermal cycle lives of solder joints by two parameterWeibull's probability density function has been carried out in this paper. The experimentalresults show that the more reliable solder joint geometry has flat or slight convex solderfillet with a stand off height larger than 0.1 mm. The results may be the recommendedguideline to design optimal solder joint geometry.