Three-dimensional thermo-electrical finite element analyses were conducted to simulate the current density and temperature distributions in solder bump joints with different pad geometries.The effects of pad thickness...Three-dimensional thermo-electrical finite element analyses were conducted to simulate the current density and temperature distributions in solder bump joints with different pad geometries.The effects of pad thickness,diameter and shape on current density and temperate distributions were investigated respectively.It was found that pads with larger thickness or/and diameter could reduce current density and temperature in solder bump significantly.Pad shapes affected the current density and temperature distributions in solder bumps.The relatively low current density and temperature didn＇t occur in the bump joint with traditional rounded pad but occurred in bump joints with octagonal and nonagonal pads respectively.Therefore,optimized pad geometry may be designed to alleviate the current crowding effect and reduce the bump temperature,and therefore delay electromigration failure and increase the mean-time-to-failure.展开更多
Powder in tube process（PIT） was adopted for the fabrication of single filament Bi-2223 tapes, and a heat treatment process including the first heat treatment（HT1）, intermediate rolling（IR）, and second heat treat...Powder in tube process（PIT） was adopted for the fabrication of single filament Bi-2223 tapes, and a heat treatment process including the first heat treatment（HT1）, intermediate rolling（IR）, and second heat treatment（HT2） was performed. The phase evolution mechanism and microstructure changes during these heat treatment processes were systematically discussed. The influences of HT1 parameters on the phase evolution process of Bi-2223 tapes were discussed. With the optimized HT1 process, a proper Bi-2223 content of about 90% was achieved. HT2 process was also optimized by adding a post annealing process. An obvious increase of current capacity was obtained due to the enhancement of intergrain connections. Single filament Bi-2223 tapes with the critical current of Ic-90 A were fabricated with the optimized sintering process.展开更多
文摘Three-dimensional thermo-electrical finite element analyses were conducted to simulate the current density and temperature distributions in solder bump joints with different pad geometries.The effects of pad thickness,diameter and shape on current density and temperate distributions were investigated respectively.It was found that pads with larger thickness or/and diameter could reduce current density and temperature in solder bump significantly.Pad shapes affected the current density and temperature distributions in solder bumps.The relatively low current density and temperature didn＇t occur in the bump joint with traditional rounded pad but occurred in bump joints with octagonal and nonagonal pads respectively.Therefore,optimized pad geometry may be designed to alleviate the current crowding effect and reduce the bump temperature,and therefore delay electromigration failure and increase the mean-time-to-failure.
基金Funded by the National Natural Science Foundation of China(No.51472206)the National ITER Program of China(2015GB115001)the Program for Innovative Research Team in Shaanxi Province(No.2013KCT-07)
文摘Powder in tube process（PIT） was adopted for the fabrication of single filament Bi-2223 tapes, and a heat treatment process including the first heat treatment（HT1）, intermediate rolling（IR）, and second heat treatment（HT2） was performed. The phase evolution mechanism and microstructure changes during these heat treatment processes were systematically discussed. The influences of HT1 parameters on the phase evolution process of Bi-2223 tapes were discussed. With the optimized HT1 process, a proper Bi-2223 content of about 90% was achieved. HT2 process was also optimized by adding a post annealing process. An obvious increase of current capacity was obtained due to the enhancement of intergrain connections. Single filament Bi-2223 tapes with the critical current of Ic-90 A were fabricated with the optimized sintering process.
