Heat dissipation enhancement method for finned heat sink for AGV motor driver's IGBT module

With the widespread use of high-power and highly integrated insulated gate bipolar transistor(IGBT),their cooling methods have become challenging.This paper proposes a liquid cooling scheme for heavy-duty automated guided vehicle(AGV)motor driver in port environment,and improves heat dissipation by analyzing and optimizing the core component of finned heat sink.Firstly,the temperature distribution of the initial scheme is studied by using Fluent software,and the heat transfer characteristics of the finned heat sink are obtained through numerical analysis.Secondly,an orthogonal test is designed and combined with the response surface methodology to optimize the structural parameters of the finned heat sink,resulting in a 14.57%increase in the heat dissipation effect.Finally,the effectiveness of heat dissipation enhancement is verified.This work provides valuable insights into improving the heat dissipation of IGBT modules and heat sinks,and provides guidance for their future applications.

Lifetime estimation of IGBT module using square-wave loss discretization and power cycling test

The insulated gate bipolar transistor(IGBT)module is one of the most age-affected components in the switch power supply, and its reliability prediction is conducive to timely troubleshooting and reduction in safety risks and unnecessary costs. The pulsed current pattern of the accelerator power supply is different from other converter applications;therefore, this study proposed a lifetime estimation method for IGBT modules in pulsed power supplies for accelerator magnets. The proposed methodology was based on junction temperature calculations using square-wave loss discretization and thermal modeling.Comparison results showed that the junction temperature error between the simulation and IR measurements was less than 3%. An AC power cycling test under real pulsed power supply applications was performed via offline wearout monitoring of the tested power IGBT module. After combining the IGBT4 PC curve and fitting the test results,a simple corrected lifetime model was developed to quantitatively evaluate the lifetime of the IGBT module,which can be employed for the accelerator pulsed power supply in engineering. This method can be applied to other IGBT modules and pulsed power supplies.

Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test

The excellent properties of SiC bring new challenges for the device packaging.In this study,the bonding strength,fracture behaviors and microstructural evolution of micron-porous Ag joint were elevated during thermal cycling(–50 ℃–250 ℃) in SiC/DBC(direct bonding copper) die attachment structure for different time.During harsh thermal shock test,the strength of sintered joint deceased gradually with the increase of cycling number,and the value just was half of the value of as-sintered after 1 000 cycles.Coarsening of Ag grains was observed in micron-porous joint with the structure inhomogeneity and defects increasing,which were the reasons of the strength decease.In addition,it was also found that the fracture behavior of sintered joints was changed from ductile deformation of Ag grain to brittle fracture of crack propagation after 1 000 cycles.This study will add the understanding in the mechanical properties of Ag sinter joining and its applications at high temperature.

Design and Experimental Investigation for Subsea Control Module Test System

As a core part of subsea production systems,subsea control modules(SCMs)are costly,difficult,and expensive to install and inconvenient to use in underwater maintenance.Therefore,performance and function tests must be carried out before launching SCMs.This study developed a testing device and an SCM test by investigating SCMs and their underwater.The testing device includes four parts:a hydraulic station,an SCM test stand,a signal generating device,and an electronic test unit.First,the basic indices of the testing device were determined from the performance and working parameters of the SCM.Second,the design scheme of the testing device for the SCM was tentatively proposed,and each testing device was designed.Finally,a practical measurement of the SCM,in combination with the hydraulic station,SCM test stand,signal generator,electronic unit,and highpressure water tank,was carried out according to the test requirements.The measurement mainly involved equipment inspection before testing and an experimental test for the SCM.The validity and feasibility of the testing device and method were simultaneously verified through an association test.

Thermal-Hydraulic System Study of the Helium Cooled Pebble Bed (HCPB) Test Blanket Module (TBM) for ITER Using System Code RELAP5

The HCPB concept has been a European DEMO reference concept for nearly one decade. Detailed thermal-hydraulic study on the control behavior of the whole system is one of the important parts of this development. The thermal-hydraulic effect of the TBM-combined cooling circuit during a cyclic operation in ITER has been studied using the system code RELAP5. The RELAP5 is based on an one-dimensional, transient two-fluid model for the flow of a two-phase steam-water mixture that can contain noncondensable components like Helium. The RELAP5models are modified to take the cyclic operation of the circulator, heat, exchanger, bypass, valves etc in to account. A sequence of operational phases is investigated, starting from the cold state through the heating phase that brings the system to a stand-by condition, followed by typical power cycles applied in ITER. The results show that the implemented control mechanisms keep the inlet temperature to the TBM and the total mass flow rate at the required values through all phases.

Thermo-Mechanical Analyses of the High Heat Flux Component for ITER Dual Functional Lithium Lead Test Blanket Module

The finite element code ANSYS is used to calculate the temperature and stress distributions for the first wall of DFLL-TBM （dual functional lithium lead-test blanket module）, for testing in ITER. Preliminary analyses indicate that not only the low temperature design rules, the well-known 3Sin rules, are satisfied for the first wall, but the additional high temperature structural design criteria for the creep damage limits and creep-ratcheting limits are met as well.

The embedded design verification test of microwave circuit modules based on specific chips

In the Paper,the author introduces an embedded design verification test based on specific chips to solve the technical problems of microwave circuit test and fault diagnosis.The author explains embedded design of microwave circuit modules and approach of hardware design and software design,and finally verifies the embedded design of microwave circuit modules based on specific chips.

A Precise Model for Simulation of Temperature Distribution in Power Modules

The interaction between the active chips mounted and the same base plate is considered as a thermoelectrical coupling effect.An approach to coupling effect analysis of a multi-chip system is presented with IGBT as a sample.Finite element method is used to evaluate the temperature distribution in power modules.The precise electrothermal model is obtained by fitting the curve of transient thermal impedance with a finite series of exponential terms,in which,the thermal-coupling effect among chips is considered as a prediction of the highest transient temperature of the chips.This model can be used in many thermal monitoring systems.Both ANSYS and PSPICE si- mulation software have been employed,and the simulation results agree with the experimental ones very well.

用于IGBT模块温度观测的3-D降阶混合型热模型

IGBT模块温度在线监测是提高大容量变流器可靠性的关键技术。在IGBT模块在线温度监测方法中,热阻模型法可对IGBT模块内部的温度分布进行估计,因而受到关注。结合了传感器数据的温度观测器可基于热阻模型,实时修正材料老化、参数温度依赖性和功率损耗计算误差等不确定因素对温度估计造成的影响。然而现有热模型无法同时兼顾系统可观性和建模准确性,且阶数相对较高,难以应用于温度观测器的在线运行。因此,该文提出了一种适用于风冷散热多芯片IGBT模块3-D温度观测器,同时满足可观性、准确性和实时性要求的混合型降阶热模型。首先,分析了热阻模型的拓扑结构及其参数辨识的方法,并探究了模型的状态空间生成规律;然后,基于非线性优化算法对该模型的参数进行修正,以减小因计算流体力学(CFD)仿真模型参数与实际参数不一致所引入的热阻模型与实验物理对象间的误差;随后,使用平衡截断法对热阻模型降阶,相对于现有集总参数热阻模型,进一步提高了实时求解效率;最后,通过仿真和实验验证了所提模型的准确性。

基于失效演化模拟的电力机车用IGBT模块解析剩余寿命建模研究

牵引变流器作为电力机车系统中最关键且故障率最高的设备,影响系统的安全运行,其中绝缘栅双极晶体管(insulated gate bipolar transistor,IGBT)模块是导致牵引变流器失效的主要部件。开展IGBT模块剩余寿命准确评估,对降低运维成本和系统故障率具有重要的战略价值和经济意义。目前采用“里程修”的运维方式,未考虑机车运行线路、工况、负载差异等因素对寿命的影响,导致一些线路过早更换的高昂运维成本和一些线路过晚替换的系统停运风险。因此,在牵引系统IGBT模块故障率高、运行线路间可靠性差异大且采用不合理的“里程修”方式背景下,目前业界普遍关心的问题是各线路基于固定里程修更换的IGBT模块剩余寿命是多少。该文针对电力机车用IGBT模块剩余寿命准确评估的问题,以IGBT模块焊料层不同服役里程空洞尺寸分布规律为基础,建立考虑焊料层空洞空间分布规律的精细化多物理场模型,开展多芯片并联IGBT模块失效演化物理过程模拟,提出以焊料层空洞分布统计规律为老化状态的电力机车用IGBT模块解析剩余寿命预测模拟,并通过功率循环试验验证改进模型准确性。研究成果丰富功率器件的寿命预测和可靠性评估理论,为系统从“里程修”向“状态修”转变提供科学依据。

基于干冰微粒喷射冷却的高速列车IGBT散热器设计

针对高速列车IGBT模块的高效散热问题,设计了一种应用于干冰微粒喷射冷却的针肋散热器。建立了3组不同针肋参数模型,通过数值模拟研究分析了针肋数量、直径、高度对散热效果的影响,得出最优针肋散热器的针肋数量为64、直径为12 mm、高度为45 mm,相比于无肋散热器其换热基板表面温度降低了10.57℃,散热器内部干冰升华率提高了17.2%。通过实验观测到了干冰微粒冷却流体在管内流动状态以及干冰微粒在散热器内部扰动碰撞过程,验证了模拟结果,干冰微粒喷射冷却使热源功率为1.6 kW的IGBT模块保持在约25℃,满足其散热需要,为深入研究干冰微粒喷射冷却技术提供指导。

基于稳态集-射极饱和电压的IGBT功率模块疲劳失效模型的研究

随着绝缘栅双极型晶体管(insulated gate bipolar transistor, IGBT)功率模块在民用和军用领域应用的不断深入,IGBT功率模块在长时间电-热应力下的疲劳老化问题越来越突出。本文基于半导体物理和器件可靠性理论,研究IGBT功率模块封装失效的产生原因,分析焊料层和键丝失效的作用机理和表现特征。在研究IGBT通态电压模型的基础上,提出了一种基于稳态集-射极饱和电压的IGBT功率模块疲劳老化模型,实现对焊料层疲劳和键丝疲劳等封装老化问题的综合表征。搭建IGBT功率模块的电-热老化实验测试平台,进行了功率循环老化实验验证,结果表明本文模型可以较为准确地评估IGBT功率模块封装的疲劳老化程度。

COMPOSITE SOFT SWITCHING CONFIGURATION FOR INVERTERS USING BRIDGE LEG MODULES

The use of either lossless snubbers or resonant zero voltage switching (ZVS) and zero current switching (ZCS) techniques can increase efficiency and reduce electromagnetic inter ference (EMI) and noise of industrial power equipment at high switching frequencies. This paper presents an adaptive composite soft switching configuration which combines snubber functions and resonant ZCS circuits for switches in inverters using power bridge leg modules. Simulation and experimental results are included.

Numerical and Experimental Investigation of Hydrodynamic Interactions of Two VLFS Modules Deployed in Tandem

This paper numerically and experimentally investigates the hydrodynamic interaction between two semi-submersible type VLFS modules in the frequency domain. Model tests were conducted to investigate the relationship between interactions and wave headings. Numerical studies were performed by solving the radiation-diffraction problem and were validated against the experimental results. Motion Response Amplitude Operators (RAOs) were obtained from numerical and experimental studies. The dependency of the hydrodynamic interaction effect on wave headings is clarified. The influence of different wave periods on the motion responses of two-module VLFS and wave elevations in the gap is studied. The results indicate that the hydrodynamic interactions of the two modules are directly related to the wave headings and the periods of the incident wave. The shielding effect plays an important role in short wave, and the influence decreases with the increase of the incident wavelength. The numerical results based on the diffraction-radiation code can give a relatively good estimation to the responses in short wave while for long wave, it would over-predict the response.

EconoDUAL封装、母线电压800V的1200A IGBT功率模块设计与开发

提高车规级功率模块的功率密度对电动汽车的性能具有重要意义,而传统功率模块内部采用的二维布局杂散电感大,限制了开关速度与母线电压,影响功率密度的提高。为此,以EconoDUAL封装的IGBT功率模块为对象,使用叠层DBC的方法进行三维布局设计,开发出了1200 V/1200 A的IGBT功率模块;详细介绍了所提功率模块的布局结构,与传统二维布局方法相比,杂散电感下降了58%;同时,对功率模块进行电气性能测试,通过了母线电压800 V下脉冲电流为1200 A的双脉冲实验,证明了模块功率密度的提高。为了在提高功率密度的情况下不影响散热性能,功率模块底部使用了水冷PinFin散热器,并对其进行了散热仿真和结-水热阻的测试,结果表明,IGBT热阻为0.084 K/W,二极管热阻为0.124 K/W,与同封装下商用1200 V/900 A模块相比并无明显差异,证明了所提设计方法的正确性及有效性。

计及IGBT模块键合线与芯片焊料层老化的热网络法结温计算

文中提出一种计及IGBT模块键合线与芯片焊料层老化的热网络法结温计算,基于Simulink对短时间尺度下损耗与结温的相互依赖关系进行更新,并分别通过双脉冲测试及有限元仿真修正长时间尺度下键合线与芯片焊料层老化对IGBT结温计算的影响,在此基础上,根据芯片焊料层不同老化状态下键合线的应力特征,实现两种老化模式的相互关联,较为准确地计算IGBT结温。最终利用试验平台与传统结温计算方法进行对比验证了所提结温计算方法的准确性。该结温计算方法有助于在实际运行工况及IGBT模块老化状态下精确计算结温。

基于改进双支耦合Cauer模型的逆变器中IGBT模块结温预测方法

在严苛工况下,应用于光伏发电和风电系统逆变器中的IGBT模块极易老化,进而在焊料层中形成空洞,而芯片材料的热物性也会因高温而发生变化,两者结合将大幅影响耦合模型的预测精度。基于此,在热耦合效应下,对焊料层空洞和芯片热效应对芯片结温的影响进行分析,建立同时考虑IGBT芯片焊料层空洞损伤和芯片材料热效应的改进双支耦合Cauer模型。通过有限元方法研究不同空洞率对IGBT模块热特性的影响,并给出含有空洞时焊料层热阻的计算方法。在此基础上,进一步考虑IGBT模块芯片热参数对温度的依赖关系,建立芯片热阻-温度的函数模型。最终,通过实验验证所提改进模型的准确性和有效性,提高了IGBT模块的结温预测精度,增强了光伏发电和风电系统中逆变器的可靠性。

IGBT模块V-I特性曲线簇建模及其结温提取应用

绝缘栅双极型晶体管(Insulated gate bipolar transistor,IGBT)以其高效率、大容量和低成本等特点在新能源发电及储能、高压直流输电、电力牵引和电气化交通等领域应用非常广泛。然而一旦IGBT模块发生故障,将打破相关装置和设备的正常运行状态,引发一系列连锁事故,造成人员伤害和严重的经济损失。根据一项调查统计结果,光伏电站大约34%的可靠性问题是由IGBT模块故障所引发的,因此,IGBT模块可靠性问题愈发受到关注。相关研究成果表明,IGBT模块的结温与模块可靠性问题之间存在密切的关系,如何能够快速准确地获取当前IGBT模块的实时结温是IGBT模块可靠性研究的关键。通过对IGBT模块的V-I输出特性曲线进行深入分析和研究,提出一种表征IGBT模块导通压降、结温和集电极电流关系的建模方法。利用该方法建立的表征模型可以方便快捷地提取IGBT模块结温,并通过试验验证了基于该建模方法的IGBT模块结温提取策略的有效性。除此之外,该建模方法考虑到了模块键合线老化的影响,并给出了相应的模型校正方法和结温提取策略。

一种基于开通栅极电压的新型IGBT键合线老化监测方法

绝缘栅双极型晶体管(insulated gate bipolar transistors,IGBT)的可靠运行是牵引变流器安全和性能的重要保障。键合线老化作为IGBT的一种常见失效模式,对其进行监测具有重要意义。文中提出一种基于开通栅极电压ugem的键合线老化监测方法,该方法可有效避免温度和负载电流带来的影响。首先,基于IGBT等效电路模型,系统分析ugem受键合线断裂影响的原因;其次,利用双脉冲测试进行验证,同时对温度和负载电流带来的影响进行分析;在此基础上,考虑到使用ugem局部特征将受到温度和电流的干扰,提出将开通栅极电压整体波形用于键合线老化的监测,并进一步利用有监督的线性判别分析进行数据降维以及采用支持向量机实现键合线断裂根数的检测。最后,通过实验对所提监测方法的有效性进行验证。

NPC三电平IGBT模块驱动电路设计及动态特性测试

二极管中点钳位NPC(neutral point clamped)三电平逆变器具备较低的开关应力、谐波分量和较好的抗干扰能力,促使其成为光伏、储能等新能源领域DC-AC变换器的主要拓扑之一。针对大功率应用场景中普遍采用的NPC三电平IGBT功率半导体模块开展研究,分析NPC三电平功率模块的换流回路,并据此给出对应换流回路的寄生参数精准仿真评估方法。依据换流回路寄生参数最小原则,设计适用于NPC三电平功率半导体模块的动态特性测试电路。根据换流回路以及电路工作原理,设计NPC三电平功率模块的驱动电路,并给出增强驱动电流、防直通及死区时间可调的驱动方案。最后,通过对NPC三电平IGBT模块的动态测试,详细评估了不同工况下功率器件的动态损耗。