期刊文献+
共找到1篇文章
< 1 >
每页显示 20 50 100
Influence of drain and substrate bias on the TID effect for deep submicron technology devices
1
作者 黄辉祥 刘张李 +4 位作者 胡志远 张正选 陈明 毕大炜 邹世昌 《Journal of Semiconductors》 EI CAS CSCD 2012年第4期64-68,共5页
This paper presents a study of the total ionization effects of a 0.18 #m technology. The electrical para meters of NMOSFETs were monitored before and after irradiation with 6~Co at several dose levels under different ... This paper presents a study of the total ionization effects of a 0.18 #m technology. The electrical para meters of NMOSFETs were monitored before and after irradiation with 6~Co at several dose levels under different drain and substrate biases. Key parameters such as offstate leakage current and threshold voltage shift were studied to reflect the ionizing radiation tolerance, and explained using a parasitic transistors model. 3D device simulation was conducted to provide a better understanding of the dependence of device characteristics on drain and substrate biases. 展开更多
关键词 parasitic transistor swallow trench isolation total ionizing dose off-state leakage
原文传递
上一页 1 下一页 到第
使用帮助 返回顶部