To explore the complex thermal-mechanical-chemical behavior in the solid-liquid cast-roll bonding(SLCRB) of Cu/Al cladding strip, numerical simulations were conducted from both macro and micro scales. In macro-scale, ...To explore the complex thermal-mechanical-chemical behavior in the solid-liquid cast-roll bonding(SLCRB) of Cu/Al cladding strip, numerical simulations were conducted from both macro and micro scales. In macro-scale, with birth and death element method, a thermo-mechanical coupled finite element model(FEM) was set up to explore the temperature and contact pressure distribution at the Cu/Al bonding interface in the SLCRB process. Taking these macro-scale simulation results as boundary conditions, we simulated the atom diffusion law of the bonding interface by molecular dynamics(MD) in micro-scale. The results indicate that the temperature in Cu/Al bonding interface deceases from 700 to 320 ℃ from the entrance to the exit of caster, and the peak of contact pressure reaches up to 140 MPa. The interfacial diffusion thickness depends on temperature and rolling reduction, higher temperature results in larger thickness, and the rolling reduction below kiss point leads to significant elongation deformation of cladding strip which yields more newborn interface with fresh metal and make the diffusion layer thinner. The surface roughness of Cu strip was found to be benefit to atoms diffusion in the Cu/Al bonding interface. Meanwhile, combined with the SEM-EDS observation on the microstructure and composition in the bonding interface of the experimental samples acquired from the castrolling bite, it is revealed that the rolling reduction and severe elongation deformation in the solid-solid contact zone below kiss point guarantee the satisfactory metallurgical bonding with thin and smooth diffusion layer. The bonding mechanisms of reactive diffusion, mechanical interlocking and crack bonding are proved to coexist in the SLCRB process.展开更多
The interfacial status of the steel-aluminum solid to liquid bonding plates (their steel plate surfaces were or were not immersed in flux aqueous solution) were measured by using SEM (Scanning Electron Microscope) and...The interfacial status of the steel-aluminum solid to liquid bonding plates (their steel plate surfaces were or were not immersed in flux aqueous solution) were measured by using SEM (Scanning Electron Microscope) and X-ray diffraction . The results showed that the layer of flux (the minimum thickness was 15 μm on the steel plate surface) could protect the steel plate surface from oxidizing effectively at high temperature in solid to liquid bonding. The melt temperatUre of the flux should be lower than 580 ℃ so that it could be melted and removed completely. No. 1 flux (patent product made by the author) made up of halogeindes could also force liquid aluminum to infiltrate into steel plate surface and thus the interfacial shear strength of the bonding plate was rather large.展开更多
Artificial neural networks (ANN), being a sophisticated type of information processing system by imitating the neural system of human brain, can be used to investigate the effects of concentration of flux solution, te...Artificial neural networks (ANN), being a sophisticated type of information processing system by imitating the neural system of human brain, can be used to investigate the effects of concentration of flux solution, temperature of liquid aluminium, temperture of tools and pressure on thickness of the intermetallic layer at the interface between steel and aluminium under solid-liquid pressure bonding of steel and aluminium perfectly. The optimum thickness has been determined according to the value of the optimum shearing strength.展开更多
Studies were conducted on the interfacial microstructure of a steel/liquid aluminium and its evolution during the bonding rolling process. The effects of wetting time and deformation on the diffusion layer and on the ...Studies were conducted on the interfacial microstructure of a steel/liquid aluminium and its evolution during the bonding rolling process. The effects of wetting time and deformation on the diffusion layer and on the bonding strength were examined. By means of electron microscopy and electron probe analysis, it was found that the diffusion layer is mainly composed of FeAI3. For a steel temperature of 250℃ and an aluminium temperature of 850 ~C, the diffusion layer was formed within 3 s, and the shear strength of the samples increased after 8 to 14 s. Although the interface was not damaged, it was deformed notably. For an aluminium temperature of 750℃ and a wetting time of 11 to 17 s, the shear strength of the interface remained high, but the interface was obviously broken during rolling, leading to reduced bonding strength.展开更多
The liquid-film solution-diffusion bonding of ZCuBe2.5 alloys was conducted using Cu-based alloy powders. The tensile strength of the joint is up to 318 MPa. With the increase of temperature gradient, the bonding time...The liquid-film solution-diffusion bonding of ZCuBe2.5 alloys was conducted using Cu-based alloy powders. The tensile strength of the joint is up to 318 MPa. With the increase of temperature gradient, the bonding time decreases and the interface migration velocity increases remarkably. The appropriate temperature gradient is 5-40 K/cm. Under fixed bonding time, the thickness of diffusion layer increases with the increase of temperature gradient, and this tendency becomes more remarkable with the prolonging of bonding time.展开更多
Solid liquid state pressure bonding of Si 3N 4 ceramics with aluminum based alloys, which contain a small amount of intermetallic compounds Al 3Ti or Al 3Zr, was investigated. With this new method, the heat resistant ...Solid liquid state pressure bonding of Si 3N 4 ceramics with aluminum based alloys, which contain a small amount of intermetallic compounds Al 3Ti or Al 3Zr, was investigated. With this new method, the heat resistant properties of the bonding zone metal are improved, and the joints’ strengths at high temperature is increased. The joints’ shear strength at room temperature and at 600 ℃ reach 126～133 MPa and 32～34 MPa, respectively, with suitable bonding pressure. The reaction between aluminum and Si 3N 4 ceramics, which produces Al Si N O type compounds is the dominant interfacial reaction, while the reactions between the second active element Ti or Zr in the aluminum based alloys and Si 3N 4 ceramics also occur to some extend. [展开更多
The liquid/solid(L/S)interface of dissimilar metals is critical to the microstructure,mechanical strength,and structural integrity of interconnects in many important applications such as electronics,automotive,aeronau...The liquid/solid(L/S)interface of dissimilar metals is critical to the microstructure,mechanical strength,and structural integrity of interconnects in many important applications such as electronics,automotive,aeronautics,and astronautics,and therefore has drawn increasing research interests.To design preferential microstructure and optimize mechanical properties of the interconnects,it is crucial to understand the formation and growth mechanisms of diversified structures at the L/S interface during interconnecting.In situ synchrotron radiation or tube-generated X-ray radiography and tomography technologies make it possible to observe the evolution of the L/S interface directly and therefore have greatly propelled the research in this field.Here,we review the recent progress in understanding the L/S interface behaviors using advanced in situ X-ray imaging techniques with a particular focus on the following two issues:(1)interface behaviors in the solder joints for microelectronic packaging including the intermetallic compounds(IMCs)during refl ow,Sn dendrites,and IMCs during solidification and refl ow porosities and(2)growth characteristics and morphological transition of IMCs in the interconnect of dissimilar metals at high temperature.Furthermore,the main achievements and future research perspectives in terms of metallurgical bonding mechanisms under complex conditions with improved X-ray sources and detectors are remarked and discussed.展开更多
Solid-liquid state bonding of Si3N4 ceramics with TiN-modified Ag-Cu-Ti brazing alloy was used'- to enhance joint strength. The effects of the TiN particles on the microstructures, interfacial reactions, and roo...Solid-liquid state bonding of Si3N4 ceramics with TiN-modified Ag-Cu-Ti brazing alloy was used'- to enhance joint strength. The effects of the TiN particles on the microstructures, interfacial reactions, and room-temperature properties of the joints were investigated. The results show that the TiN particles are gen- erally well dispersed in the Ag-Cu eutectic base and the interface between them is both clean and com-pact. Changes in the TiN volume fractions from 0 to 20% exert no noticeable effect on the interfacial reac-tion between Ag-Cu-Ti and the substrates. Other bonding parameters being constant, the TiN volume frac-tion in the filler material plays a key role in the joint properties. For TiN volume fractions below 20%, the joints are reinforced, especially joints with 5% and 20% TiN. The average shearing strength of joints with 5% TiN is 200.8 MPa, 30% higher than that of joints with no TiN (154.1 MPa). However, for TiN volumes frac- tions above 20%, the joint strengths decrease.展开更多
基金Funded by the General Program of National Natural Science Foundation of China(Nos.51474189 and 51674222)the Excellent Youth Foundation of Hebei Scientific Committee,China(No.E2018203446)the Scientific Research Foundation of the Higher Education Institutions of Hebei Province,China(No.QN2015214)
文摘To explore the complex thermal-mechanical-chemical behavior in the solid-liquid cast-roll bonding(SLCRB) of Cu/Al cladding strip, numerical simulations were conducted from both macro and micro scales. In macro-scale, with birth and death element method, a thermo-mechanical coupled finite element model(FEM) was set up to explore the temperature and contact pressure distribution at the Cu/Al bonding interface in the SLCRB process. Taking these macro-scale simulation results as boundary conditions, we simulated the atom diffusion law of the bonding interface by molecular dynamics(MD) in micro-scale. The results indicate that the temperature in Cu/Al bonding interface deceases from 700 to 320 ℃ from the entrance to the exit of caster, and the peak of contact pressure reaches up to 140 MPa. The interfacial diffusion thickness depends on temperature and rolling reduction, higher temperature results in larger thickness, and the rolling reduction below kiss point leads to significant elongation deformation of cladding strip which yields more newborn interface with fresh metal and make the diffusion layer thinner. The surface roughness of Cu strip was found to be benefit to atoms diffusion in the Cu/Al bonding interface. Meanwhile, combined with the SEM-EDS observation on the microstructure and composition in the bonding interface of the experimental samples acquired from the castrolling bite, it is revealed that the rolling reduction and severe elongation deformation in the solid-solid contact zone below kiss point guarantee the satisfactory metallurgical bonding with thin and smooth diffusion layer. The bonding mechanisms of reactive diffusion, mechanical interlocking and crack bonding are proved to coexist in the SLCRB process.
文摘The interfacial status of the steel-aluminum solid to liquid bonding plates (their steel plate surfaces were or were not immersed in flux aqueous solution) were measured by using SEM (Scanning Electron Microscope) and X-ray diffraction . The results showed that the layer of flux (the minimum thickness was 15 μm on the steel plate surface) could protect the steel plate surface from oxidizing effectively at high temperature in solid to liquid bonding. The melt temperatUre of the flux should be lower than 580 ℃ so that it could be melted and removed completely. No. 1 flux (patent product made by the author) made up of halogeindes could also force liquid aluminum to infiltrate into steel plate surface and thus the interfacial shear strength of the bonding plate was rather large.
文摘Artificial neural networks (ANN), being a sophisticated type of information processing system by imitating the neural system of human brain, can be used to investigate the effects of concentration of flux solution, temperature of liquid aluminium, temperture of tools and pressure on thickness of the intermetallic layer at the interface between steel and aluminium under solid-liquid pressure bonding of steel and aluminium perfectly. The optimum thickness has been determined according to the value of the optimum shearing strength.
文摘Studies were conducted on the interfacial microstructure of a steel/liquid aluminium and its evolution during the bonding rolling process. The effects of wetting time and deformation on the diffusion layer and on the bonding strength were examined. By means of electron microscopy and electron probe analysis, it was found that the diffusion layer is mainly composed of FeAI3. For a steel temperature of 250℃ and an aluminium temperature of 850 ~C, the diffusion layer was formed within 3 s, and the shear strength of the samples increased after 8 to 14 s. Although the interface was not damaged, it was deformed notably. For an aluminium temperature of 750℃ and a wetting time of 11 to 17 s, the shear strength of the interface remained high, but the interface was obviously broken during rolling, leading to reduced bonding strength.
文摘The liquid-film solution-diffusion bonding of ZCuBe2.5 alloys was conducted using Cu-based alloy powders. The tensile strength of the joint is up to 318 MPa. With the increase of temperature gradient, the bonding time decreases and the interface migration velocity increases remarkably. The appropriate temperature gradient is 5-40 K/cm. Under fixed bonding time, the thickness of diffusion layer increases with the increase of temperature gradient, and this tendency becomes more remarkable with the prolonging of bonding time.
文摘Solid liquid state pressure bonding of Si 3N 4 ceramics with aluminum based alloys, which contain a small amount of intermetallic compounds Al 3Ti or Al 3Zr, was investigated. With this new method, the heat resistant properties of the bonding zone metal are improved, and the joints’ strengths at high temperature is increased. The joints’ shear strength at room temperature and at 600 ℃ reach 126～133 MPa and 32～34 MPa, respectively, with suitable bonding pressure. The reaction between aluminum and Si 3N 4 ceramics, which produces Al Si N O type compounds is the dominant interfacial reaction, while the reactions between the second active element Ti or Zr in the aluminum based alloys and Si 3N 4 ceramics also occur to some extend. [
基金supported by the National Key Research and Development Program(Nos.2017YFA0403800 and 2017YFB0305301)the National Natural Science Foundation of ChinaExcellent Young Scholars(No.51922068)+1 种基金the National Natural Science Foundation of China(Nos.51727802,51821001 and 51904187)funded by China Postdoctoral Science Foundation(No.2019M661500)。
文摘The liquid/solid(L/S)interface of dissimilar metals is critical to the microstructure,mechanical strength,and structural integrity of interconnects in many important applications such as electronics,automotive,aeronautics,and astronautics,and therefore has drawn increasing research interests.To design preferential microstructure and optimize mechanical properties of the interconnects,it is crucial to understand the formation and growth mechanisms of diversified structures at the L/S interface during interconnecting.In situ synchrotron radiation or tube-generated X-ray radiography and tomography technologies make it possible to observe the evolution of the L/S interface directly and therefore have greatly propelled the research in this field.Here,we review the recent progress in understanding the L/S interface behaviors using advanced in situ X-ray imaging techniques with a particular focus on the following two issues:(1)interface behaviors in the solder joints for microelectronic packaging including the intermetallic compounds(IMCs)during refl ow,Sn dendrites,and IMCs during solidification and refl ow porosities and(2)growth characteristics and morphological transition of IMCs in the interconnect of dissimilar metals at high temperature.Furthermore,the main achievements and future research perspectives in terms of metallurgical bonding mechanisms under complex conditions with improved X-ray sources and detectors are remarked and discussed.
基金Supported by the National Natural Science Foundation of China (No. 50075046)
文摘Solid-liquid state bonding of Si3N4 ceramics with TiN-modified Ag-Cu-Ti brazing alloy was used'- to enhance joint strength. The effects of the TiN particles on the microstructures, interfacial reactions, and room-temperature properties of the joints were investigated. The results show that the TiN particles are gen- erally well dispersed in the Ag-Cu eutectic base and the interface between them is both clean and com-pact. Changes in the TiN volume fractions from 0 to 20% exert no noticeable effect on the interfacial reac-tion between Ag-Cu-Ti and the substrates. Other bonding parameters being constant, the TiN volume frac-tion in the filler material plays a key role in the joint properties. For TiN volume fractions below 20%, the joints are reinforced, especially joints with 5% and 20% TiN. The average shearing strength of joints with 5% TiN is 200.8 MPa, 30% higher than that of joints with no TiN (154.1 MPa). However, for TiN volumes frac- tions above 20%, the joint strengths decrease.
