The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of...The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of different parts of the shell were observed by scanning electron microscopy and optical microscopy, and the thermophysical and mechanical properties of the shell were tested. The results show that there exists the segregation phenomenon between the Si C particulate and the liquid phase during thixoforming, the liquid phase flows from the shell, and the Si C particles accumulate at the bottom of the shell. The volume fraction of Si C decreases gradually from the bottom to the walls. Accordingly, the thermal conductivities of bottom center and walls are 178 and 164 W·m-1·K-1, the coefficients of thermal expansion(CTE) are 8.2×10-6 and 12.6×10-6 K-1, respectively. The flexural strength decreases slightly from 437 to 347 MPa. The microstructures and properties of the shell show gradient distribution.展开更多
Based on ANSYS and Icepak softwares, the numerical analysis method is used to build up the thermal analysis model of the 2.5D package, which contains a high power CPU chip. The focus of the research is on the determin...Based on ANSYS and Icepak softwares, the numerical analysis method is used to build up the thermal analysis model of the 2.5D package, which contains a high power CPU chip. The focus of the research is on the determination of the contributing factors and their effects on the thermal resistance and heat distribution of the package. The parametric analysis illustrates that the substrate conductivity, TIM conductivity and fin height are more crucial for heat conduction in the package. Furthermore, these major parameters are compared and analyzed by orthogonal tests, and the optimal solution for 2.5D integration is proposed. The factors＇ influence patterns on thermal resistance, obtained in this article, could be utilized as a thermal design reference.展开更多
文摘The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of different parts of the shell were observed by scanning electron microscopy and optical microscopy, and the thermophysical and mechanical properties of the shell were tested. The results show that there exists the segregation phenomenon between the Si C particulate and the liquid phase during thixoforming, the liquid phase flows from the shell, and the Si C particles accumulate at the bottom of the shell. The volume fraction of Si C decreases gradually from the bottom to the walls. Accordingly, the thermal conductivities of bottom center and walls are 178 and 164 W·m-1·K-1, the coefficients of thermal expansion(CTE) are 8.2×10-6 and 12.6×10-6 K-1, respectively. The flexural strength decreases slightly from 437 to 347 MPa. The microstructures and properties of the shell show gradient distribution.
基金Project supported by the National S&T Major Projects(No.2011ZX02709-2)the China National Science Foundation(No.61176098)
文摘Based on ANSYS and Icepak softwares, the numerical analysis method is used to build up the thermal analysis model of the 2.5D package, which contains a high power CPU chip. The focus of the research is on the determination of the contributing factors and their effects on the thermal resistance and heat distribution of the package. The parametric analysis illustrates that the substrate conductivity, TIM conductivity and fin height are more crucial for heat conduction in the package. Furthermore, these major parameters are compared and analyzed by orthogonal tests, and the optimal solution for 2.5D integration is proposed. The factors＇ influence patterns on thermal resistance, obtained in this article, could be utilized as a thermal design reference.
