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Synthesis, structure, and properties of Ba9Co3Se(15) with one-dimensional spin chains
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作者 Lei Duan Xian-Cheng Wang +6 位作者 Jun Zhang Jian-Fa Zhao Li-Peng Cao Wen-Min Li Run-Ze Yu Zheng Deng Chang-Qing Jin 《Chinese Physics B》 SCIE EI CAS CSCD 2020年第3期330-334,共5页
A new compound with one-dimensional spin chains, Ba9Co3Se(15), was synthesized under high pressure and high temperature conditions and systematically characterized via structural, transport and magnetic measurements. ... A new compound with one-dimensional spin chains, Ba9Co3Se(15), was synthesized under high pressure and high temperature conditions and systematically characterized via structural, transport and magnetic measurements. Ba9Co3Se(15) crystallizes in a hexagonal structure with the space group P-6c2(No. 188) and lattice constants of a = b = 9.6765 ? and c = 18.9562 ?. The structure consists of trimeric face-sharing octahedral CoSe6 chains, which are arranged in a triangular lattice in the ab-plane and separated by Ba atoms. The distance of the nearest neighbor of CoSe6 chains is very large, given by the lattice constant a = 9.6765 ?. The Weiss temperature Tθ associated with the intra-chain coupling strength is about -346 K. However, no long-range magnetic order but a spin glass transition at ~ 3 K has been observed. Our results indicate that the spin glass behavior in Ba9Co3Se(15) mainly arises from the magnetic frustration due to the geometrically frustrated triangular lattice. 展开更多
关键词 onE-DIMENSIonAL CHAIN spin glass high-pressure
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Metal gate etch-back planarization technology
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作者 孟令款 殷华湘 +1 位作者 陈大鹏 叶甜春 《Journal of Semiconductors》 EI CAS CSCD 2012年第3期114-117,共4页
Planarization used in a gate-last CMOS device was successfully developed by particular technologies of SOG two-step plasma etch-back plus one special etch-back step for SOG/SiO_2 interface trimming.The within-the-wafe... Planarization used in a gate-last CMOS device was successfully developed by particular technologies of SOG two-step plasma etch-back plus one special etch-back step for SOG/SiO_2 interface trimming.The within-the-wafer ILD thickness non-uniformity can reach 4.19%with a wafer edge exclusion of 5 mm.SEM results indicated that there was little"dish effect"on the 0.4μm gate-stack structure and finally achieved a good planarization profile on the whole substrate.The technology provided a CMP-less process basis for sub-100 nm high-k/metal gate-last CMOS integration. 展开更多
关键词 metal gate plasma etch-back PLANARIZATIon spin on glass
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