Effect of Ag and Ni on the melting point and solderability of SnSbCu solder alloys

To improve the properties of Sn10Sb8Cu solder alloy, two new solders （SnSbCuAg and SnSbCuNi） were formed by adding small amounts of Ag or Ni into the solder alloy. The results show that the melting point of the SnSbCuAg solder alloy decreases by 14.1℃ and the spreading area increases by 16.5% compared to the matrix solder. The melting point of the SnSbCuNi solder alloy decreases by 5.4℃ and the spreading area is slightly less than that of the matrix solder. Microstructure analysis shows that adding trace Ag makes the melting point decline due to the dispersed distribution of SnAg phase with low melting point. Adding trace Ni, Cu6Sn5 and （Cu, Ni）6Sn5 with polyhedron shape on the copper substrate can be easily seen in the SnSbCuNi solder alloy, which makes the viscosity of the melting solder increase and the spreading property of the solder decline.

Fully Connected Convolutional Neural Network in PCB Soldering Point Inspection

In Electronics Manufacturing Services (EMS) industry, Printed Circuit Board (PCB) inspection is tricky and hard, especially for soldering point inspection due to the extremely tiny size and inconsistent appearance for uneven heating in reflow soldering process. Conventional computer vision technique based on OpenCV or Halcon usually cause false positive call for originally good soldering point on PCB because OpenCV or Halcon use the pre-defined threshold in color proportion for deciding whether the specific soldering point is OK or NG (not good). However, soldering point forms are various after heating in reflow soldering process. This paper puts forward a VGG structure deep convolutional neural network, which is named SolderNet for processing soldering point after reflow heating process to effectively inspect soldering point status, reduce omission rate and error rate, and increase first pass rate. SolderNet consists of 11 hidden convolution layers and 3 densely connected layers. Accuracy reports are divided into OK point recognition and NG point recognition. For OK soldering point recognition, 92% is achieved. For NG soldering point recognition, 99% is achieved. The dataset is collected from KAGA Co. Ltd Plant in Suzhou. First pass rate at KAGA plant is increased from 25% to 80% in general.

高密度芯片激光钎焊温度场及应力场数值模拟研究

旨在探讨激光钎焊工艺参数对高密度芯片制造中凸点焊点质量的影响。通过有限元方法建立了三维瞬态热耦合数值模型,并利用高斯体热源模型和iSoldering软件模拟了SnAgCu钎料凸点激光钎焊的温度场和应力场,研究不同功率10 W、15 W、20 W和不同光斑半径0.09 mm、0.3 mm、0.5 mm下SnAgCu钎料钎焊焊点的变化规律。研究发现,激光功率和光斑半径是影响焊点质量的关键参数。在部分参数不变的情况下,随着激光功率的增大,钎料熔化更完全,润湿性更好,但也会产生更大的等效应力。增大光斑半径会导致焊点温度和等效应力降低。经过数值模拟和实际钎焊焊点的对比,结果表明:当激光功率为15 W、光斑半径为0.09 mm、焊接速度为0.1 mm/s时,SnAgCu凸点激光钎焊的焊点质量最佳,模拟凸点钎焊的焊点与实际钎焊结果吻合度达到85%,验证了模拟结果的准确性和可靠性。同时探讨了钎料与焊盘之间生成的金属间化合物厚度对焊点质量的影响,为提高焊点连接强度提供了理论依据。

元素Co对Sn-0.7Cu无铅焊料合金组织、熔点、润湿性及可靠性能的影响研究

研究了添加适量的Co元素对Sn-0.7Cu无铅钎料合金性能的影响,应用Axio Scope A1显微镜、差示扫描量热仪、MUST system3型可焊性测试仪、高温试验箱、HITACHI 550i型扫描电镜对Sn-0.7Cu-xCo(x=0%、0.002%、0.004%、0.02%、0.03%)合金焊料进行金相观察,并对其熔点、可焊性及可靠性能进行了对比试验分析。结果表明,加入一定量Co元素,使Sn-0.7Cu熔点增高,润湿性能有所降低,但金相组织和可靠性均得到改善。

Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys

The melting point, spreading property, mechanical properties and microstructures of Sn-3.0Ag-2.8Cu solder alloys added with micro-variable-Ce were studied by means of optical microscopy, scanning electron microscopy(SEM) and energy dispersive X-ray(EDX). The results indicate that the melting point of Sn-3.0Ag-2.8Cu solder is enhanced by Ce addition; a small amount of Ce will remarkably prolong the creep-rupture life of Sn-3.0Ag-2.8Cu solder joint at room temperature, especially when the content of Ce is 0.1%, the creep-rupture life will be 9 times or more than that of the solder joint without Ce addition; the elongation of Sn-3.0Ag-2.8Cu solder is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%-0.1 %.

Effect of indium addition on the microstructural formation and soldered interfaces of Sn-2.5Bi-1Zn-0.3Ag lead-free solder

The microstructural formation and properties of Sn-2.5Bi-xln-lZn-0.3Ag （in wt%） alloys and the evolution of soldered interfaces on a Cu substrate were investigated. Apart from the relatively low melting point （about 195C）, which is close to that of conventional eutectic Sn-Pb solder, the investigated solder presents superior wettability, solderability, and ductility. The refined equiaxial grains enhance the me- chanical properties, and the embedded bulk intermetallic compounds （IMCs） （Cu6Sn5 and CusZns） and granular Bi particles improve the joint reliability. The addition of In reduces the solubility of Zn in the 13-Sn matrix and strongly influences the separation and growth behaviors of the IMCs. The soldered interface of Sn-2.5Bi-xln-lZn-0.3Ag/Cu consists of Cu-Zn and Cu-Sn IMC layers.

氢化松香酸值、软化点对SnAg3.0Cu0.5焊锡膏基本性能的影响

选用高酸值KE-604、中酸值AXE、无酸值KE-100三种氢化松香制备焊锡膏并进行基本性能测试。研究表明氢化松香的软化点越低Ti值越高、抗塌落性能越好,焊接过程中产生锡珠越少;高酸值松香能提高焊锡膏的焊接性,减少铜板腐蚀;中酸值全氢化松香能增加焊锡膏的抗塌落性能、润湿性和降低空洞率;无酸值松香酯能增强焊锡膏成膜性和提高抗塌落性能;在助焊剂配方中通常使用两种或两种以上的复配松香代替单一松香,来获得更好的焊锡膏性能。

(Sn_(1-x)Zn_(x))_(57)(In_(0.78)Bi_(0.22))_(43)低熔点无铅焊料的微观结构表征

为了寻求一种应用于三维集成电路低温焊接的无铅焊料,基于多组元混合的概念设计并表征(Sn_(1-x)Zn_(x))_(57)(In_(0.78)Bi_(0.22))_(43)(x=0.10,0.15,0.20,摩尔分数,%)四元合金。采用扫描电子显微镜、X射线衍射仪和差示扫描量热仪研究合金的显微组织、热性能和润湿性。结果表明,合金由金属间化合物BiIn_(2)、In_(0.2)Sn_(0.8)和富Zn固溶体组成。随着Zn添加量的增加,BiIn_(2)和富Zn相的体积分数增加。合金的熔点低至70℃,源自低熔点金属间化合物In_(0.2)Sn_(0.8)和BiIn_(2)的形成;合金具有良好的润湿性,润湿角约为40°。在合金和Cu板的界面结合处形成一种薄而坚韧的Cu_(5)Zn_(8)层,提高焊点可靠性。研究表明,通过多组元混合概念设计合金可以有效提高焊料的焊接性能。

SnAgCu无铅焊点的电迁移行为研究

电迁移引发的焊点失效已经成为当今高集成度电子封装中的最严重的可靠性问题之一。应用SnAgCu无铅焊膏焊接微米级铜线,进行电迁移实验。结果表明:焊点形貌从原来的光滑平整变得凹凸不平,阴极处出现了裂纹和孔洞,并且在铜基板和Cu6Sn5金属间化合物(IMC)之间出现薄薄的一层Cu3Sn金属间化合物,由ImageJ软件测量其平均厚度约为2.11μm;而在阳极附近没有明显的Cu3Sn金属间化合物形成。

Bi对Sn-0．3Ag-0．7Cu无铅钎料熔点及润湿性能的影响

研究了添加适量的Bi元素对低银型Sn-0.3Ag-0.7Cu无铅钎料合金性能的影响,应用差示扫描量热仪和SAT—5100型润湿平衡仪对Sn-0.3Ag-0.7Cu-xBi(x=0,1,3,4.5)钎料的熔点、润湿性能作了对比试验分析。结果表明,一定量Bi元素的加入可以降低Sn-0.3Ag-0.7Cu钎料合金的熔点,并改善其润湿性能。但过多的Bi元素会导致钎料的液固相线温度差增大,塑性下降,造成焊点剥离缺陷。综合考虑得到Sn-0.3Ag-0.7Cu-3.0Bi无铅钎料具有最佳的综合性能。

Sn-3Ag-0.5Cu/Ni微焊点多次回流焊后IMC厚度及组织分析

采用Sn-Ag-Cu焊球(直径200,300,400和500μm),镀Ni盘,研究1,3,5次回流焊条件下焊点的IMC厚度及显微组织与焊球尺寸间的关系。结果表明:对于同一尺寸的焊球,随着回流焊次数的增加,IMC的厚度增大,形状由平直状逐渐过渡为体钎料一侧凹凸不平;在同一回流焊次数下,随着焊球尺寸的增大,IMC厚度减小,形貌相对没有明显差别。IMC的组成成分随着Ni向体钎料方向的不断扩散而从Sn、Ag、Cu合金变成Sn、Ag、Cu、Ni合金,其主要组成部分为(Cu,Ni)6Sn5。

低熔点Sn-Zn-Bi无铅钎料的组织和性能

研究了Sn-Zn-Bi钎料的组织、相变及润湿性.在Sn-9Zn二元共晶的基础上加入质量分数为(2-10)%的Bi,合金结晶过程中形成富Zn的初生相这导致合金的结晶温度降低,也标志着熔点的降低,但熔程扩大.在加Bi基础上,适当降低Zn的含量则可以缩小熔程,且熔点无明显变化. Bi的加入明显改善了Si-Zn系钎料的润湿性,提高了钎料在Cu基底上的铺展面积,缩短了润湿时间.钎料中Zn原子向Cu基底的扩散而形成扩散反应层,导致钎料熔体/Cu界面能的下降.因此,钎料中Zn含量提高,其在Cu基底上的铺展面积增大,润湿力提高.而由于扩散过程需要一定时间,导致润湿时间延长.因此,必须合理控制Zn的含量以获得铺展性与润湿时间的良好匹配.

Sb元素对Sn-0.7Cu钎料熔点及钎焊界面的影响

应用扫描电镜和差示扫描量热仪研究Sb元素(0.25%,0.5%,0.75%,1.0%)对Sn-0.7Cu钎料熔点及钎焊界面的影响。结果表明,Sb元素的加入使钎料的熔点升高,从226.38℃增加到227.09℃,但含量小于0.75%时熔点的变化不大,当Sb元素的含量达到1.0%时变化较大。当Sb元素的含量达到0.5%时,界面化合物的形貌发生了很大变化,扇贝状金属间化合物层变得均匀平滑,避免了大柱状的Cu6Sn5相的生成,厚度也变小,明显地抑制了金属间化合物的生长,细化了晶粒。当Sb元素的含量大于0.5%时,界面又出现大柱状的Cu6Sn5相,且界面化合物层的厚度增大。Sb元素的加入并未改变界面处金属间化合物的种类。

一种高性能实用型Sn-Cu无铅电子钎料

研制了一种具有自主知识产权的高性能无铅电子钎料CWB—07系列。它采用在Sn-Cu基体合金中加入Ni、Re、P等多种改性元素的方式,全面改善和提高了钎料的综合性能。经检测、对比和应用试验,证明本产品具有较高的性价比和较强的实用性。抗拉强度达到45MPa,超过Sn-3.5Ag,经济指数优于Sn-3.5Ag和Sn63Pb。

微量银对Sn0.7Cu钎料物理性能及钎焊工艺性能的影响

SnCu共晶钎料是公认的SnPb钎料最具潜力的替代品,尤其在波峰焊上,但与其它无铅钎料相比,该钎料物理性能及铺展性能差,影响其广泛应用.通过在Sn0.7Cu合金基础上添加微量银来改善合金性能.结果表明,银含量对Sn0.7CuxAg钎料熔点影响不大,最大变化仅为0.3℃;随银含量增加,电阻率逐渐升高;同时,在Sn0.7Cu基体上添加微量银可以改善钎料合金铺展性能,Sn0.7Cu0.2Ag钎料铺展面积最大为28.61mm2,较基体提高了25.5%,这主要与形成的富银相及钎料与基板间金属间化合物状态有关.

电子封装用无铅焊料的最新进展

随着WEEE/RoHS法令的颁布,电子封装行业对于无铅焊接提出了更高的要求。根据国际上对无铅焊料的最新研究进展提出了无铅焊料“三大候选”的概念。总结了目前无铅焊料尚存的三大主要弱点,并对国际上推荐使用的几种无铅焊料的优缺点进行了概述。

Al-Si-Cu-Ni低熔点钎料中合金元素对其性能的影响

Al-Si钎料因具有良好的润湿性、流动性、钎焊接头的抗腐蚀性和可加工性 ,应用非常广泛 ,但其熔点较高 ,很难用于低熔点的铝合金的钎焊。以Cu、Ni作为主要的添加元素 ,通过正交试验的方法研究了合金元素Cu、Ni、Si对铝基钎料熔点的影响。结果表明 ,影响的主次顺序为Cu、Si、Ni ,同时得出 :随着合金元素Cu、Si的含量的增大 ,其熔点大大降低 ;合金元素Ni的含量对钎料熔点的影响较小。钎料Al-2 0Cu -3.3Ni-10Si的熔点最低 ,达到5 35 .8℃ 。

铜铟铋硫对Sn-Ag基无铅焊料性能的影响

研究了Cu、In、Bi、S元素对Sn-Ag基无铅焊料熔点和铺展性的影响。结果表明:Sn-Ag-Cu三元合金成分为95.5%Sn3.5%Ag1%Cu时具有较低熔点(215℃)和好的铺展性;加入适量的In可降低Sn-Ag合金的熔点和改善铺展性能;随w(Bi)的增加Sn-Ag-Bi三元合金的熔点降低、铺展性变好;Sn-Ag合金的熔点随w(S)的增加而升高,加入少量S能改善Sn-Ag合金的铺展性。

Sn-Zn-Al-P系无铅焊料成分优化研究

通过实验,在Sn-Zn-Al的基础上添加合金元素P,根据Sn-Zn-Al-P系无铅焊料合金的润湿性能,对合金的成分进行了优化。测试优选合金的熔点和耐腐蚀性能,并对接头微观组织进行观察。结果表明,Al、P合金元素对Sn-Zn-Al-P系焊料合金的熔点、润湿性和抗腐蚀性能均有影响,当Al和P质量分数均低于0.1%时,焊料合金才具有较好的综合性能。