Wettability balance method was used to investigate the wetting performance of Sn Cu Ni-x Eu on Cu substrate, and the mechanical properties and the fracture morphology were studied.The results indicated that the additi...Wettability balance method was used to investigate the wetting performance of Sn Cu Ni-x Eu on Cu substrate, and the mechanical properties and the fracture morphology were studied.The results indicated that the addition of Eu could enhance the properties of solder and solder joints, with the increase of Eu content, tendency of first increase and then decrease could be found in the wetting time, wetting force and the mechanical properties of Sn Cu Ni-x Eu, and the optimal content was 0.039%.For Sn Cu Ni-0.039 Eu solder joints, the optimum mechanical properties could be found, and the amplitude increased was 20%, with the observation of the fracture morphology, it was found that small dimples could be seen, the toughness fracture for Sn Cu Ni and mixture fracture for Sn Cu Ni-0.039 Eu could be demonstrated.And thermal fatigue behavior of Sn Cu Ni solder joints could be enhanced obviously with the 0.039%Eu addition.展开更多
基金Project supported by Natural Science Foundation of the Higher Education Institutions of Jiangsu Province(12KJB460005)
文摘Wettability balance method was used to investigate the wetting performance of Sn Cu Ni-x Eu on Cu substrate, and the mechanical properties and the fracture morphology were studied.The results indicated that the addition of Eu could enhance the properties of solder and solder joints, with the increase of Eu content, tendency of first increase and then decrease could be found in the wetting time, wetting force and the mechanical properties of Sn Cu Ni-x Eu, and the optimal content was 0.039%.For Sn Cu Ni-0.039 Eu solder joints, the optimum mechanical properties could be found, and the amplitude increased was 20%, with the observation of the fracture morphology, it was found that small dimples could be seen, the toughness fracture for Sn Cu Ni and mixture fracture for Sn Cu Ni-0.039 Eu could be demonstrated.And thermal fatigue behavior of Sn Cu Ni solder joints could be enhanced obviously with the 0.039%Eu addition.
