Research on Switching Characteristics Based on Optimization Design of SiC MOSFET Drive Circuit

With the increasing emphasis on energy conservation,emission reduction and environmental protection,the application prospect of SiC power devices is becoming more and more broad.In the high frequency application of SiC MOSFET,the change rate of voltage and current in the turn-on and turn-off process increases with the increase of switching frequency.Also,the current and voltage spike oscillation phenomenon is gradually intensified due to the influence of circuit stray parameters.Based on the analysis of SiC MOSFET characteristics,the paper discusses the design requirements and design principles of SiC MOSFET drive circuit.Then,taking the SiC module C2M0080120D of Cree Company as an example,a driver circuit design is realized through the ACPL-355JC optocoupler driver module of Broadcom Company.The circuit not only has the characteristics of fast transmission delay and excellent performance,but also has the functions of overload and short circuit protection.The driving circuit is verified by LTspice simulation software,and the switching characteristics of SiC MOSFET under different working conditions are studied in depth.The experimental results show that the driving circuit can improve the switching time of SiC MOSFET and effectively solve the problem of current and voltage spike oscillation,which lays a foundation for the practical application of SiC MOSFET in the future.

Improvement of switching characteristics by substrate bias in AlGaN/AlN/GaN heterostructure field effect transistors

A simple and effective approach to improve the switching characteristics of AlGaN/AlN/GaN heterostructure field effect transistors （HFETs） by applying a voltage bias on the substrate is presented. With the increase of the substrate bias, the OFF-state drain current is much reduced and the ON-state current keeps constant. Both the ON/OFF current ratio and the subthreshold swing are demonstrated to be greatly improved. With the thinned substrate, the improvement of the switching characteristics with the substrate bias is found to be even greater. The above improvements of the switching characteristics are attributed to the interaction between the substrate bias induced electrical field and the bulk traps in the GaN buffer layer, which reduces the conductivity of the GaN buffer layer.

Improvement on Switching Characteristics and Switching Losses of IGBT by ZVS-PWM

Absrtact: The principle of ZVS - PWM inverting circuit is first described by means of inverting welder supply. The contrastive study is made on switching characte -ristics and switching losses of IGBT between ZVS - PWM and hard - switching.

Effects of Film Thickness and Ar/O2 Ratio on Resistive Switching Characteristics of HfOx-Based Resistive-Switching Random Access Memories

Cu/HfOx/n^＋Si devices are fabricated to investigate the influence of technological parameters including film thickness and Ar/02 ratio on the resistive switching （RS） characteristics of HfOx films, in terms of switch ratio, endurance properties, retention time and multilevel storage. It is revealed that the RS characteristics show strong dependence on technological parameters mainly by altering the defects （oxygen vacancies） in the film. The sample with thickness of 2Onto and Ar/O2 ratio of 12：3 exhibits the best RS behavior with the potential of multilevel storage. The conduction mechanism of all the films is interpreted based on the filamentary model.

The Theory of Composite and Switching Characteristics under Sampling Scheme-I

Using the new theoretical method managed by theory concerned with recurrent state and transient state obtains complete composite and switching characteristics of various kinds of sampling schemes, especially ISO 2859.

The Theory of Composite and Switching Characteristics under Sampling Scheme-Ⅱ

3.Composite and Switching Characteristics under ISO 2859 Sampling Scheme IS(1)Graphs of sampling program of IS.

Resistive switching properties of SnO_(2)nanowires fabricated by chemical vapor deposition

Resistive switching(RS)devices have great application prospects in the emerging memory field and neuromorphic field,but their stability and unclear RS mechanism limit their relevant applications.In this work,we construct a hydrogenated Au/SnO_(2)nanowire(NW)/Au device with two back-to-back Schottky diodes and investigate the RS characteristics in air and vacuum.We find that the Ion/Io ff ratio increases from 20 to 10^(4)when the read voltage decreases from 3.1 V to^(-1)V under the condition of electric field.Moreover,the rectification ratio can reach as high as 10^4owing to oxygen ion migration modulated by the electric field.The nanodevice also shows non-volatile resistive memory characteristic.The RS mechanism is clarified based on the changes of the Schottky barrier width and height at the interface of Au/SnO_(2)NW/Au device.Our results provide a strategy for designing high-performance memristive devices based on SnO_(2)NWs.

Electro-optical dual modulation on resistive switching behavior in BaTiO3/BiFeO3/TiO2 heterojunction

The novel BaTiO3/BiFeO3/TiO2 multilayer heterojunction is prepared on a fluorine-doped tinoxide(FTO) substrate by the sol–gel method. The results indicate that the Pt/Ba TiO3/BiFeO3/TiO2/FTO heterojunction exhibits stable bipolar resistive switching characteristic, good retention performance, and reversal characteristic. Under different pulse voltages and light fields, four stable resistance states can also be realized. The analysis shows that the main conduction mechanism of the resistive switching characteristic of the heterojunction is space charge limited current(SCLC) effect. After the comprehensive analysis of the band diagram and the P–E ferroelectric property of the multilayer heterojunction, we can deduce that the SCLC is formed by the effect of the oxygen vacancy which is controlled by ferroelectric polarizationmodulated change of interfacial barrier. And the effective photo-generated carrier also plays a regulatory role in resistance state(RS), which is formed by the double ferroelectric layer Ba TiO3/BiFeO3 under different light fields. This research is of potential application values for developing the multi-state non-volatile resistance random access memory(RRAM) devices based on ferroelectric materials.

Switching Behavior of Cascode GaN Under Influence of Gate Driver

With high-frequency,low power dissipation and high-efficiency characteristics,Gallium nitride(GaN)power devices are of significant benefit in designing high-speed motor drives,as they improve performance and reduce weight.However,due to the cascode structure,coupling with the parasitics in gate driver and power circuits,power converters based on cascode GaN are prone to overshoot and oscillate on switching waveforms,which may lead to serious EMC problems,or even device breakdown.The complicated structure of cascode GaN device makes the gate driver design comparatively complex.An analytical model of the switching process considering gate driver parameters is proposed in this article.The influence of gate driver parameters on switching behavior is investigated from the perspective of switching speed,waveform overshoot,and power loss.Trade-offs among overshoot,switching speed,and power loss are discussed;guidelines to design gate driver parameters are given.

Circuit Implementation of Power Converter for High-Speed Switching Operations

Recently,high di/dt and dv/dt switching operations of power converter circuits has been discussed for realizing a high-efficiency power converter circuit.In this case,parasitic inductances of the bus bar between a DC capacitor and power devices may cause issues of overshoot voltage and electromagnetic interference(EMI)noise.Therefore,it is necessary to design the bus bar geometry while considering the minimization and optimization of the parasitic inductance of bus bar.This paper discusses a relationship between bus bar geometry and switching characteristics.In addition,the bus bar analysis is based on the PEEC method,and the bus bar geometry is designed by considering the stray inductance with using an inductance-map method.Moreover,this paper also presents a design procedure of acceptable stray inductance based on a standardization method.It should be noted that the stray inductance is designed not for minimization,but optimization,and it is shown not as an absolute value(H),but as a percentage value(%).Finally,the oscillation waveforms under turn-off operation will be discussed depending on the bus bar geometry.

Resistive switching characteristic of electrolyte-oxide-semiconductor structures

The resistive switching characteristic of SiO2 thin film in electrolyte-oxide-semiconductor （EOS） struc- tures under certain bias voltage is reported. To analyze the mechanism of the resistive switching characteristic, a batch olEOS structures were fabricated under various conditions and their electrical properties were measured with a set of three-electrode systems. A theoretical model based on the formation and rupture of conductive filaments in the oxide layer is proposed to reveal the mechanism of the resistive switching characteristic, followed by an experimental investigation of Auger electron spectroscopy （AES） and secondary ion mass spectroscopy （SIMS） to verify the proposed theoretical model. It is found that different threshold voltage, reverse leakage current and slope value features of the switching I-V characteristic can be observed in different EOS structures with different elec- trolyte solutions as well as different SiO2 layers made by different fabrication processes or in different thicknesses. With a simple fabrication process and significant resistive switching characteristic, the EOS structures show great potential for chemical/biochemical applications.

Influence of Parasitic Parameters on Dynamic Threshold Voltage Hysteresis of Silicon Carbide MOSFETs

Threshold voltage (V_(TH)) hysteresis affects the dynamic characteristics of silicon carbide (SiC) MOSFETs, whichin turn affects reliability of a device. In this paper, a dynamichysteresis curve is proposed as an evaluation method of theinfluence of V_(TH) hysteresis on the switching characteristics ofSiC MOSFETs. This method can eliminate the impact of triggerlevel and obtain the dynamic V_(TH). Furthermore, the influence ofparasitic parameters on dynamic V_(TH) hysteresis is theoreticallyanalyzed. Double pulse tests under different parasitic parametersare performed on three SiC MOSFETs with different gatestructures to verify the analysis. Results show that gate resistance(R_(G)) and source inductance (L_(S)) have more significant effectson dynamic V_(TH) hysteresis compared with gate inductance anddrain inductance. V_(TH) hysteresis phenomenon weakens withincrease of R_(G) or L_(S), which is related to device structure.The results presented in this paper can provide guidance forthe design of circuit parasitic parameters of SiC MOSFETs toregulate V_(TH) hysteresis.

Modeling of Busbars in High Power Neutral Point Clamped Three-Level Inverters

The busbars in high power neutral point clamped three-level inverters are modeled using the Maxwell Q3D Extractor software, which is based on the partial element equivalent circuits method. The equivalent circuits of the busbars and devices model are simulated in the electric simulator PSlM to analyze the effects of the parasitic inductance on the switching characteristics of the integrated gate commutated thyristor （IGCT） in different topology positions. The simulation results agree well with the measured impedance analyzer results and the IGCT test results, which proves the effectiveness of the modeling method for the large, complex busbars.