A novel MEMS inductor consisting of a planar single crystalline silicon spiral with a copper surface coating as the conductor is presented. Using a silicon-glass anodic bonding and deep etching formation-and-release p...A novel MEMS inductor consisting of a planar single crystalline silicon spiral with a copper surface coating as the conductor is presented. Using a silicon-glass anodic bonding and deep etching formation-and-release process,a 40μm-thick silicon spiral is formed, which is suspended on a glass substrate to eliminate substrate loss. The surfaces of the silicon spiral are coated with highly conformal copper by electroless plating to reduce the resis- tive loss in the conductor,with thin nickel film plated on the surface of the copper layer for final surface passivation. The fabricated inductor exhibits a self-resonance frequency higher than 15GHz,with a quality factor of about 40 and an inductance of over 5nil at 11.3GHz. Simulations based on a compact equivalent circuit model of the inductor and parameter extraction using a characteristic-function approach are carried out,and good agreement with measurements is obtained.展开更多
Two different scalable models developed based on enhanced 1-πand 2-πtopologies are presented for onchip spiral inductor modeling.All elements used in the two topologies for accurately predicting the characteristics ...Two different scalable models developed based on enhanced 1-πand 2-πtopologies are presented for onchip spiral inductor modeling.All elements used in the two topologies for accurately predicting the characteristics of spiral inductors at radio frequencies are constructed in geometry-dependent equations for scalable modeling.Then a comparison between the 1-πand 2-πscalable models is made from the following aspects：the complexity of equivalent circuit models and parameter-extraction procedures,scalable rules and the accuracy of scalable models.The two scalable models are further verified by the excellent match between the measured and simulated results on extracted parameters up to self-resonant frequency（SRF） for a set of spiral inductors with different L,R and N,which are fabricated by employing 0.18-μm 1P6M RF CMOS technology.展开更多
文摘A novel MEMS inductor consisting of a planar single crystalline silicon spiral with a copper surface coating as the conductor is presented. Using a silicon-glass anodic bonding and deep etching formation-and-release process,a 40μm-thick silicon spiral is formed, which is suspended on a glass substrate to eliminate substrate loss. The surfaces of the silicon spiral are coated with highly conformal copper by electroless plating to reduce the resis- tive loss in the conductor,with thin nickel film plated on the surface of the copper layer for final surface passivation. The fabricated inductor exhibits a self-resonance frequency higher than 15GHz,with a quality factor of about 40 and an inductance of over 5nil at 11.3GHz. Simulations based on a compact equivalent circuit model of the inductor and parameter extraction using a characteristic-function approach are carried out,and good agreement with measurements is obtained.
基金supported by the Scientific and Technologic Cooperation Foundation of Yangtze River Delta Area of China(Nos.2008C16017, 08515810103)the Major Science and Technology Project of China(No.2009ZX02303-05).
文摘Two different scalable models developed based on enhanced 1-πand 2-πtopologies are presented for onchip spiral inductor modeling.All elements used in the two topologies for accurately predicting the characteristics of spiral inductors at radio frequencies are constructed in geometry-dependent equations for scalable modeling.Then a comparison between the 1-πand 2-πscalable models is made from the following aspects：the complexity of equivalent circuit models and parameter-extraction procedures,scalable rules and the accuracy of scalable models.The two scalable models are further verified by the excellent match between the measured and simulated results on extracted parameters up to self-resonant frequency（SRF） for a set of spiral inductors with different L,R and N,which are fabricated by employing 0.18-μm 1P6M RF CMOS technology.
