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Semi-analytic Solution of Steady Temperature Fields During Thin Plate Welding
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作者 DAI Yao TAN Wei +1 位作者 SUN Qi SUN Chang-qing 《Chinese Journal of Aeronautics》 SCIE EI CAS CSCD 2006年第B12期248-251,共4页
Usually, it is very difficult to find out an analytical solution to thermal conduction problems during high temperature welding. Therefore, as an important numerical approach, the method of lines (MOLs) is introduce... Usually, it is very difficult to find out an analytical solution to thermal conduction problems during high temperature welding. Therefore, as an important numerical approach, the method of lines (MOLs) is introduced to solve the temperature field characterized by high gradients. The basic idea of the method is to semi-discretize the governing equation of the problem into a system of ordinary differential equations (ODEs) defined on discrete lines by means of the finite difference method, by which the thermal boundary condition with high gradients are directly embodied in formulation. Thus the temperature field can be obtained by solving the ODEs. As a numerical example, the variation of an axisymmetrical temperature field along the plate thickness can be obtained. 展开更多
关键词 steady temperature field method of lines thin plate welding semi-analytic solution high gradient
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