Breaking Through Bottlenecks for Thermally Conductive Polymer Composites:A Perspective for Intrinsic Thermal Conductivity,Interfacial Thermal Resistance and Theoretics

Rapid development of energy,electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites.However,the thermal conductivity coefficient(λ)values of prepared thermally conductive polymer composites are still difficult to achieve expectations,which has become the bottleneck in the fields of thermally conductive polymer composites.Aimed at that,based on the accumulation of the previous research works by related researchers and our research group,this paper proposes three possible directions for breaking through the bottlenecks:(1)preparing and synthesizing intrinsically thermally conductive polymers,(2)reducing the interfacial thermal resistance in thermally conductive polymer composites,and(3)establishing suitable thermal conduction models and studying inner thermal conduction mechanism to guide experimental optimization.Also,the future development trends of the three above-mentioned directions are foreseen,hoping to provide certain basis and guidance for the preparation,researches and development of thermally conductive polymers and their composites.

Thermal Resistance of Common Rice Maintainer and Restorer Lines to High Temperature During Flowering and Early Grain Filling Stages

Fifteen common rice maintainer lines and 26 high-yielding restorer lines were used to evaluate their thermal resistance and fertility during flowering and early grain filling stages. The rice plants were subjected to high temperature stress （39-43 ℃） for 1-15 d from main stem flowering. Based on the heat stress index, they were divided into thermal resistant lines, semi-thermal resistant lines, semi-thermal sensitive lines and thermal sensitive lines. Therefore, the maintainer lines K22B, Bobai B and V20B belonged to thermal resistant lines, whereas 11-32B, Zhongzhe B and Zhong 9B belonged to thermal sensitive lines. For rice restorer lines, Minghui 63 had the highest thermal resistance, followed by R207, P32, P929, and the lowest thermal resistant lines P62-2-2, R8006 and P51. The correlation analysis indicated that the heat stress index was significantly correlated with seed-setting rate and abortive grain rate under heat stress, but not under natural conditions. This indicated that heat stress occurred during flowering and early grain filling stages mainly decreased the seed- setting rate and significantly increased the abortive grain rate in both rice maintainer and restorer lines.

Effect of contact thermal resistance on temperature distributions of concrete-filled steel tubes in fire

To predicate the temperature distribution of concrete-filled steel tubes(CFSTs) being exposure to fire,a finite element analysis model was developed using a finite element package,ANSYS.A suggested value of contact thermal resistance was therefore proposed with the supporting of massive numbers of collected test data.Parametric analysis was conducted subsequently towards the cross-sectional temperature distribution of CFST columns in four-side fire,in which the exposure time,width of the cross section,steel ratio were taken into account with considering contact thermal resistance.It was found that contact thermal resistance has little effect on the overall temperature regulation with the exposure time,the width of cross-section or the change of steel ratio.However,great temperature dropping at the concrete adjacent to the contact interface,and gentle temperature increase at steel tube,exist if considering contact thermal resistance.The results of the study are expected to provide theoretical basis for the fire resistance behavior and design of the CFST columns being exposure to fire.

Measurements of electron-phonon coupling factor and interfacial thermal resistance of metallic nano-films using a transient thermoreflectance technique

Using a transient thermoreflectance （TTR） technique, several Au films with different thicknesses on glass and SiC substrates are measured for thermal characterization of metMlic nano-films, including the electron phonon coupling factor G, interfazial thermal resistance R, and thermal conductivity Ks of the substrate. The rear heating-front detecting （RF） method is used to ensure the femtosecond temporal resolution. An intense laser beam is focused on the rear surface to heat the film, and another weak laser beam is focused on the very spot of the front surface to detect the change in the electron temperature. By varying the optical path delay between the two beams, a complete electron temperature profile can be scanned. Different from the normally used single-layer model, the double-layer model involving interfaciM thermal resistance is studied here. The electron temperature cooling profile can be affected by the electron energy transfer into the substrate or the electron-phonon interactions in the metallic films. For multiple-target optimization, the genetic algorithm （GA） is used to obtain both G and R. The experimental result gives a deep understanding of the mechanism of ultra-fast heat transfer in metals.

Effect of microstructure of Au80Sn20 solder on the thermal resistance TO56 packaged GaN-based laser diodes

Au80Sn20 alloy is a widely used solder for laser diode packaging.In this paper,the thermal resistance of Ga N-based blue laser diodes packaged in TO56 cans were measured by the forward voltage method.The microstructures of Au80Sn20 solder were then investigated to understand the reason for the difference in thermal resistance.It was found that the microstructure with a higher content of Au-rich phase in the center of the solder and a lower content of(Au,Ni)Sn phase at the interface of the solder/heat sink resulted in lower thermal resistance.This is attributed to the lower thermal resistance of Au-rich phase and higher thermal resistance of(Au,Ni)Sn phase.

Interfacial thermal resistance between high-density polyethylene(HDPE) and sapphire

To improve the thermal conductivity of polymeric composites, the numerous interfacial thermal resistance （ITR） inside is usually considered as a bottle neck, but the direct measurement of the ITR is hardly reported. In this paper, a sandwich structure which consists of transducer/high density polyethylene （HDPE）/sapphire is prepared to study the interface characteristics. Then, the ITRs between HDPE and sapphire of two samples with different HDPE thickness values are measured by time-domain thermoreflectance （TDTR） method and the results are -- 2 × 10-7 m2.K.W-1. Furthermore, a model is used to evaluate the importance of ITR for the thermal conductivity of composites. The model＇s analysis indicates that reducing the ITR is an effective way of improving the thermal conductivity of composites. These results will provide valuable guidance for the design and manufacture of polymer-based thermally conductive materials.

Thermal Resistance Testing Technology Research of Integration High Power-LED

In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point contact test method. According to the principle that LED forward voltage changes with temperature,LED heat sink to surface temperature distribution is studied directly in the test,and then we analyze the thermal resistance of high-power LED with many integrated chips when its secondary packaging is introduced. This method makes the measurement of thermal resistance of LED more rapid and convenient. It provides an effective assessment method for the analysis of high power LED device design and engineering application.

Thermal resistance matrix representation of thermal effects and thermal design in multi-finger power heterojunction bipolar transistors

The thermal resistance matrix including self-heating thermal resistance and thermal coupling resistance is presented to describe the thermal effects of multi-finger power heterojunction bipolar transistors. The dependence of thermal resistance matrix on finger spacing is also investigated. It is shown that both self-heating thermal resistance and thermal coupling resistance are lowered by increasing the finger spacing, in which the downward dissipated heat path is widened and the heat flow from adjacent fingers is effectively suppressed. The decrease of self-heating thermal resistance and thermal coupling resistance is helpful for improving the thermal stability of power devices. Furthermore, with the aid of the thermal resistance matrix a 10-finger power heterojunction bipolar transistor （HBT） with non-uniform finger spacing is designed for high thermal stability. The optimized structure can effectively lower the peak temperature while maintaining a uniformity of the temperature profile at various biases and thus the device effectively may operate at a higher power level.

Application of thermally stimulated acoustic emission method to assess the thermal resistance and related properties of coals

Traditional methods of coal thermal resistance characterization are informative but considerably timeconsuming and require utilization of a complex and expensive equipment. This limits the effectiveness of their application. In this paper, authors experimentally investigated potential application of thermally stimulated acoustic emission method for developing of relatively simple and rapid coals thermal resistance assessment method. Features of thermally stimulated acoustic emission of anthracite, lignites and bituminous coal samples subject to cyclic thermal loading have been experimentally investigated.For the first time, it has been shown that there exists a relationship of such patterns with structural parameters and properties of the coal samples, as well as their thermal resistance. The results indicate the possibility of applying the method of thermally stimulated acoustic emission to control processes of cryogenic disintegration and thermal resistance of fossil coals. The description of the equipment and methodological support needed for the implementation of this method have been provided.

Thermal resistance matrix representation of thermal effects and thermal design of microwave power HBTs with two-dimensional array layout

Based on the thermal network of the two-dimensional heterojunction bipolar transistors(HBTs) array, the thermal resistance matrix is presented, including the self-heating thermal resistance and thermal coupling resistance to describe the self-heating and thermal coupling effects, respectively.For HBT cells along the emitter length direction, the thermal coupling resistance is far smaller than the self-heating thermal resistance, and the peak junction temperature is mainly determined by the self-heating thermal resistance.However, the thermal coupling resistance is in the same order with the self-heating thermal resistance for HBT cells along the emitter width direction.Furthermore, the dependence of the thermal resistance matrix on cell spacing along the emitter length direction and cell spacing along the emitter width direction is also investigated, respectively.It is shown that the moderate increase of cell spacings along the emitter length direction and the emitter width direction could effectively lower the self-heating thermal resistance and thermal coupling resistance,and hence the peak junction temperature is decreased, which sheds light on adopting a two-dimensional non-uniform cell spacing layout to improve the uneven temperature distribution.By taking a 2 × 6 HBTs array for example, a twodimensional non-uniform cell spacing layout is designed, which can effectively lower the peak junction temperature and reduce the non-uniformity of the dissipated power.For the HBTs array with optimized layout, the high power-handling capability and thermal dissipation capability are kept when the bias voltage increases.

Micro-organic dust combustion considering particles thermal resistance

Organic dust flames deal with a field of science in which many complicated phenomena like pyrolysis or devolatization of solid particles and combustion of volatile particles take place. One-dimensional flame propagation in cloud of fuel mixture is analyzed in which flame structure is divided into three zones. The first zone is preheat zone in which rate of the chemical reaction is small and transfer phenomena play significant role in temperature and mass distributions. In this model, it is assumed that particles pyrolyze first to yield a gaseous fuel mixture. The second zone is reaction zone where convection and vaporization rates of the particles are small. The third zone is convection zone where diffusive terms are negligible in comparison of other terms. Non-zero Biot number is used in order to study effect of particles thermal resistance on flame characteristics. Also, effect of particle size on combustion of micro organic dust is investigated. According to obtained results, it is understood that both flame temperature and burning velocity decrease with rise in the Biot number and particle size.

Chemical and Thermal Resistance of Basalt Fiber in Inclement Environments

To study the applicability of the basalt fiber through various experimental works in thermal and chemical environments, glass fiber and carbon fiber were compared and discussed. The tensile strength testing was used to investigate the corrosive resistance of basalt fiber, meanwhile, surface study by scanning electron microscopy and microanalysis with complementary X-ray diffraction analysis （SEM/EDS） was also used to ascertain the durability of basalt fiber. The basalt fiber showed better strength retention than the glass fiber at relatively high temperature. Its tensile strength increased when exposed at 300 ~C for several hours, and still maintain about 70% of the initial strength at 400 ~C, whereas that of the glass fiber decreased dramatically. The better stability of the basalt fiber was observed in hydrothermal and chemical environment. The tensile strength of the basalt fiber increased by 20% after the immersion in boiling water and remained well in acid solution, when it comes to glass fiber, the tensile strength decreased to some extent. Although the alkali resistance of basalt fiber was poor at the initial stage, it shows better resistance than the glass fiber after long time treatment.

Comparison of Testing Clothing Thermal Resistance on 2 Thermal Manikins

The paper compares clothing thermal resistance of the same ensemble tested by different thermal manikins in different laboratories. It also examines the consistence of the two groups of total thermal resistance by Paired-Sample T Test method, which proves that there is no remarkable difference in testing results under the same experiment method and requirement. It is of great significance in promoting the application of thermal manikin testing technology and academic exchange among different institutes.

Measurement of Thermal Resistance of Heat-resistant Fabrics with a Guarded-hot-box

A novel analytical method with the guarded-hot-box (GHB) in investigating the thermal resistance of heat-resistant fabrics is described and the analytical method is also presented in this paper. The new apparatus is capable of measure thermal resistance of the fabrics in high temperature up to an average applied temperature of 250℃. The maximum measurement error of the apparatus is 6.5% and relative error is less than 2.8% between the introduced method and standard given value. In the GHB method, air layer thickness is the most important factor that influences measurement value of thermal resistance of heat-resistant fabrics. Results show that the method is more accurate and efficient than GB11048-89 one in measuring thermal resistance of heat-resistant fabrics.

Thermal Resistance of Graphite Plastics Based on Aromatic Polyamide

The paper presents the results of studying graphite plastics based on heat-resistant polyamide by thermogravimetric analysis (TGA), as well as the determination of mechanisms and kinetic parameters by the Koats-Redfern method. Based on the results of the thermal analysis, the mechanisms and kinetic parameters of the thermal destruction process were determined, namely: graphite injection increases the heat resistance of graphite plastics by 2 (graphite content 10% by weight) - 22% (graphite content 50% by weight) and reduces the activation energy of the process thermal destruction almost 2 times. This makes it possible to improve the technological parameters for the production of polymeric composite materials, which are limited by a narrow interval between the flow temperatures and the thermal destruction of phenylone C-2.

Surface Temperatures Determination with Influencing Convective and Radiative Thermal Resistance Parameters of Combustor of Gas Turbine

Surface temperatures were determined with due consideration of the influencing thermal conditions of conductive, convective and radiative heat. A general condition of heat influx to a point was formulated with the end effect of such influx to the receiving point. It was noted that the heat flow will cause a rate of change of internal energy of the point. Based on the theory of the rate of change of internal energy, a combustor model of cylindrical cross-section was used to generate out the timely temperature equation. Further work was done on this model equation to convert it to non-dimensional. The conversion of this equation was very essential in summing up the parameters that can influence the timely generation of the temperatures. Interestingly, it is noted that when a material withstands temperatures, it will equally withstand the thermal stresses that inherently will be developed in it. From the results, the work came up with a table showing the range of these slope figures of equations, a point was also found for a vital recommendation for further studies, where such figures can be used to check the suitability for thermal stress levels and the lifetime of combustor of such thickness.

A Detailed Thermal Resistance Network Analysis of FCBGA Package

Using thermal models to describe the heat dissipation process of FCBGA is a significant topic in the field of packaging.However,the thermal resistance model considering the structure of each part of the chip is still ambiguous and rare,but it is quite desirable in engineering.In this work,we propose a detailed thermal resistance network model,and describe it by using thermal conduction resistance and thermal spreading resistance.For a striking FCBGA case,we calculated the thermal resistance of each part of the structure according to the temperature field simulated by COMSOL.The thermal resistance network can be used to predict the temperatures in the chip under different conditions.For example,when the power changes by 40%,the relative error of junction temperature prediction is only 0.24%.The function of the detailed thermal resistance network in evaluating the optimization space and determining the optimization direction is clarified.This work illustrates a potential thermal resistance analysis method for electronic devices such as FCBGA.

Prediction and parametric analysis of 3D borehole and total internal thermal resistance of single U-tube borehole heat exchanger for ground source heat pumps

The borehole and total internal thermal resistance are both significant parameters in evaluating the thermal performance of the ground source heat pump.This study aimed to obtain the accurate correlation of the 3D borehole and total internal thermal resistance(R_(b,3D)and R_(a,3D))and analyze the impacts of parameters on the R_(b,3D)and R_(a,3D).Firstly,eight parameters affecting the R_(b,3D)and R_(a,3D),including the borehole diameter,pipe diameter,pipe-pipe distance,borehole depth,soil thermal conductivity,grout thermal conductivity,pipe thermal conductivity,and fluid velocity inside the pipe,were considered and an L-54 design matrix was generated.Then,the 3D numerical model,coupling with the four-resistance model,was proposed to calculate R_(b,3D)and R_(a,3D)for each case.After that,the response surface methodology was employed to obtain and verify the correlation of R_(b,3D)and R_(a,3D),which were compared with the existing resistance calculation methods.Lastly,analysis of variance was carried out to reveal parameters that have statistically significant impacts on the R_(b,3D)and R_(a,3D).Results show that the rationality and accuracy of the correlation of R_(b,3D)and R_(a,3D)can be verified by the determination coefficient and P value of regression model,as well as the P value of lack-of-fit.The existing resistance calculation methods are more or less inaccurate and the discrepancies in some cases can be up to 86.74%and 111.35%for the borehole and total internal thermal resistance.The pipe and grout thermal conductivity,pipe and borehole diameter,and the pipe-pipe distance can be seen as the significant contributory factors to the variation of R_(b,3D)and R_(a,3D).

Preparation and Thermal Shock Resistance of Mullite Ceramics for High Temperature Solar Thermal Storage

Mullite thermal storage ceramics were prepared by low-cost calcined bauxite and kaolin.The phase composition,microstructure,high temperature resistance and thermophysical properties were characterized by modern testing techniques.The experimental results indicate that sample A3(bauxite/kaolin ratio of 5:5)sintered at 1620℃has the optimum comprehensive properties,with bulk density of 2.83 g·cm^(-3)and bending strength of 155.44 MPa.After 30 thermal shocks(1000℃-room temperature,air cooling),the bending strength of sample A3 increases to 166.15 MPa with an enhancement rate of 6.89%,the corresponding thermal conductivity and specific heat capacity are 3.54 W·(m·K)^(-1)and 1.39 kJ·(kg·K)^(-1)at 800℃,and the thermal storage density is 1096 kJ·kg^(-1)(25-800 mullite ceramics;sintering properties;high-temperature thermal storage;thermal shock resistance).Mullite forms a dense and continuous interlaced network microstructure,which endows the samples high thermal storage density and high bending strength,but the decrease of bauxite/kaolin ratio leads to the decrease of mullite content,which reduces the properties of the samples.

Polyarylene Ether Nitrile and Titanium Dioxide Hybrids as Thermal Resistant Dielectrics

With the expanding application of capacitors,thermal resistant dielectric materials are in high demand due to the increasing harsh environments where the capacitors are needed and the heat generated by the capacitors.Herein,we present polyarylene ether nitrile and titanium dioxide hybrids which can be used as thermal resistant dielectrics for these capacitors.Phthalonitrile modified titanium dioxide(TiO_(2)-CN)and phthalonitrile end-capped polyarylene ether nitrile(PEN-Ph)are firstly prepared.After being cast into TiO_(2)-CN/PEN nanocomposite films,these composites self-crosslink upon heating at 320℃for 4 h,forming the polyarylene ether nitrile and titanium dioxide hybrids(TiO_(2)-PEN).Improved dielectric constants which are stable from room temperature to 200℃of these hybrids are observed,indicating the potential application of the hybrids as thermal resistant dielectrics.