Given the substantially increasing complexity of embedded systems, the use of relatively detailed clock cycle-accurate simulators for the design-space exploration is impractical in the early design stages. Raising the...Given the substantially increasing complexity of embedded systems, the use of relatively detailed clock cycle-accurate simulators for the design-space exploration is impractical in the early design stages. Raising the abstraction level is nowadays widely seen as a solution to bridge the gap between the increasing system complexity and the low design productivity. For this, several system-level design tools and methodologies have been introduced to efficiently explore the design space of heterogeneous signal processing systems. In this paper, we demonstrate the effectiveness and the flexibility of the Sesame/Artemis system-level modeling and simulation methodology for efficient peformance evaluation and rapid architectural exploration of the increasing complexity heterogeneous embedded media systems. For this purpose, we have selected a system level design of a very high complexity media application;a H.264/AVC (Advanced Video Codec) video encoder. The encoding performances will be evaluated using system-level simulations targeting multiple heterogeneous multiprocessors platforms.展开更多
Thermoelectric cooling(TEC)is critically important in thermal management of laser modules or chips and potentially for personalized thermoregulation.The formulae for efficiency in standard textbooks can only describe ...Thermoelectric cooling(TEC)is critically important in thermal management of laser modules or chips and potentially for personalized thermoregulation.The formulae for efficiency in standard textbooks can only describe the performance of a TEC module with ideal thermal conditions,that is,fixed terminal temperatures,but are unable to deal with a real TEC system where heat transfer at its interfaces with the heat source and sink are finite and with thermal resistances.Here,we define the TEC system-level performance indices,that is,the maximum cooling power,temperature difference,and coefficient of performance,by introducing a set of explicit formulae.The external heat transfer conditions are taken into account as dimensionless thermal resistance parameters.With these formulae,the TEC system performances are evaluated elegantly with errors well within±5%over broad operating conditions.We further optimize the cooling power and the coefficient of performance in practical scenarios and establish a general White–Box design procedure for TEC systems,which enables a transparent design process and straightforward analysis of performance bottlenecks.A set of cooling experiments are performed to validate the analytical model and to illustrate the dependence of system design on realistic thermal conditions.By choosing the suitable TEC module parameter under given external heat transfer conditions,the cooling power can be improved by more than 100%.This work sheds some light on the integral design of TEC systems for broad applications to take full advantage of the advanced thermoelectric materials in the cooling field.展开更多
文摘Given the substantially increasing complexity of embedded systems, the use of relatively detailed clock cycle-accurate simulators for the design-space exploration is impractical in the early design stages. Raising the abstraction level is nowadays widely seen as a solution to bridge the gap between the increasing system complexity and the low design productivity. For this, several system-level design tools and methodologies have been introduced to efficiently explore the design space of heterogeneous signal processing systems. In this paper, we demonstrate the effectiveness and the flexibility of the Sesame/Artemis system-level modeling and simulation methodology for efficient peformance evaluation and rapid architectural exploration of the increasing complexity heterogeneous embedded media systems. For this purpose, we have selected a system level design of a very high complexity media application;a H.264/AVC (Advanced Video Codec) video encoder. The encoding performances will be evaluated using system-level simulations targeting multiple heterogeneous multiprocessors platforms.
基金the Guangdong Innovation Research Team Project,Grant/Award Number:2016ZT06G587the Shenzhen Science and Technique Fund,Grant/Award Number:KYTDPT20181011104007+1 种基金the Tencent Foundation,Grant/Award Number:the XPLORER PRIZEthe Shenzhen Key Project of Long-Term Support Plan,Grant/Award Number:20200925164021002。
文摘Thermoelectric cooling(TEC)is critically important in thermal management of laser modules or chips and potentially for personalized thermoregulation.The formulae for efficiency in standard textbooks can only describe the performance of a TEC module with ideal thermal conditions,that is,fixed terminal temperatures,but are unable to deal with a real TEC system where heat transfer at its interfaces with the heat source and sink are finite and with thermal resistances.Here,we define the TEC system-level performance indices,that is,the maximum cooling power,temperature difference,and coefficient of performance,by introducing a set of explicit formulae.The external heat transfer conditions are taken into account as dimensionless thermal resistance parameters.With these formulae,the TEC system performances are evaluated elegantly with errors well within±5%over broad operating conditions.We further optimize the cooling power and the coefficient of performance in practical scenarios and establish a general White–Box design procedure for TEC systems,which enables a transparent design process and straightforward analysis of performance bottlenecks.A set of cooling experiments are performed to validate the analytical model and to illustrate the dependence of system design on realistic thermal conditions.By choosing the suitable TEC module parameter under given external heat transfer conditions,the cooling power can be improved by more than 100%.This work sheds some light on the integral design of TEC systems for broad applications to take full advantage of the advanced thermoelectric materials in the cooling field.
