Fabricating Buffer Layers for YBa_2Cu_3O_y Coated Conductor by Surface Oxidation Epitaxy

NiO buffer layers were formed on a tape of Ni for making YBCO coated conductor by surface-oxidation epitaxy （SOE） process. Different oxidizing conditions such as temperature and duration were studied for Ni tapes. It is found that the texture of NiO could be affected directly by the orientation and surface of substrate. X-ray diffraction （XRD） 2-2θ scan, φ-scan, and pole figure were employed to characterize the in-plane alignment and cube texture. X-ray φ-scan shows that NiO film is formed on Ni tape with high cube texture and a typical value at the full width at half maximum （FWHM） is ≤ 7.5°. Scanning electron microscopy was used to study the surface morphology of NiO films. No crack is found and the films appear dense. Such technique is simple and of low cost with perfect reproducibility, promising for developing long tapes.

Influence of epitaxial layer structure and cell structure on electrical performance of 6.5 kV SiC MOSFET

Silicon carbide(SiC)material features a wide bandgap and high critical breakdown field intensity.It also plays an important role in the high efficiency and miniaturization of power electronic equipment.It is an ideal choice for new power electronic devices,especially in smart grids and high-speed trains.In the medium and high voltage fields,SiC devices with a blocking voltage of more than 6.5 kV will have a wide range of applications.In this paper,we study the influence of epitaxial material properties on the static characteristics of 6.5 kV SiC MOSFET.6.5 kV SiC MOSFETs with different channel lengths and JFET region widths are manufactured on three wafers and analyzed.The FN tunneling of gate oxide,HTGB and HTRB tests are performed and provide data support for the industrialization process for medium/high voltage SiC MOSFETs.

Epitaxial Properties of Co-Doped ZnO Thin Films Grown by Plasma Assisted Molecular Beam Epitaxy

High quality Co-doped ZnO thin films are grown on single crystalline Al2O3（0001） and ZnO（0001） substrates by oxygen plasma assisted molecular beam epitaxy at a relatively lower substrate temperature of 450℃. The epitaxial conditions are examined with in-situ reflection high energy electron diffraction （RHEED） and ex-situ high resolution x-ray diffraction （HRXRD）. The epitaxial thin films are single crystal at film thickness smaller than 500nm and nominal concentration of Co dopant up to 20%. It is indicated that the Co cation is incorporated into the ZnO matrix as Co^2＋ substituting Zn^2＋ ions. Atomic force microscopy shows smooth surfaces with rms roughness of 1.9 nm. Room-temperature magnetization measurements reveal that the Co-doped ZnO thin films are ferromagnetic with Curie temperatures Tc above room temperature.

Raman Study of Defects in SI－GaAs and Se－doped Epitaxial Layer Irradiated by 10 MeV Electrons

Raman scattering measurements on Se-doped GaAs epitaxial layers and semi-insulating (SI) GaAs irradi-ated by 10 Mev electrons have been investigated. Several defect-related features were observed. We suggestthat the 220 cm ￣-1mode is attribute to As_1 which is associated, at least in part, with EL2 and EL12 defects.For Sedoped samples, the Raman peaks at 205 and 258 cm￣-1 may be due to vibrational modes in small clus-ters of arsenic, and the 77 and 185 ￣-1modes are probably associated with disorder-activated first order Ra-man scattering.Irradiated results show that the small clusters of arsenic and disorder state are increased with in-creasing irradiation fluences. Other Raman peaks will also be discussed in this paper.

Quantitative Evaluation of an Epitaxial Silicon-Germanium Layer on Silicon

An epitaxial SixGey layer on a silicon substrate was quantitatively evaluated using rocking curve (RC) and reciprocal space map (RSM) obtained by powder X-ray diffraction (XRD), energy-dispersive X-ray spectroscopy (EDS) in conjunction with transmission electron microscopy (TEM), and EDS in conjunction with scanning electron microscopy (SEM). To evaluate the relative deviation of the quantitative analysis results obtained by the RC, RSM, SEM/EDS, and TEM/EDS methods, a standard sample comprising a Si0.7602Ge0.2398 layer on a Si substrate was used. The correction factor (K-factor) for each technique was determined using multiple measurements. The average and standard deviation of the atomic fraction of Ge in the Si0.7602Ge0.2398 standard sample, as obtained by the RC, RSM, TEM/EDS, and SEM/EDS methods, were 0.2463 ± 0.0016, 0.2460 ± 0.0015, 0.2350 ± 0.0156, and 0.2433 ± 0.0059, respectively. The correction factors for the RC, RSM, TEM/EDS, and SEM/EDS methods were 0.9740, 0.9740, 1.0206, and 0.9856, respectively. The SixGey layer on a silicon substrate was quantitatively evaluated using the RC, RSM, and EDS/TEM methods. The atomic fraction of Ge in the epitaxial SixGey layer, as evaluated by the RC and RSM methods, was 0.1833 ± 0.0007, 0.1792 ± 0.0001, and 0.1631 ± 0.0105, respectively. After evaluating the results of the atomic fraction of Ge in the epitaxial layer, the error was very small, i.e., less than 3%. Thus, the RC, RSM, TEM/EDS, and SEM/EDS methods are suitable for evaluating the composition of Ge in epitaxial layers. However, the thickness of the epitaxial layer, whether the layer is strained or relaxed, and whether the area detected in the TEM and SEM analyses is consistent must be considered.

A new algorithm based on C-V characteristics to extract the epitaxy layer parameters for power devices with the consideration of termination

Doping concentration and thickness of an epitaxy layer are the most essential parameters for power devices.The conventional algorithm extracts these two parameters by calculating the doping profile from its capacitance-voltage(C-V)characteristics.Such an algorithm treats the device as a parallel-plane junction and ignores the influence of the terminations.The epitaxy layer doping concentration tends to be overestimated and the thickness underestimated.In order to obtain the epitaxy layer parameters with higher accuracy,a new algorithm applicable for devices with field limited ring(FLR)terminations is proposed in this paper.This new algorithm is also based on the C-V characteristics and considers the extension manner of the depletion region under the FLR termination.Such an extension manner depends on the design parameters of the FLR termination and is studied in detail by simulation and modeling.The analytical expressions of the device C-V characteristics and the effective doping profile are derived.More accurate epitaxy layer parameters can be extracted by fitting the effective doping profile expression to the C-V doping profile calculated from the C-V characteristics.The relationship between the horizontal extension width and the vertical depth of the depletion region is also acquired.The credibility of the new algorithm is verified by experiments.The applicability of our new algorithm to FLR/field plate combining terminations is also discussed.Our new algorithm acts as a powerful tool for analyses and improvements of power devices.

Direct Structural Evidences of Epitaxial Growth Ge<SUB>1-X</SUB>Mn<SUB>X</SUB>Nanocolumn Bi-Layers on Ge(001)

Molecular Beam Epitaxy (MBE) system equipped with in-situ Reflection High-Energy Electron Diffraction (RHEED) has been used for (Ge, Mn) thin film growth and monitoring the surface morphology and crystal structure of thin films. Based on the observation of changes in RHEED patterns during nanocolumn growth, we used a real-time control approach to realize multilayer structures that consist of two nanocolumn layers separated by a Ge barrier layer. Transmission Electron Microscopy (TEM) has been used to investigate the structural properties of the GeMn nanocolumns and GeMn/Ge nanocolumns bi-layers samples.

中国电科11所碲镉汞薄膜材料制备技术进展

碲镉汞材料具有响应速度快、量子效率高、带隙连续可调等优点,广泛应用于红外探测领域,本文报道了近年来中国电科11所在碲镉汞薄膜材料制备方面的技术进展。在碲锌镉衬底材料制备方面,已突破Φ135mm碲锌镉晶体生长技术,碲锌镉衬底平均位错腐蚀坑密度(EPD)<1×10^(4)cm^(-2),具备了80mm×80mm规格碲锌镉衬底的批量生产能力。在液相外延碲镉汞薄膜制备方面,富碲水平液相外延碲镉汞薄膜平均位错腐蚀坑密度EPD<4×10^(4)cm^(-2),具备80mm×80mm规格碲镉汞薄膜的制备能力;富汞垂直液相外延实现高质量双层异质结碲镉汞薄膜材料批量化制备,该种材料的半峰宽(FWHM)控制在(20~40)arcsec范围内,碲镉汞薄膜厚度极差≤±06μm。在分子束外延碲镉汞薄膜方面,实现了6 in硅基碲镉汞材料制备,组分标准偏差≤00015,表面宏观缺陷密度≤100cm^(-2);碲锌镉基碲镉汞材料已具备50mm×50mm制备能力,组分标准偏差为0002,厚度标准偏差为0047μm。从探测器验证结果来看,基于富碲水平液相外延碲镉汞薄膜实现了1 k×1 k、2 k×2 k等规格红外焦平面探测器的工程化制备;采用双层异质结碲镉汞薄膜实现了高温工作、长波及甚长波探测器的制备;使用分子束外延制备的碲镉汞薄膜实现了27 k×27 k、54 k×54 k、8 k×8 k等规格红外焦平面探测器研制,在宇航领域有巨大的应用潜力。

等离子体增强原子层沉积AlN外延单晶GaN研究

氮化镓(GaN)作为第三代半导体材料,具有较大的禁带宽度,较高的击穿电场强度、电子迁移率、热导系数以及直接带隙等优异特性,被广泛应用于电子器件和光电子器件中。由于与衬底的失配问题,早期工艺制备GaN材料难以获得高质量单晶GaN薄膜。直到采用两步生长法,即先在衬底上低温生长氮化铝(AlN)成核层,再高温生长GaN,才极大地提高了GaN材料的质量。目前用于制备AlN成核层的方法有磁控溅射以及分子束外延等,为了进一步提高GaN晶体质量,本研究提出在两英寸c面蓝宝石衬底上使用等离子体增强原子层沉积(Plasma-enhanced Atomic Layer Deposition,PEALD)方法制备AlN成核层来外延GaN。相比于磁控溅射方法,PEALD方法制备AlN的晶体质量更好;相比于分子束外延方法,PEALD方法的工艺简单、成本低且产量大。沉积AlN的表征结果表明,AlN沉积速率为0.1 nm/cycle,并且AlN薄膜具有随其厚度变化而变化的岛状形貌。外延GaN表征结果表明,当沉积厚度为20.8 nm的AlN时,GaN外延层的表面最平整,均方根粗糙度为0.272 nm,同时具有最好的光学特性以及最低的位错密度。本研究提出了在PEALD制备的AlN上外延单晶GaN的新方法,沉积20.8 nm的AlN有利于外延高质量的GaN薄膜,可以用于制备高电子迁移率晶体管及发光二极管。

三结砷化镓太阳能电池外延层表面抛光技术研究

以空间用三结砷化镓(GaAs)电池外延表面抛光为研究对象,对抛光压力、抛光转速、抛光液pH等参数进行试验研究。研究结果表明:选用抛光压力40 g/cm^(3),采用55 r/min的转速,有效氯含量为5%的抛光液,对三结砷化镓太阳能电池外延表面有良好的抛光效果,可得到良好的表面颗粒度,即表面粗糙度小于0.4 nm、颗粒粒径大于0.2μm(含0.2/μm)的数量低于50个,颗粒粒径小于0.2μm的数量低于100个的外延片表面,为键合技术用于三结砷化镓太阳能电池的批量生产提供了可能。

Dielectric Response and Broadband Microwave Absorption Properties of Three-Layer Graded ZnO Nanowhisker/Polyester Composites

We design and prepare three-layer graded ZnO nanowhisker/polyester composites. The dispersion configuration of ZnO nanowhiskers in the polyester is investigated, and their microwave reflectivity curves are also measured. Experimental results have shown that the graded dispersion with ZnO nanowhiskers contributes to broadband microwave absorption. In other words, the absorption band depends on the graded dispersion configuration of ZnO nanowhiskers in polyester matrix.

Two Phases of Coherent Structure Motions in Turbulent Boundary Layer

Two phases of coherent structure motion are acquired after obtaining conditional phase-averaged waveforms for longitudinal velocity of coherent structures in turbulent boundary layer based on Harr wavelet transfer. The correspondences of the two phases to the two processes （i.e. ejection and sweep） during a burst are determined.

Boundary Layer on a Moving Wall with Suction and Injection

We investigate the boundary-layer flow on a moving permeable plate parallel to a moving stream. The governing equations are solved numerically by a finite-difference method. Dual solutions are found to exist when the plate and the free stream move in the opposite directions.

Boundary Layer Flow over a Continuously Moving Thin Needle in a Parallel Free Stream

We investigate the boundary-layer flow on a moving isothermal thin needle parallel to a moving stream. The governing equations are solved numerically by a finite-difference method. Dual solutions are found to exist when the needle and the free stream move in the opposite directions.

NONDESTRUCTIVE BAND-GAP PROFILE DETERMINATION OF HgCdTe LPE GROWN LAYERS

Infrared transmission and photoconductivity spectra of mercury cadmium telluride (MCT) epitaxial layers, grown by liquid phase epitaxy (LPE) on CdTe and CdZnTe wide band gap substrates, were investigated both theoretically and experimentally at temperatures T =82 K and T =300 K in the infrared (IR) wavelength region 3 15 μm. The photoresponse position of the diodes was determined at cryogenic temperatures from the transmission spectra of room temperature. Theoretical calculations of optical density D(h-ω), needed for analysis of experimental optical transmission data, were performed in the framework of WKB approximation.

Research on CeO2 cap layer for YBCO-coated conductor

Two groups of coated conductor samples with different thicknesses of CeO2 cap layers deposited by pulsed laser deposition （PLD） under the same conditions have been studied. Of them, one group is of CeO2 films, which are deposited on stainless steel （SS） tapes coated by IBAD-YSZ （IBAD-YSZ/SS）, and the other group is of CeO2/YSZ/Y2O3 multilayers, which are deposited on NiW substrates by PLD for the fabrication of YBCO-coated conductor through the RABiTS approach. YBCO film is then deposited on the tops of both types of buffer layers by PLD. The effects of the thickness of the CeO2 film on the texture of the CeO2 film and the critical current density （Jc） of the YBCO film are analysed. For the case of CeO2 film on IBAD-YSZ/SS, there appears a self-epitaxy effect with increasing thickness of the CeO2 film. For CeO2/YSZ/Y2O3/NiW, in which the buffer layers are deposited by PLD, there occurs no self-epitaxy effect, and the optimal thickness of CeO2 is about 50 nm. The surface morphologies of the two groups of samples are examined by SEM.

An Electroluminescence Delay Time Model of Bilayer Organic Light-Emitting Diodes

Based on the mechanism of injection, transport and recombination of the charge carriers, we develop a model to calculate the delay time of electroluminescence （EL） from bilayer organic light emitting diodes. The effect of injection, transport and recombination processes on the EL delay time is discussed, and the relationship between the internal interface barrier and the recombination time is revealed. ＂]~he results show that the EL delay time is dominated by the recombination process at lower applied voltage and by the transport process at higher applied voltage. When the internal interface barrier varies from 0.15 eV to 0.3 eV, the recombination delay time increases rapidly~ while the internal interface barrier exceeds about 0.3eV~ the dependence of the recombination delay time on applied voltage is almost undiversified, which may serve as a guideline for designing of a high-speed EL response device.

Study of a 4H-SiC epitaxial n-channel MOSFET

Epitaxial channel metal-oxide semiconductor field-effect transistors （MOSFETs） have been proposed as one possible way to avoid the problem of low inversion layers in traditional MOSFETs. This paper presents an equation of maximum depletion width modified which is more accurate than the original equation. A 4H--SiC epitaxial n-channel MOSFET using two-dimensional simulator ISE is simulated. Optimized structure would be realized based on the simulated results for increasing channel mobility.

Reduction of Dislocations in GaN Epilayer Grown on Si （111） Substrates using a GaN Intermedial Layer

GaN intermedial layers grown under different pressures are inserted between GaN epilayers and AIN/Si（111） substrates. In situ optical reflectivity measurements show that a transition from the three-dimensional （3D） mode to the 2I） one occurs during the GaN epilayer growth when a higher growth pressure is used during the preceding GaN intermedial layer growth, and an improvement of the crystalline quality of GaN epilayer will be made. Combining the in situ reflectivity and transmission electron microscopy （TEM） measurements, it is suggested that the lateral growth at the transition of growth mode is favourable for bending of dislocation lines, thus reducing the density of threading dislocations in the epilayer.