Analysis of Si/GaAs Bonding Stresses with the Finite Element Method

In conjunction with ANSYS,we use the finite element method to analyze the bonding stresses of Si/ GaAs. We also apply a numerical model to investigate a contour map and the distribution of normal stress,shearing stress, and peeling stress, taking into full consideration the thermal expansion coefficient as a function of temperature. Novel bonding structures are proposed for reducing the effect of thermal stress as compared with conventional structures. Calculations show the validity of this new structure.

Numerical Study on the Stress–Strain Cycle of Thermal Self-Compressing Bonding

Thermal self-compressing bonding(TSCB) is a new solid-state bonding method pioneered by the authors. With electron beam as the non-melted heat source, previous experimental study performed on titanium alloys has proved the feasibility of TSCB. However, the thermal stress–strain process during bonding, which is of very important significance in revealing the mechanism of TSCB, was not analysed. In this paper, finite element analysis method is adopted to numerically study the thermal elasto-plastic stress–strain cycle of thermal self-compressing bonding. It is found that due to the localized heating, a non-uniform temperature distribution is formed during bonding, with the highest temperature existed on the bond interface. The expansion of high temperature materials adjacent to the bond interface are restrained by surrounding cool materials and rigid restraints, and thus an internal elasto-plastic stress–strain field is developed by itself which makes the bond interface subjected to thermal compressive action. This thermal self-compressing action combined with the high temperature on the bond interface promotes the atom diffusion across the bond interface to produce solid-state joints. Due to the relatively large plastic deformation, rigid restraint TSCB obtains sound joints in relatively short time compared to diffusion bonding.

The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading

This paper studies the dynamic stress intensity factor （DSIF） at the interface in an adhesive joint under shear loading. Material damage is considered. By introducing the dislocation density function and using the integral transform, the problem is reduced to algebraic equations and can be solved with the collocation dots method in the Laplace domain. Time response of DSIF is calculated with the inverse Laplace integral transform. The results show that the mode Ⅱ DSIF increases with the shear relaxation parameter, shear module and Poisson ratio, while decreases with the swell relaxation parameter. Damage shielding only occurs at the initial stage of crack propagation. The singular index of crack tip is -0.5 and independent on the material parameters, damage conditions of materials, and time. The oscillatory index is controlled by viscoelastic material parameters.

Numerical simulation of stress distribution in Al_2O_3-TiC/Q235 diffusion bonded joints

The distributions of the axial stress and shear stress in Al2O3-TiC/Q235 diffusion bonded joints were studied using finite element method （FEM）. The effect of interlayer thickness on the axial stress and shear stress was also investigated. The results indicate that the gradients of the axial stress and shear stress are great near the joint edge. The maximal shear stress produces at the interface of the Al2O3-TIC and Ti interlayer. With the increase of Cu interlayer thickness, the magnitudes of the axial stress and shear stress first decrease and then increase. The distribution of the axial stress changes greatly with a little change in the shear stress. The shear fracture initiates at the interface of the Al2O3-TiC/ Ti interlayer with high shear stress and then propagates to the Al2O3-TIC side, which is consistent with the stress FEM calculating results.

FEM simulation on residual stress distribution during diffusion bonding between Ti （ C, N） metallic ceramic/interlayer/40Cr steel

Based on ANSYS FEM software, the distribution of residual stress in the diffusion bonding joints between Ti（ C,N） metallic ceramic/interlayer/4OCr steel was calculated and experimentally ver^ed. The results showed that the trend on the distribution of residual stress field in the joints was not changed with the use of interlayer. The maximum residual stress was always located in metallic ceramic with area ranging from 1 mm to 4 mm to the interlayer. The maximum residual stress in the joints was also affected by diffusion temperature. The satellite pulse current during the initial stage on diffusion bonding can promote the formation of liquid film at the interface, by which diffusion temperature and loading pressure can be greatly decreased. The crack initiation was easily produced at the corner of Ti （ C, N） metallic ceramic close to the interlayer. If a higher residual stress produced in the joints, the crack was propagated into the whole ceramic.

Bonding stress—slip constitutive behavior between bars and grout concrete

To establish bonding stress—slip constitutive model between bars and grout concrete,13 test specimens were employed to study the bonding behavior and the force transfer of bars adhered to grout concrete. The bonding stress development of bars adhered to grout concrete was analyzed. The local bonding stress—slip curve was obtained. Based on the test results,a new bonding stress— slip constitutive model between bars and grout concrete was proposed. The results show that the maximum bonding stress is not influenced by the bar bond length,but it is strengthened when the splitting strength of grout concrete is increased. The model matches the experimental results well,and the regressing coefficient equals 1.7.

Stress Variation Model of Bond Stress-Slip Relationship Between Steel Bar and Concrete

-Based on the experimental data, a stress variation model of the bond stress-slip relationship between steel bar and concrete is established. The characteristic of the model is that the boundary conditions are satisfied very well; the effects of the material properties, the concrete cover, the crack spacing and the distance from the cracked cross section are considered. Good agreement between measured and calculated bond stress-slip relationship is found. This model is useful for the study of the stiffness, deformation and crack width of reinforced concrete members, and for the nonlinear analysis of reinforced concrete structures by the finite element method.

Residual Stress and Deformation Analysis of Static Bonding Multi-layer Pyrex7740 Glass and Aluminum

Residual stresses and deformation of static bonding multi-layer Pyrex7740 glass and aluminum have important effects on performances of bonding parts. The stress and strain finite element analysis of anodic bonding can optimize the structure and process design, reduce the workload of the experiments, shorten the production cycle, improve the bonding quality, and reduce the process costs. In this paper, residual stresses and deformation in the static bonding two-layer （glass/aluminum）, three-layer （glass/aluminum/ glass）,five-layer（glass/aluminum/glass/aluminum/glass）and seven-layer （glass/aluminum/glass/aluminum/glass/ aluminum/glass） samples have been analyzed using nonlinear finite element simulation software MARC. The simulation results show that the shear stress distribution and deformation distribution in different multi-layer glass and aluminum samples are similar. The stress distribution along thickness at different typical positions in all multi-layer samples has characteristics of pulse pattern, which has pulse peak at the position of transition layers and then decreases abruptly to the minimum value at the positions of glass and aluminum. The maximum shear stress is located in the outside surface area in the transition layer between the top unconstrained glass layer and aluminum layer. The displacement distribution along thickness in all multi-layer samples increases gradually fi＇om the constrained bottom glass layer to the top unconstrained glass layer with abrupt step increase in the aluminum layers, The maximum deformations occur in aluminum layers. It is found that the minimum deformation distortion and the minimum shear stress occur in the three-layer static bonding sample.

Stress distribution at diffusion-bonded interface of Fe_3Al with Cr18-Ni8 steel

Fe3Al and Crl8-Ni8 steel were bonded in vacuum and an interface was formed between Fe3Al and Crl8-Ni8 steel. Stress distribution at the diffusion-bonded interface was researched by numerical simulation and finite element method （FEM）. The results indicated that the peak stress appeared at the interface near Cr18-Ni8 steel side. This is the key factor to induce crack at this position. With the enhancement of heating temperature, the peak stress at the bonded interface increases. When the temperature is 1 100 22, the peak stress is up to 65.9 MPa, which is bigger than that at 1 000 22 by 9. 4%. In addition, the peak stress becomes bigger with the increase of the thickness of base metal from 1 mm to 8 ram. While the thickness is more than 8 ram, the peak stress varies slightly with the change of the thickness.

Micro thermal shear stress sensor based on vacuum anodic bonding and bulk-micromachining

This paper describes a micro thermal shear stress sensor with a cavity underneath, based on vacuum anodic bonding and bulk micromachined technology. A Ti/Pt alloy strip, 2μm×100μm, is deposited on the top of a thin silicon nitride diaphragm and functioned as the thermal sensor element. By using vacuum anodic bonding and bulk-si anisotropic wet etching process instead of the sacrificial-layer technique, a cavity, functioned as the adiabatic vacuum chamber, 200μm×200μm×400μm, is placed between the silicon nitride diaphragm and glass （Corning 7740）. This method totally avoid adhesion problem which is a major issue of the sacrificial-layer technique.

X-Ray Measurement of Residual Stress in Plastic Bonded Explosives

The X-ray diffractive technology was adopted for tentative study of plastic bonded explosive.The datum of some new diffractive peaks in standard PDF cards were added.The effects of strain to interplanar distance and crystal size of the explosive were studied.The results show that grain size of plastic bonded explosive is decreasing with the increasing of the pressure,and the residual stress of the explosive is draw stress.

Hybrid bonding of GaAs and Si wafers at low temperature by Ar plasma activation

High-quality bonding of 4-inch GaAs and Si is achieved using plasma-activated bonding technology.The influence of Ar plasma activation on surface morphology is discussed.When the annealing temperature is 300℃,the bonding strength reaches a maximum of 6.2 MPa.In addition,a thermal stress model for GaAs/Si wafers is established based on finite element analysis to obtain the distribution of equivalent stress and deformation variables at different temperatures.The shape varia-tion of the wafer is directly proportional to the annealing temperature.At an annealing temperature of 400℃,the maximum protrusion of 4 inches GaAs/Si wafers is 3.6 mm.The interface of GaAs/Si wafers is observed to be dense and defect-free using a transmission electron microscope.The characterization of interface elements by X-ray energy dispersion spectroscopy indi-cates that the elements at the interface undergo mutual diffusion,which is beneficial for improving the bonding strength of the interface.There is an amorphous transition layer with a thickness of about 5 nm at the bonding interface.The preparation of Si-based GaAs heterojunctions can enrich the types of materials required for the development of integrated circuits,improve the performance of materials and devices,and promote the development of microelectronics technology.

Numerical Study on the Mechanical Behavior of Hydraulic Fractures under Stress Disturbance,based on a Multi Pb-GBM Method

Water inrush is a common disaster in submarine mining.The key to preventing this disaster is to restrict the water-conducting fissure propagation induced by mining from forming a flow channel to communicate with the overlying aquifer.The mechanical behavior of hydraulic fractures under stress disturbance lies at the heart of the problem.Hence,the multiple parallel bond-grain-based model(multi Pb-GBM)is introduced to explore the hydraulic fracture evolution law of crystalline granite under the influence of stress disturbance.The results show that:hydraulic fracturing under stress disturbance is clearly affected by the stress wave frequency;the higher the frequency is,the more difficult it is to crack,but the crack propagation speed is faster after crack initiation;the propagation direction of a crack is deflected towards the propagation direction of the stress wave and the crack dip angle is controlled by the maximum principal stress;the internal crystal boundary of the same mineral is the most stable one among the three contacts,the contact boundary between different minerals being the most fragile one.This research not only has a practical application value to seabed mining engineering,but also has important theoretical significance in enriching deep rock mechanics theory.

BOND PERFORMANCE EXPERIMENT FOR FLY ASH CONCRETE AND STEEL BAR

The impact of fly ash content on bond performance of steel bars and their surrounding concrete is studied by means of sticking strain gauges on steel bars. The average bond stress-slip curves, the steel strain-anchor location curves, and the bond stress-anchor position curves of the pullout specimens with various fly ash contents are obtained. Results indicate that the bond performance of concrete and steel bars can be improved and the distribution of steel strain along the anchorage length tends to be more uniform by adding fly ash in concrete specimens, and both ultimate bond stress and ultimate slip deformation increase the most when 20% of specimens′ content is fly ash.

Effect of annealing temperature on joints of diffusion bonded Mg/Al alloys

To study the effect of annealing temperature on the joints between magnesium and aluminum alloys, and improve the properties of bonding layers, composite plates of magnesium alloy（AZ31 B） and aluminum alloy（6061） were welded using the vacuum diffusion bonding method. The composite specimens were continuously annealed in an electrical furnace under the protection of argon gas. The microstructures were then observed using scanning electron microscopy. X-ray diffractometry was used to investigate the residual stresses in the specimens. The elemental distribution was analyzed with an electron probe micro analyzer. The tensile strength and hardness were also measured. Results show that the diffusion layers become wide as the heat treatment temperature increases, and the residual stress of the specimen is at a minimum and tensile strength is the largest when being annealed at 250 ℃. Therefore, 250 ℃ is the most appropriate annealing temperature.

Microstructures and properties of transient liquid phase diffusion bonded joints of Ni_3Al-base superalloy

An investigation of transient liquid phase (TLP) diffusion bonding of a Ni 3Al base directionally solidified superalloy, IC6 alloy, was presented. The interlayer alloy employed was Ni Mo Cr B powder alloy. The results show that the microstructure of the TLP diffusion bonded joints is a combination of γ solid solution (or a γ+γ′ structure) and borides. With the bonding time increasing, the quantity of the borides both in bonding seam and adjacent zones is gradually reduced, and the joint stress rupture property is improved. The obtained stress rupture property of the TLP bonded joints is on a level with the transverse property of IC6 base materials. [

Mechanism of microweld formation and breakage during Cu-Cu wire bonding investigated by molecular dynamics simulation

Currently,wire bonding is the most popular first-level interconnection technology used between the die and package terminals,but even with its long-term and excessive usage,the mechanism of wire bonding has not been completely evaluated.Therefore,fundamental research is still needed.In this study,the mechanism of microweld formation and breakage during Cu-Cu wire bonding was investigated by using molecular dynamics simulation.The contact model for the nanoindentation process between the wire and substrate was developed to simulate the contact process of the Cu wire and Cu substrate.Elastic contact and plastic instability were investigated through the loading and unloading processes.Moreover,the evolution of the indentation morphology and distributions of the atomic stress were also investigated.It was shown that the loading and unloading curves do not coincide,and the unloading curve exhibited hysteresis.For the substrate,in the loading process,the main force changed from attractive to repulsive.The maximum von Mises stress increased and shifted from the center toward the edge of the contact area.During the unloading process,the main force changed from repulsive to attractive.The Mises stress reduced first and then increased.Stress concentration occurs around dislocations in the middle area of the Cu wire.

Full-scale pullout tests of rock anchors in a limestone quarry focusing on bond failure at the anchor-grout and grout-rock interfaces

Rock anchors are a common safety measure for stabilising large-scale infrastructure,such as bridge towers,retaining walls,rock slopes and windmills.There are four principal failure modes for rock anchors:(a)tensile failure of the steel anchor,(b)anchor-grout interface failure,(c)grout-rock interface failure,and(d)rock mass uplift.Field tests were performed in a limestone quarry.These tests were designed to test failure modes B and C through pullout.In the tests of failure mode B,the shear stress on the anchor-grout interface is the largest at the top of the grout column and attenuates towards the distal end for small loads.The shear stress becomes uniformly distributed when the applied load is approximately 50%of the ultimate pullout load.The anchors designed to test failure mode C were installed with an endplate and had a higher toughness than the straight bar anchors.The shear stress on the grout-rock interface is the largest at the endplate and attenuates upward before slip starts along the interface.When the ultimate pullout load is reached,and the grout column starts to slip,the shear stress is approximately constant.The bond shear strength on the anchor-grout interface was approximately 20%of the uniaxial compressive strength of the grout,and the bond strength of the grout-rock interface was around 5%for that of the grout.The grout-rock interface is likely determined by whichever is weaker,the grout or the rock.

Stresses induced by post-tensioned anchor in jointed rock mass

A new analytical study on stresses around a post-tensioned anchor in rocks with two perpendicular joint sets is presented. The assumptions of orthotropic elastic rock with plane strain conditions are made in derivation of the formulations. A tri-linear bond-slip constitutive law is used for modeling the tendon-grout interface behavior and debonding of this interface. The bearing plate width is also considered in the analysis. The obtained solutions are in the integral forms and numerical techniques that have been used for evaluation. In the illustrative example given, the major principal stress is compressive in the anchor free zone and compressive stress concentrations of 815 k Pa and 727 k Pa(for the anchor load of 300 k N) are observed under the bearing plate and the bond length proximal end, respectively. However, large values of tensile stresses with the maximum of-434 k Pa are formed at the bond length distal end. The results obtained using the proposed solution are compared very those of numerical method(FEM).

Transient liquid phase diffusion bonding of a single crystal superalloy DD6

DD6 alloy was bonded by transient liquid phase (TLP) diffusion bonding. The main compositions of the interlayer alloy employed were similar to those of the base metal, DD6, and a certain amount of element B was added as the melting point depressant. The results show that it is difficult to obtain the joints with the microstructures completely homogeneous. For the joint TLP diffusion bonded at 1290℃ for 12h, about half areas of the beam possessed a γ+γ′ microstructure, nearly identical with that of the base metal, and the other local areas consisted of γ-solution, borides, etc. Prolonging the bonding time to 24h, the inhomogeneous areas in the joint reduced, and the joint property improved. The joint stress-rupture strength at 980℃ and 1100℃ reached 90%-100% and 70%-80% of those of the base metal respectively.