Analysis and Inverse Substructuring Computation on Dynamic Quality of Mechanical Assembly

Mechanical assembly has its own dynamic quality directly affecting the dynamic quality of whole product and should be considered in quality inspection and estimation of mechanical assembly. Based on functional relations between dynamic characteristics involved in mechanical assembly, the effects of assembling process on dynamic characteristics of substructural components of an assembly system are investigated by substructuring analysis. Assembly-coupling dynamic stiffness is clarified as the dominant factor of the effects and can be used as a quantitative measure of assembly dynamic quality. Two computational schemes using frequency response functions（FRFs） to determine the stiffness are provided and discussed by inverse substructuring analysis, including their applicable conditions and implementation procedure in application. Eigenvalue analysis on matrix-ratios of FRFs before and after assembling is employed and well validates the analytical outcomes and the schemes via both a lumped-parameter model and its analogic experimental counterpart. Applying the two schemes to inspect the dynamic quality provides the message of dynamic performance of the assembly system, and therefore improves conventional quality inspection and estimation of mechanical assembly in completeness.

Random Vibration Analysis of Electronic Equipment Based on the Substructure Method

To improve the computational efficiency in large-scale problems,the substructure method was proposed in the finite element analysis(FEA)of constructions,electronics devices,auto parts,etc.The effect of random vibration on an electronic chassis was analyzed by the substructure method via the ANSYS FEA.The basic principles of the substructure methods were briefly discussed,and then modeling and FEA,including model analysis and power spectral density(PSD)analysis,of the electronic chassis was conducted with substructure method via the ANSYS.Finally vibration experiment was done to verify the accuracy of FEA with substructure method,which proved that the substructure method,with adequate accuracy,could improve the computational efficiency for large-scale electronic chassis.Based on the stress distribution from FEA and experimental results,a comprehensive structural optimization was proposed.