Evolution of bonding interface in solid-liquid cast-rolling bonding of Cu/Al clad strip

Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,and their micro-morphology evolution in the SLCRB process are investigated with scanning electron microscope(SEM),energy dispersive spectrometer(EDS),and X-ray diffraction(XRD).In the casting pool,initial aluminized coating is first generated on the copper strip surface,with the diffusion layer mainly consisting ofα(Al)+CuAl2and growing at high temperatures,with the maximum thickness of10μm.After sequent rolling below the kiss point,the diffusion layer is broken by severe elongation,which leads to an additional crack bond process with a fresh interface of virgin base metal.The average thickness is reduced from10to5μm.The reaction products,CuAl2,CuAl,and Cu9Al4,are dispersed along the rolling direction.Peeling and bending test results indicate that the fracture occurs in the aluminum substrate,and the morphology is a dimple pattern.No crack or separation is found at the bonding interface after90°-180°bending.The presented method provides an economical way to fabricate Cu/Al clad strip directly.

Microstructure and Solid/Liquid Interface Evolutions of Directionally Solidified Fe-Al-Ta Eutectic Alloy

A modified Bridgman directional solidification technique was used to prepare Fe-Al-Ta eutectic in situ composites at different growth rates ranging from 6 to 80 μm/s. The directionally solidified FeAl-Ta eutectic composites are composed of two phases: Fe（Al,Ta） matrix phase, and Fe2 Ta（Al） Laves phase. Solidification microstructure is affected by solidification rate. Microstructure of the Fe-Al-Ta eutectic alloy grown at 6.0 μm/s is broken-lamellar eutectic. Eutectic colonies are formed with the increase of the solidification rate. Microstructures are mainly composed of the lamellar or fibrous eutectic at the center of the colony and coarse lamellar eutectic zone at the boundary. Meanwhile, the inter-lamellar spacing（or the inter-rod spacing） is decreased. The spacing adjustments are also observed in Fe-Al-Ta eutectic alloy. The solid/liquid interface evolves from planar interface to shallow cellular interface, then to deep cellular, and finally to shallow cellular planar with the increase of the solidification rate.

Understanding fundamentals of electrochemical reactions with tender X-rays:A new lab-based operando X-ray photoelectron spectroscopy method for probing liquid/solid and gas/solid interfaces across a variety of electrochemical systems

Electrocatalysis is key to improving energy efficiency,reducing carbon emissions,and providing a sustainable way of meeting global energy needs.Therefore,elucidating electrochemical reaction mechanisms at the electrolyte/electrode interfaces is essential for developing advanced renewable energy technologies.However,the direct probing of real-time interfacial changes,i.e.,the surface intermediates,chemical environment,and electronic structure,under operating conditions is challenging and necessitates the use of in situ methods.Herein,we present a new lab-based instrument commissioned to perform in situ chemical analysis at liquid/solid interfaces using ambient pressure X-ray photoelectron spectroscopy(APXPS).This setup takes advantage of a chromium source of tender X-rays and is designed to study liquid/solid interfaces by the“dip and pull”method.Each of the main components was carefully described,and the results of performance tests are presented.Using a three-electrode setup,the system can probe the intermediate species and potential shifts across the liquid electrolyte/solid electrode interface.In addition,we demonstrate how this system allows the study of interfacial changes at gas/solid interfaces using a case study:a sodium–oxygen model battery.However,the use of APXPS in electrochemical studies is still in the early stages,so we summarize the current challenges and some developmental frontiers.Despite the challenges,we expect that joint efforts to improve instruments and the electrochemical setup will enable us to obtain a better understanding of the composition–reactivity relationship at electrochemical interfaces under realistic reaction conditions.

Mathematical Modelling of Particle Movement Ahead of the Solid-liquid Interface in Continuous Casting

Whether the particle will be trapped by the solid-liquid interface or not is dependent on its moving behavior ahead of the interface, so a mathematical model has been developed to investigate the movement of the particle ahead of the solid-liquid interface. Based on the theory for the boundary layer, the fluid velocity field near the solid-liquid interface was obtained, and the trajectories of particles were calculated by the equations of motion for particles. In this model, the drag force, the added mass force, the buoyance force, the gravitational force, the Saffman force and the Basset history force are considered. The results show that the behavior of the particle ahead of the solid-liquid interface is affected by the physical property of the particle and fluid flow. And in the continuous casting process, if it moves in the stream directed upward or downward near vertical solid-liquid interface or in the horizontal flow under the solid-liquid interface, the particle with the diameter from 5 um to 60um can reach the solid-liquid interface. But if it moves in horizontal flow above the solid-liquid interface, only the particle with the diameter from 5 um to 10 um can reach the solid-liquid interface.

Effect of current density on distribution coefficient of solute at solid-liquid interface

When current passes through the solid-liquid interface, the growth rate of crystal, solid-liquid interface energy and radius of curvature at dendritic tip will change. Based on this fact, the theoretical relation between the distribution of solute at solid-liquid interface and current density was established, and the effect of current on the distribution coefficient of solute through effecting the rate of crystal growth, the solid-liquid interface energy and the radius of curvature at the dendritic tip was discussed. The results show that as the current density increases, the distribution coefficient of solute tends to rise in a whole, and when the former is larger than about 400 A/cm 2, the latter varies significantly.

Thermal rectification induced by Wenzel–Cassie wetting state transition on nano-structured solid–liquid interfaces

Thermal rectification refers to the phenomenon by which the magnitude of the heat flux in one direction is much larger than that in the opposite direction.In this study,we propose to implement the thermal rectification phenomenon in an asymmetric solid–liquid–solid sandwiched system with a nano-structured interface.By using the non-equilibrium molecular dynamics simulations,the thermal transport through the solid–liquid–solid system is examined,and the thermal rectification phenomenon can be observed.It is revealed that the thermal rectification effect can be attributed to the significant difference in the interfacial thermal resistance between Cassie and Wenzel states when reversing the temperature bias.In addition,effects of the liquid density,solid–liquid bonding strength and nanostructure size on the thermal rectification are examined.The findings may provide a new way for designs of certain thermal devices.

Atomic-level characterization of liquid/solid interface

The detailed understanding of various underlying processes at liquid/solid interfaces requires the development of interface-sensitive and high-resolution experimental techniques with atomic precision.In this perspective,we review the recent advances in studying the liquid/solid interfaces at atomic level by electrochemical scanning tunneling microscope(EC-STM),non-contact atomic force microscopy(NC-AFM),and surface-sensitive vibrational spectroscopies.Different from the ultrahigh vacuum and cryogenic experiments,these techniques are all operated in situ under ambient condition,making the measurements close to the native state of the liquid/solid interface.In the end,we present some perspectives on emerging techniques,which can defeat the limitation of existing imaging and spectroscopic methods in the characterization of liquid/solid interfaces.

Apparent Active Adsorption Force at a Solid-Liquid Interface with Active Adsorption

The paper presents a new relationship between the three surface tensions on the solid-liquid-vapor interface, γ_(sl)-γ_(sv)+γ_(lv)cosθ=βin order to understand the wetting on the liquid-solid interface in the case of active adsorption.The authors suggest a new force“apparent active adsorption force”βto take part in the balance at the three interface lines of contact in the solid-liquid-vapor phases,its dimen- sion isβ=Σα_iRT(Γ_i^(sl)-Γ_i^(sv)+Γ_i^(lv)cosθ),and its direction is dependent on the sign of β,whenβis a positive, the direction is agree with surface tension of the sol- id-vapor interface γ and vice versa.

Influence of Ni interlayer on interfacial microstructure and mechanical properties of Ti-6Al-4V/AZ91D bimetals fabricated by a solid–liquid compound casting process

The solid–liquid compound casting of Mg-AZ91D and Ti-TC4 alloys was developed by using pure Ni electro-deposited coating.The pouring temperatures of 660℃,690℃,720℃and 750℃were chosen to investigated the effects of casting temperatures on microstructural evolution,properties,and fracture behaviors of Ni-coated TC4/AZ91D bimetals by the solid–liquid compound casting(SLCC).The scanning electron microscopy(SEM)and the energy dispersive spectroscopy(EDS)results showed that the interfacial zone mainly composed of nickel,Mg_(2)Ni and Mg-Al-Ni in the bimetals cast at 660℃.As the pouring temperature was increased to 750℃,the width of the interface zone,which mainly composed ofδ(Mg),Mg_(2)Ni,Mg-Al-Ni,Mg_(3)TiNi_(2) and Al_(3)Ni,gradually increased.The microhardness tests showed that the micro-hardness of the interface zone was smaller than that of TC4 substrate but larger than that of the cast AZ91D matrix.At the pouring temperature of 720℃,the Ni-coated TC4/AZ91D bimetals had the most typical homogeneous interface,which had granular Mg-Al-Ni ternary phase but no ribbon-like Al3Ni binary phase,and achieved the highest shear strength of 97.35MPa.Meanwhile,further fracture behavior analysis showed that most fracture failure of Ni-coated TC4/AZ91D bimetals occurred at the Mg_(2)Ni+δ(Mg)eutectic structure and Al_(3)Ni hard intermetallic.

An APXPS endstation for gas–solid and liquid–solid interface studies at SSRF

In the past few decades, various surface analysis techniques find wide applications in studies of interfacial phenomena ranging from fundamental surface science,catalysis, environmental science and energy materials.With the help of bright synchrotron sources, many of these techniques have been further advanced into novel in-situ/operando tools at synchrotron user facilities, providing molecular level understanding of chemical/electrochemical processes in-situ at gas–solid and liquid–solid interfaces.Designing a proper endstation for a dedicated beamline is one of the challenges in utilizing these techniques efficiently for a variety of user's requests. Many factors,including pressure differential, geometry and energy of the photon source, sample and analyzer, need to be optimized for the system of interest. In this paper, we discuss the design and performance of a new endstation at beamline02 B at the Shanghai Synchrotron Radiation Facility for ambient pressure X-ray photoelectron spectroscopy studies.This system, equipped with the newly developed hightransmission HiPP-3 analyzer, is demonstrated to be capable of efficiently collecting photoelectrons up to 1500 eV from ultrahigh vacuum to ambient pressure of 20 mbar.The spectromicroscopy mode of HiPP-3 analyzer also enables detection of photoelectron spatial distribution with resolution of 2.8 ± 0.3 lm in one dimension. In addition,the designing strategies of systems that allow investigations in phenomena at gas–solid interface and liquid–solid interface will be highlighted through our discussion.

Fractal Description of the Solid/Liquid Interface of a Directionally Solidified Superalloy with Different Phosphorus Content

The solid/liquid interface of a directionally solidified Ni-base superalloy with different phosphorus contents was quantitatively described by means of fractat method.When the solidification rate was fixed,the relationship between the fractal dimensionality of the solid/liquid interface and the phos- phorus content of the test alloy was given.Combined the thermodynamics and fractal theory,the ef- fect mechanism of phosphorus content on fractal dimensionality of the solid/liquid interface was discussed.

Effects of Ca(Y)-Si modifier on interface morphology and solute segregation during directional solidification of an austenite medium Mn steel

The austenite medium Mn steel modified with controlled additions of Ca, Y, Si were directionally solidified using the vertical Bridgman method to study the effects of Ca（Y）-Si modifier on the solid-liquid （S-L） interface morphology and solute segregation. The interface morphology and the C and Mn segregation of the steel directionally solidified at 6.9 μtrn/s were investigated with an image analysis and a scanning electron microscope equipped with energy dispersive X-ray analysis. The 0.5wt% Ca-Si modified steel is solidified with a planar S-L interface. The interface of the 1.0wt% Ca-Si modified steel is similar to that of the 0.5wt% Ca-Si modified steel, but with larger nodes. The 1.5wt% Ca-Si modified steel displays a cellular growth parttern. The S-L interface morphology of the 0.5wt% Ca-Si＋1.0wt% Y-Si modified Mn steel appears as dendritic interface, and primary austenite dendrites reveal developed lateral branching at the quenched liquid. In the meantime, the independent austenite colonies are formed ahead of the S-L interface. A mechanism involving constitutional supercooling explains the S-L interface evolution. It depends mainly on the difference in the contents of Ca, Y, and Si ahead of the S-L interface. The segregation of C and Mn ahead of the S-L interface enhanced by the modifiers is observed.

Role of temperature gradient in liquid/solid phase solution-diffusion bonding

The liquid-film solution-diffusion bonding of ZCuBe2.5 alloys was conducted using Cu-based alloy powders. The tensile strength of the joint is up to 318 MPa. With the increase of temperature gradient, the bonding time decreases and the interface migration velocity increases remarkably. The appropriate temperature gradient is 5-40 K/cm. Under fixed bonding time, the thickness of diffusion layer increases with the increase of temperature gradient, and this tendency becomes more remarkable with the prolonging of bonding time.

INTERACTION OF PARTICLES WITH A SOLIDIFIED INTERFACE DURING SOLIDIFICATION OF METAL MATRIX COMPOSITE REINFORCED WITH PARTICLES

The interaction of particles with a solid-liquid interface during solidification of metal matrix composites has been investigated theoretically in this paper.Owing to the presence of particles in the melt,the shape of the solidification front and solute concentration field in front of solidification interface have been disturbed The thermodynamic method was employed,and a mathematical expression of the shape of the solidification interface and solute concentration field were deduced.Meanwhile,a theory is developed for evaluation of critical velocities of particles pushed by the solidification interface.A numerical simulation is done in which the critical velocity is evaluated as a function of particle size,thermal conductivity,diffusion coefficient,temperature gradient at the solidification front,the solid-liquid interfacial energy and the melt viscosity.The critical velocity is shown to be closely linked to the shape of the solidification interface and solute concentration field, and hence all the parameters also affect the shape of the solidification interface and solute concentration field of the front.

Experimental determination of interfacial energies for Ag_2Al solid solution in the CuAl_2-Ag_2Al system

The equilibrated grain boundary groove shapes of solid solution Ag2Al in equilibrium with an AI-Cu-Ag liquid were observed from a quenched sample with a radial heat flow apparatus. The Gibbs Thomson coefficient, solid liquid interfacial energy and grain boundary energy of the solid solution Ag2Al have been determined from the observed grain boundary groove shapes. The thermal conductivity of the solid phase and the thermal conductivity ratio of the liquid phase to solid phase for Ag2Al-28.3 at the %CuAl2 alloy at the melting temperature have also been measured with a radial heat flow apparatus and Bridgman type growth apparatus, separately.

FRACTAL ANALYSES OF DIRECTIONAL SOLIDIFICATION BEHAVIOR OF A Ni-BASE SUPERALLOY

The morphology of solid/liquid interface of a directionally solidification process is described by means of fractal analysis,and the relations among the fractal dimension of the solid/liq- uid interface,solidification rate,dendrite arm space and the phosphorus content of the test al- loys have been given.It was found that the increase of the solidification rate and the phos- phorus content of the test alloy will lead to a increase,following the regularity of exponential function,in the fractal dimension of solid/liquid interface.Furthermore,by combining the fractal theory and the thermodynamic principle with the measured results,it has been proved that the fractal dimension is not only a kind of simple geometrical parameter used in des- cribing irregular geometry,but also a state function depending the change of solidification parameters and chemical compositions.

Numerical simulation of mold-temperature-control solidification

A finite element method(FEM) for the numerical simulation of the columnar part of the mould-temperature-control solidification(MTCS) process was presented. The latent heat was taken into account and 3D transient heat transfer analysis was carried out by using the developed FEM software. The relative errors between the numerical and experimental data are less than 6%. Three MTCS cases were computed with this method. The first case only opens the cooling channels in the bottom of the mold. The second case individually controls the separate 7 groups of cooling channels by giving 7 control points. When the temperature of a control point reaches the preset value of 400℃, the corresponding channel will be opened. The third case opens all the cooling channels at the same time. The results indicate that in the second case, the solid-liquid interface keeps near-planar. The growth velocity of the solid-liquid interface is 0.3-0.4 mm/s, which is greater than 0.1-0.3 mm/s of the first case, performing better than the others. Thus the forming quality and efficiency part interior can be improved by mold-temperature-control and the numerical model is validated. The numerical simulation of MTCS can provide an available tool for the advanced investigation on the defect improvement and the crystal’s quality.

Effect of cold-rolling and annealing on interfacial structures and properties of A500/steel bimetal strip

The effect of cold-rolling, by both a series of small passes and single-pass with different deformations as well as the subsequent annealing, on the interfacial structures and properties of A500（AlSn8Pb2Si2.5Cu0.8Cr0.2）/steel bimetal strip produced by liquid-solid roll cladding was investigated. Experimental results of the cold-rolling by a series of small passes show that the interfacial bonding strength increases slightly when the total deformation is less than 7.32% and then decreases gradually with the increase in deformation. Subsequent annealing has no effect on the interfacial structures and properties. The effect of cold-rolling by single-pass less than 33.2% deformation on the interfacial structures and properties is the same as that of multi-pass cold-rolling, whereas cold-rolling by single-pass more than 33.2% deformation followed by annealing at 350℃ for 2.5h can make the interfacial bonding strength increase to a great extent. Metallographic examination of the interface shows that there exist only transverse cracks within the interfacial layer and the clad strip does not split along the interface during cold-rolling if the thickness of interfacial layer is less than 45μm. The thick interfacial layer（>56μm）, however, crumbles during cold-rolling, thus resulting in the splitting of the clad strip.

液态亚共晶Al-4.5%Si合金中定向枝晶生长与组织调控

采用高温端上升式Bridgman定向凝固实验技术,在0.1~100μm/s跨三量级宽速域生长条件下,系统研究亚共晶Al-4.5%Si合金的组织形态演变机制,实现从平面晶到胞晶再到枝晶的全过程组织调控。当液相温度梯度保持200 K/cm恒定时,发现固液界面失稳的临界生长速度为0.43μm/s,而发生胞枝晶转变的生长速度阈值是3.3μm/s。理论计算揭示出组成过冷(Composition supercooling,CS)区分布范围是2.6~10mm,相应的最大过冷度为2~193.8 K,而实际糊状区长度在2.8~6.2 mm区间变化。实验结果表明,定向枝晶生长模型Kurz-Giovanola-Trivedi(KGT)能够合理预测初生α(Al)枝晶顶端半径、顶端温度和顶端成分,而Hunt一次枝晶间距模型和Kurz-Fisher二次分枝间距模型均与实测结果相一致。初生α(Al)枝晶间的(α(Al)+Si)共晶生长机制定性地符合Jackson-Hunt(JH)经典共晶生长理论。

The effect of interfacial energy anisotropy on planar interface instability in a succinonitrile alloy under a small temperature gradient

The morphological stability of a planar interface with different crystallographic orientations is studied under a small positive temperature gradient using a transparent model alloy of succinonitrile. Novel experimental apparatus is constructed to provide a temperature gradient of about 0.37 K/mm. Under this small temperature gradient, the planar interface instability depends largely on the crystallographic orientation. It is shown experimentally that the effect of interfacial energy anisotropy on planar interface stability cannot be neglected even in a small temperature gradient system. Higher interfacial energy anisotropy leads the planar interface to become more unstable, which is different from the stabilizing effect of the interfacial energy on the planar interface. The experimental results are in agreement with previous theoretical calculations and phase field simulations.