粉末近净成形(Powder metallurgy near net shaping,PM-NNS)技术能够制备出具有优异综合力学性能的粉末合金复杂部件。介绍了粉末热等静压(Hot isostatic pressing,HIP)近净成形技术原理及优势,综述了近年来国内外粉末近净成形在航天发...粉末近净成形(Powder metallurgy near net shaping,PM-NNS)技术能够制备出具有优异综合力学性能的粉末合金复杂部件。介绍了粉末热等静压(Hot isostatic pressing,HIP)近净成形技术原理及优势,综述了近年来国内外粉末近净成形在航天发动机领域的研究现状,从工艺路线和构件研制两方面展开,简述了构件制备过程的影响因素及缺陷控制,结合中国科学院金属研究所粉末近净成形技术在航天发动机领域的研究及应用情况,总结了粉末近净成形技术当前存在的主要问题及发展方向,以期进一步拓宽该技术的应用范围。展开更多
The thermal debinding of new binder in cemented carbide's extruding compacts and its debinding mechanism have been studied here. When the low molecular mass components (LMMC) in these new binder systems are change...The thermal debinding of new binder in cemented carbide's extruding compacts and its debinding mechanism have been studied here. When the low molecular mass components (LMMC) in these new binder systems are changed, their thermogravimetric analysis (TGA) curves are very different. As the paraffin wax is the main LMMC, the new binder has been removed in two different temperature zones; while the temperature is at 240 ℃, the LMMC have been almost totally debinded. When a kind of short time polymer X is the main LMMC, there are no zones of low temperature debinding in the TGA curves. The differential thermal analysis curves show that a new single phase microstructural material composing with X and polymer A has been made in these cases.展开更多
SiCp/Cu composites with a compact microstructure were successfully fabricated by vacuum hot-pressing method. In order to suppress the detrimental interfacial reactions and ameliorate the interfacial bonding between co...SiCp/Cu composites with a compact microstructure were successfully fabricated by vacuum hot-pressing method. In order to suppress the detrimental interfacial reactions and ameliorate the interfacial bonding between copper and silicon carbide, molybdenum coating was deposited on the surface of silicon carbide by magnetron sputtering method and crystallized heat-treatment. The effects of the interfacial design on the thermo-physical properties of Si Cp/Cu composites were studied in detail. Thermal conductivity and expansion test results showed that silicon carbide particles coated with uniform and compact molybdenum coating have improved the comprehensive thermal properties of the Si Cp/Cu composites. Furthermore, the adhesion of the interface between silicon carbide and copper was significantly strengthened after molybdenum coating. Si Cp/Cu composites with a maximum thermal conductivity of 274.056 W/（m·K） and a coefficient of thermal expansion of 9 ppm/K were successfully prepared when the volume of silicon carbide was about 50%, and these Si Cp/Cu composites have potential applications for the electronic packageing of the high integration electronic devices.展开更多
文摘粉末近净成形(Powder metallurgy near net shaping,PM-NNS)技术能够制备出具有优异综合力学性能的粉末合金复杂部件。介绍了粉末热等静压(Hot isostatic pressing,HIP)近净成形技术原理及优势,综述了近年来国内外粉末近净成形在航天发动机领域的研究现状,从工艺路线和构件研制两方面展开,简述了构件制备过程的影响因素及缺陷控制,结合中国科学院金属研究所粉末近净成形技术在航天发动机领域的研究及应用情况,总结了粉末近净成形技术当前存在的主要问题及发展方向,以期进一步拓宽该技术的应用范围。
文摘The thermal debinding of new binder in cemented carbide's extruding compacts and its debinding mechanism have been studied here. When the low molecular mass components (LMMC) in these new binder systems are changed, their thermogravimetric analysis (TGA) curves are very different. As the paraffin wax is the main LMMC, the new binder has been removed in two different temperature zones; while the temperature is at 240 ℃, the LMMC have been almost totally debinded. When a kind of short time polymer X is the main LMMC, there are no zones of low temperature debinding in the TGA curves. The differential thermal analysis curves show that a new single phase microstructural material composing with X and polymer A has been made in these cases.
基金Funded by the China Aerospace Science&Industry Corp
文摘SiCp/Cu composites with a compact microstructure were successfully fabricated by vacuum hot-pressing method. In order to suppress the detrimental interfacial reactions and ameliorate the interfacial bonding between copper and silicon carbide, molybdenum coating was deposited on the surface of silicon carbide by magnetron sputtering method and crystallized heat-treatment. The effects of the interfacial design on the thermo-physical properties of Si Cp/Cu composites were studied in detail. Thermal conductivity and expansion test results showed that silicon carbide particles coated with uniform and compact molybdenum coating have improved the comprehensive thermal properties of the Si Cp/Cu composites. Furthermore, the adhesion of the interface between silicon carbide and copper was significantly strengthened after molybdenum coating. Si Cp/Cu composites with a maximum thermal conductivity of 274.056 W/（m·K） and a coefficient of thermal expansion of 9 ppm/K were successfully prepared when the volume of silicon carbide was about 50%, and these Si Cp/Cu composites have potential applications for the electronic packageing of the high integration electronic devices.
