The mechanical properties of silica material in the monolithic form are ;far from acceptable levels. In this paper, 3D stitched quartz preform was used for the fiber reinforcement, and quartz fibers- reinforced silica...The mechanical properties of silica material in the monolithic form are ;far from acceptable levels. In this paper, 3D stitched quartz preform was used for the fiber reinforcement, and quartz fibers- reinforced silica composites were prepared by the silica sol-infiltration-sintering method. The density of the composite was up to 1.71 g/cm3 after 10 infiltration-sintering cycles. The flexural strength and the in-plane shear strength were 61.7 MPa and 20.3 MPa, respectively. The flexural stress-deflection curve exhibited mostly nonlinear behavior, which was different from that of monolithic ceramics. Because of the existence of the fiber in Z axis direction, shearing property between the different layers of 3D stitched composites were greatly enhanced. Toughness effect of the 3D stitched quartz preform was conspicuous. The as-fabricated composites showed non-catastronhic failure behavior resulting from weak fiber/matrix interface.展开更多
文摘The mechanical properties of silica material in the monolithic form are ;far from acceptable levels. In this paper, 3D stitched quartz preform was used for the fiber reinforcement, and quartz fibers- reinforced silica composites were prepared by the silica sol-infiltration-sintering method. The density of the composite was up to 1.71 g/cm3 after 10 infiltration-sintering cycles. The flexural strength and the in-plane shear strength were 61.7 MPa and 20.3 MPa, respectively. The flexural stress-deflection curve exhibited mostly nonlinear behavior, which was different from that of monolithic ceramics. Because of the existence of the fiber in Z axis direction, shearing property between the different layers of 3D stitched composites were greatly enhanced. Toughness effect of the 3D stitched quartz preform was conspicuous. The as-fabricated composites showed non-catastronhic failure behavior resulting from weak fiber/matrix interface.