Experiments and Simulation of Thermal Behaviors of the Dual-drive Servo Feed System

The machine tool equipped with the dual-drive servo feed system could realize high feed speed as well as sharp precision. Currently, there is no report about the thermal behaviors of the dual-drive machine, and the current research of the thermal characteristics of machines mainly focuses on steady simulation. To explore the influence of thermal characterizations on the precision of a jib boring machine assembled dual-drive feed system, the thermal equilibrium tests and the research on thermal-mechanical transient behaviors are carried out. A laser interferometer, infrared thermography and a temperature-displacement acquisition system are applied to measure the temperature distribution and thermal deformation at different feed speeds. Subsequently, the finite element method （FEM） is used to analyze the transient thermal behaviors of the boring machine. The complex boundary conditions, such as heat sources and convective heat transfer coefficient, are calculated. Finally, transient variances in temperatures and deformations are compared with the measured values, and the errors between the measurement and the simulation of the temperature and the thermal error are 2 ~C and 2.5 pm, respectively. The researching results demonstrate that the FEM model can predict the thermal error and temperature distribution very well under specified operating condition. Moreover, the uneven temperature gradient is due to the asynchronous dual-drive structure that results in thermal deformation. Additionally, the positioning accuracy decreases as the measured point became further away from the motor, and the thermal error and equilibrium period both increase with feed speeds. The research proposes a systematical method to measure and simulate the boring machine transient thermal behaviors.

Quantitative analysis on influencing factors for interface propagation-based thermal conductivity measurement method during solid-liquid transition

The recently proposed interface propagation-based method has shown its advantages in obtaining the thermal conductivity of phase change materials during solid-liquid transition over conventional techniques. However, in previous investigation, the analysis on the measurement error was qualitative and only focused on the total effects on the measurement without decoupling the influencing factors. This paper discusses the effects of influencing factors on the measurement results for the interface propagation-based method. Numerical simulations were performed to explore the influencing factors, namely model simplification, subcooling and natural convection, along with their impact on the measurement process and corresponding measurement results. The numerical solutions were provided in terms of moving curves of the solid-liquid interface and the predicted values of thermal conductivity. Results indicated that the impact of simplified model was strongly dependent on Stefan number of the melting process. The degree of subcooling would lead to underestimated values for thermal conductivity prediction. The natural convection would intensify the heat transfer rate in the liquid region, thereby overestimating the obtained results of thermal conductivity. Correlations and experimental guidelines are provided. The relative errors are limited in ±1.5%,±3%and ±2% corresponding to the impact of simplified model, subcooling and natural convection, respectively.

The Approach of Compensation of Air Refractive Index in Thermal Expansion Coefficients Measurement Based on Laser Feedback Interferometry

We present the thermal expansion coefficient （TEC） measurement technology of compensating for the effect of variations in the refractive index based on a Nd： YA G laser feedback system, the beam frequency is shifted by a pair of aeousto-optic modulators and then the heterodyne phase measurement technique is used. The sample measured is placed in a muffle furnace with two coaxial holes opened on the opposite furnace walls. The measurement beams hit perpendicularly and coaxially on each surface of the sample. The reference beams hit on the reference mirror and the high-refiectivity mirror, respectively. By the heterodyne configuration and computing, the influences of the vibration, distortion of the sample supporter and the effect of variations in the refractive index are measured and largely minimized. For validation, the TECs of aluminum samples are determined in the temperature range of 29-748K, confirming not only the precision within 5 × 10-7 K-1 and the accuracy within 0.4% from 298K to 448K but also the high sensitivity non-contact measurement of the lower reflectivity surface induced by the sample oxidization from 448 K to 748 K.

Out of Plane Thermal Conductivity of Carbon Fiber Reinforced Composite Filled with Diamond Powder

Highly conductive fillers have a strong influence on improving the poor out of plane thermal conductivity of carbon fiber reinforced composites. The objective of this study has been to investigate the role of the diamond powder (DP) in enhancing the out-of-plane thermal conductivity of the woven composites. Samples of the standard modulus T300 carbon fiber composite with 44% and 55% fiber volume fraction and the high modulus YS90A carbon fiber composite with 50% volume fraction were fabricated with their matrices comprising of neat epoxy and different loading of diamond powder within epoxy resin. Steady state thermal conductivity measurements were carried out and it was found from the measurements that the out of plane thermal conductivity of the standard modulus composite increased by a factor of 2.3 with 14% volume fraction of diamond powder in the composite while the out of plane thermal conductivity of the high modulus composite increased by a factor of 2.8 with 12% volume fraction of diamond powder in the composite. Finite Element Modeling (FEM) with the incorporation of microstructural characteristics is presented and good consistency between the measurements and FEM results were observed.

Heat transfer enhancement in MOSFET mounted on different FR4 substrates by thermal transient measurement

Miniaturization of electronic package leads to high heat density and heat accumulation in electronics device, resulting in short life time and premature failure of the device. Junction temperature and thermal resistance are the critical parameters that determine the thermal management and reliability in electronics cooling. Metal oxide field effect transistor（MOSFET）is an important semiconductor device for light emitting diode-integrated circuit（LED IC） driver application, and thermal management in MOSFET is a major challenge. In this study, investigations on thermal performance of MOSFET are performed for evaluating the junction temperature and thermal resistance. Suitable modifications in FR4 substrates are proposed by introducing thermal vias and copper layer coating to improve the thermal performance of MOSFET. Experiments are conducted using thermal transient tester（T3ster） at 2.0 A input current and ambient temperature varying from25℃ to 75℃. The thermal parameters are measured for three proposed designs： FR4 with circular thermal vias, FR4 with single strip of copper layer and embedded vias, and FR4 with I-shaped copper layer, and compared with that of plain FR4 substrate. From the experimental results, FR4I-shaped shows promising results by 33.71% reduction in junction temperature and 54.19% reduction in thermal resistance. For elevated temperature, the relative increases in junction temperature and thermal resistance are lower for FR4I-shaped than those for other substrates considered. The introduction of thermal vias and copper layer plays a significant role in thermal performance.

Precipitation and stability of reversed austenite in 9Ni steel

A new method was used to analyze the factors affecting the precipitation of reversed austenite during tempering. The samples were kept at various tempering temperatures for 10 min and their length changes were recorded. Then, the precipitation of reversed austenite which led to the length reduction was shown by thermal expansion curves. The results show that the effects of process parameters on the precipitation of reversed austenite can be determined more accurately by this method than by X-ray diffraction. When the quenching and tempering process is adopted, both the lower quenching temperature and higher tempering temperature can promote the precipitation of reversed austenite during tempering; and when the quenching, lamellarizing, and tempering process is used, intercritical quenching is considered beneficial to the precipitation of reversed austenite in the subsequent tempering because of Ni segregation during holding at the intercritical temperature.

Nodeless superconductivity in a quasi-two-dimensional superconductor AuTe2Se(4/3)

We performed ultra-low temperature thermal conductivity measurements on the single crystal of a new gold-based quasi-two-dimensional superconductor Au Te2Se（4/3）, which has a superconducting transition temperature Tc = 2.70 K. A negligible residual linear term κ0/T in zero magnetic field is observed, which suggests fully gapped superconducting state.Furthermore, the field dependence of κ0/T is similar to that of the multi-band s-wave superconductor Ba Fe1.9 Ni0.1 As2 at low field. These results reveal multiple nodeless superconducting gaps in this interesting quasi-two-dimensional superconductor with Berezinsky–Kosterlitz–Thouless topological transition.

Field Performance Analysis of Shoes Used in the Takraw Games in Malaysia

Using proper footwear is crucial to avoid pain, deformations and injuries on foot. For athletes, a pair of good shoes is vital for comfort and may add to performance improvement. The main objective of this study is to study the performance of some commonly used shoes in the takraw games by using experimental tests and thermal measurements. The momentum and kinetic energies that were generated by the takraw shoes were also measured. The methods used in this study included free fall test, impact force analysis and surface thermal assessment. From the outcomes of the experiments, it was found that the prototype FA shoe was better in absorption of momentum and impact force than the other shoes and also with lower surface temperature after the trial game. These outcomes suggested that it was more suitable to be worn by the takraw players for better performance. All the information obtained from this study are particularly useful for improvement on the current design oftakraw shoe.

Multiband nodeless superconductivity near the charge-density-wave quantum critical point in ZrTe(3-x)Sex

It was found that selenium doping can suppress the charge-density-wave（CDW） order and induce bulk superconductivity in ZrTe3. The observed superconducting dome suggests the existence of a CDW quantum critical point（QCP） in ZrTe3-xSex near x ≈ 0.04. To elucidate the superconducting state near the CDW QCP, we measure the thermal conductivity of two ZrTe（3-x）Sex single crystals（x = 0.044 and 0.051） down to 80 m K. For both samples, the residual linear term κ0/T at zero field is negligible, which is a clear evidence for nodeless superconducting gap. Furthermore, the field dependence of κ0/T manifests a multigap behavior. These results demonstrate multiple nodeless superconducting gaps in ZrTe（3-x）Sex,which indicates conventional superconductivity despite of the existence of a CDW QCP.

Molten Steel Breakout Prediction Based on Thermal Friction Measurement

By measuring the pressure and piston stroke of hydraulic servo cylinders in the oscillation system of a caster mould,friction between mould and shell can be determined.The condition of solidified shell can be monitored by thermocouples fixed to the mould.Breakouts,whether caused by shell cracking,shell sticking or entrained impurities,can therefore be predicted and effectively avoided through monitoring the change characteristics of friction and thermocouples temperature during the process.

Thermal analysis in high power GaAs-based laser diodes

The thermal characteristics of 808 nm Al Ga As/Ga As laser diodes（LDs） are analyzed via electrical transient measurements and infrared thermography. The temperature rise and thermal resistance are measured at various input currents and powers. From the electrical transient measurements, it is found that there is a significant reduction in thermal resistance with increasing power because of the device power conversion efficiency. The component thermal resistance that was obtained from the structure function showed that the total thermal resistance is mainly composed of the thermal resistance of the sub-mount rather than that of the LD chip, and the thermal resistance of the sub-mount decreases with increasing current. The temperature rise values are also measured by infrared thermography and are calibrated based on a reference image, with results that are lower than those determined by electrical transient measurements. The difference in the results is caused by the limited spatial resolution of the measurements and by the signal being captured from the facet rather than from the junction of the laser diode.

Photoacoustic measurement of the thermal property of condensed matter using a strong light-absorbing surface layer

By using a strong light-absorbing surface layer and front-surface illumination with a low power He-Ne laser ( 6mW), photoacoustic measurements of the thermal effusivities of materials have been made, based on the photoacoustic theory, derived in this paper, of condensed matter with a strong light- absorbing surface layer. This method can eliminate the stray light, give full play to the power of the light irradiation, and improve the signal to noise ratio. The experiment results are in good agreement with the theoretical values.