The microstructure of surface peeling in finish rolled Cu-0.1Fe-0.03P sheetis analyzed by scanning electron microscope and energy dispersive spectroscope. Fe-rich areas ofdifferent contents are observed in the matrix....The microstructure of surface peeling in finish rolled Cu-0.1Fe-0.03P sheetis analyzed by scanning electron microscope and energy dispersive spectroscope. Fe-rich areas ofdifferent contents are observed in the matrix. The stress distributions and strain characteristicsat the interface between Cu matrix and Fe particle are studied by elastic-plastic finite elementplane strain model. Larger Fe particles and higher deforming extent of finish rolling are attributedto the intense stress gradient and significant non-homogeneity equivalent strain at the interfaceand accelerate surface peeling of Cu-0.1Fe-0.03P lead frame sheet.展开更多
Under the surface peeling of Cu- Fe- P lead frame alloy larger Fe particles were observed by energy dispersive spectroscopy. By using the large strain two-dinension plane strain model and elastic plastic finite elemen...Under the surface peeling of Cu- Fe- P lead frame alloy larger Fe particles were observed by energy dispersive spectroscopy. By using the large strain two-dinension plane strain model and elastic plastic finite element method, the cause for peeling damage of Cu-Fe-P lead frame aUoy was investigated. The results show that when the content of Fe particles is more than 30% at local Fe-rich area the intense stress coacentration in the Fe particle would make the Fe particle broken up. The high equivalent stress mutation and the mismatch of equivalent strain 10% at the two sides of intefrace make it easy to develop the crack and peeling damage on finish rolling. The larger Fe particles in the Cu-Fe-P alloy should be avoided.展开更多
Surface peeling of Cu-Fe-P lead frame alloy was analyzed using plane strain model and elastoplastic finite element method. Based on the characterization of microstructure at surface peeling in finish rolled Cu-Fe-P le...Surface peeling of Cu-Fe-P lead frame alloy was analyzed using plane strain model and elastoplastic finite element method. Based on the characterization of microstructure at surface peeling in finish rolled Cu-Fe-P lead frame alloy, the stress and strain distributions of the interface between Cu matrix and Fe particle are studied. Results indicate that the equivalent strain mismatch 6.9% between Cu matrix and Fe particle and the intense stress concentration at the interface have influence on surface peeling generation. The crack is prone to the electrical conductivity decreasing of Cu-Fe-P alloy and surface peeling on finish rolling.展开更多
基金This project is supported by 863 Program of China (N0.2002AA331112)Doctoral Foundation of Northwestern Polytechnical University.
文摘The microstructure of surface peeling in finish rolled Cu-0.1Fe-0.03P sheetis analyzed by scanning electron microscope and energy dispersive spectroscope. Fe-rich areas ofdifferent contents are observed in the matrix. The stress distributions and strain characteristicsat the interface between Cu matrix and Fe particle are studied by elastic-plastic finite elementplane strain model. Larger Fe particles and higher deforming extent of finish rolling are attributedto the intense stress gradient and significant non-homogeneity equivalent strain at the interfaceand accelerate surface peeling of Cu-0.1Fe-0.03P lead frame sheet.
基金Funded by the National "863" Plan of China ( No.2002AA331112) ,the Doctorate Foundation of Northwestern Poly-technical University,andthe Science Research Foundation of HenanUniversity of Science and Technology(No.2006ZY041)
文摘Under the surface peeling of Cu- Fe- P lead frame alloy larger Fe particles were observed by energy dispersive spectroscopy. By using the large strain two-dinension plane strain model and elastic plastic finite element method, the cause for peeling damage of Cu-Fe-P lead frame aUoy was investigated. The results show that when the content of Fe particles is more than 30% at local Fe-rich area the intense stress coacentration in the Fe particle would make the Fe particle broken up. The high equivalent stress mutation and the mismatch of equivalent strain 10% at the two sides of intefrace make it easy to develop the crack and peeling damage on finish rolling. The larger Fe particles in the Cu-Fe-P alloy should be avoided.
文摘Surface peeling of Cu-Fe-P lead frame alloy was analyzed using plane strain model and elastoplastic finite element method. Based on the characterization of microstructure at surface peeling in finish rolled Cu-Fe-P lead frame alloy, the stress and strain distributions of the interface between Cu matrix and Fe particle are studied. Results indicate that the equivalent strain mismatch 6.9% between Cu matrix and Fe particle and the intense stress concentration at the interface have influence on surface peeling generation. The crack is prone to the electrical conductivity decreasing of Cu-Fe-P alloy and surface peeling on finish rolling.
