Thermal Stresses and Cracks During the Growth of Large-sized Sapphire with SAPMAC Method

The finite-element method has been used to study the thermal stress distribution in large-sized sapphire crystals grown with the sapphire growth technique with micro-pulling and shoulder-expanding at cooled center （SAPMAC） method. A critical defect model has been established to explain the growth and propagation of cracks during the sapphire growing process. It is demonstrated that the stress field depends on the growth rate, the ambient temperature and the crystallizing direction. High stresses always exist near the growth interfaces, at the shoulder-expanding locations, the tailing locations and the sites where the diameters undergo sharp changes. The maximum stresses always occur at the interface of seeds and crystals. Cracks often form in the critical defect region and spread in the m-planes and a-planes under applied tensile stresses during crystal growth. The experimental results have verified that with the improved system of crystal growth and well-controlled techniques, the large-sized sapphire crystals of high quality can be grown due to absence of cracks.

THERMAL STRESS FIELD WHEN CRACK ARREST IN AN AXIAL SYMMETRY METAL DIE USING ELECTROMAGNETIC HEATING

In order to solve the thermal stress field around crack tip in metal die when crack prevention using electromagnetic heating, a metal die with a half-embedded round crack was selected as the study object. The complex function method was used as a basis for the theoretical model of the space crack prevention in metal dies using electromagnetic heating. The crack arrest was accomplished by a pulse current discharge through the inner and outer. The theoretical analysis results show that the temperature around the crack tip rises instantly above the melting point of the metal. Small welded joints are formed at a small sphere near the crack tip inside the metal die by metal melting as a result of the heat concentration effect when the current pulse discharged. The thermal compressive stress field appears around the crack tip at the moment. The research results show that the crack prevention using electromagnetic heating can decrease the stress concentration and forms a compressive stress area around the crack tip, and also prevents the main crack from propagating further, and the goal of crack preventing can be reached.

Modeling and simulation of 3D thermal stresses of large-sized castings in solidification processes

When heavy machines and large scaled receiver system of communication equipment are manufactured, it always needs to produce large-sized steel castings, aluminum castings and etc. Some defects of hot cracking by thermal stress often appear during solidification process as these castings are produced, which results in failure of castings. Therefore predicting the effects of technological parameters for production of castings on the thermal stress during solidification process becomes an important means. In this paper, the mathematical models have been established and numerical calculation of temperature fields by using finite difference method (FDM) and then thermal stress fields by using finite element method (FEM) during solidification process of castings have been carried out. The technological parameters of production have been optimized by the results of calculation and the defects of hot cracking have been eliminated. Modeling and simulation of 3D thermal stress during solidification processes of large-sized castings provided a scientific basis, which promoted further development of advanced manufacturing technique.

THERMAL FRACTURE OF FUNCTIONALLY GRADED PLATE WITH PARALLEL SURFACE CRACKS

This work examines the fracture behavior of a functionally graded material （FGM） plate containing parallel surface cracks with alternating lengths subjected to a thermal shock. The thermal stress intensity factors （TSIFs） at the tips of long and short cracks are calculated using a singular integral equation technique. The critical thermal shock △Tc that causes crack initiation is calculated using a stress intensity factor criterion. Numerical examples of TSIFs and △Tc for an Al2O3/Si3N4 FGM plate are presented to illustrate the effects of thermal property gradation, crack spacing and crack length ratio on the TSIFs and △Tc. It is found that for a given crack length ratio, the TSIFs at the tips of both long and short cracks can be reduced significantly and △Tc can be enhanced by introducing appropriate material gradation. The TSIFs also decrease dramatically with a decrease in crack spacing. The TSIF at the tips of short cracks may be higher than that for the long cracks under certain crack geometry conditions. Hence, the short cracks instead of long cracks may first start to grow under the thermal shock loading.

Influence of Patch Side of Heat-Ray Absorbing Film on One-Dimensional Unsteady Thermal Stresses in Window Glass

Heat-ray absorbing film is used to be bonded on the existing sheet glasses of the windows.It is effective for air-conditioning energy saving against the global warming,because it absorbs heat-ray in the thin film and decreases the incoming heat-ray into the room.On the other hand,the sheet glasses increase the temperature at the surface which the sheet is bonded and sometimes yield heat cracks by thermal stresses.It is important to know the state of thermal stresses accurately in order to develop the heat-ray absorbing film with higher performance and without heat cracks.In this paper,the analysis model is treated as the two-layer plate of the conventional soda sheet glass and the heat-ray absorbing film with different absorptivities.The unsteady temperature and thermal stresses are analyzed and calculated numerically.The influence of the patch side,which the heat-ray absorbing film is bonded at the exterior side or the interior side,on the heat-ray absorbing performance and the thermal stresses is discussed.It is found that the alternative patch side has no effect on the heat-ray absorbing performance and that the patch side is recommended to be interior side from a view point of decreasing thermal stresses against the heat crack of glasses.

Crack patterns corresponding to the residual strength plateau of ceramics subjected to thermal shock

The formation strength plateau of ceramics is addressed. A set of of 99A1203 are conducted, mechanism of the residual subjected to thermal shock thermal shock experiments where the thin specimens of 1 mm× 10 mm×50 mm exhibit parallel through edge cracks, and thus permit quantitative measurements of the crack patterns. The cracks evolve with the severity of ther- mal shock. It is found that there is a correlation between the length and density of the thermal shock cracks. The increase of crack length weakens the residual strength, whereas the increase of crack density improves it. In a considerably wide temperature range, the two contrary effects just counteract each other; consequently a plateau appears in the variation curve of the residual strength. A comparison between the numerical and experimental results of the residual strength is made, and they are found in good agreement. This work is helpful to a deep understanding of the thermal shock failure of ceramics.

Finite element analysis of stresses and interface crack in TBC systems

Thermal barrier coatings have been used on high temperature components. Due to high stresses leading to unpredictable failure, a transient thermal-structural finite element solution was employed to analyze the stress distribution and J-integral at the interface between the bond coating and thermally growing oxide(TGO) in the EB-PVD thermal barrier coatings subjected to thermal loadings. The effects of some environmental and material parameters were studied, such as thermal convection coefficient, ceramic elastic modulus and TGO thickness. The results show that the stresses and J-integral values are impacted by these parameters.

One-Dimensional-Unsteady Thermal Stress in Heat-Ray Absorbing Sheet Glass:Influence of a Sudden Weather Change

Heat-ray absorbing sheet glass can decrease electric energy used for air-conditioning by controling the incoming heat-ray through windows into the rooms.On the other hand,the glasses increase the temperature and sometimes yield heat cracks by thermal stresses.It is important to know the state of thermal stress accurately in order to develop heat-ray absorbing sheet glasses with higher performance and without heat cracks.A conventional design manual at field site treats the steady state and the thermal boundary condition that all heat-rays are absorbed at glass surface.In this paper,it is assumed that the heat-ray is absorbed over all the plate thickness.The idea of the local absorptibity per unit length is introduced.The modeling of internal heat absorbing process is proposed.It can explain well that the total absorptivity depends on the plate thickness.The temperature and the thermal stresses are calculated and discussed.Sudden weather changes such as rain and/or wind after the glass is heated to be steady state are also discussed.Those weather changes are treated with the change of amount of absorbed heat-ray and/or the change of heat transfer coefficient between the glass surface and the outside atmosphere.

超大规格2024铝合金扁锭开裂行为研究

随着航空航天大型结构件尺寸的增大,高强铝合金铸锭的尺寸也要增大,铸锭成型难度也随之增大。通过铸造过程数值模拟研究了铸造速度和刮水器位置对500 mm×2300 mm和600 mm×2500 mm规格2024铝合金扁铸锭温度场及应力场的影响规律。结果表明,铸造速度对液穴深度影响最大,提升铸造速度能够大幅降低铸锭内应力,但是大幅增加了液穴深度,不利于减轻铸锭疏松和热裂;提升刮水器位置可以大幅降低铸锭的应力。提出了降低铸造速度的同时提升刮水器位置的工艺优化方向,该工艺可以制备超大规格2024铝合金扁铸锭。

灰岩在烧变过程中的热破裂机制试验研究

自燃煤层围岩在不同高温作用下会引起不同程度的结构损伤,导致其物理力学性质和工程地质效应发生显著变化。为深入认识烧变过程中岩石的结构演化规律,以徐州某矿底板灰岩为研究对象,开展不同温度作用下的热破裂试验,从多尺度上探究岩石热破裂的规律,并结合数值模拟和微观结构测试揭示其发育机理。结果显示:(1)方解石填充裂隙、层理等相对软弱结构面的热破裂温度阈值在300~400℃,完整岩石结构的热破裂温度阈值在500℃左右;600℃之前的热破裂形态较简单,基本是直线型裂纹,且宽度较小、数量较少;700℃以上出现宽度和长度显著增大的弧形热裂纹,热裂纹两侧试样的颜色有明显区别,靠近热裂纹的白色部位还发育一些连通弧形裂纹的次级小裂纹;800℃时,试样颜色全部变白,结构完全破碎,成散体状。(2)从微观结构和热应力角度阐释灰岩热破裂发育机理,发现试验温度路径下试样的热破裂主要发育在降温过程中,且最大热应力差主要在靠近试样表面的近似环形带上分布。500℃以下的热破裂成因主要为热应力在试样的原始缺陷处集中,并超过了部分软弱结构的抗拉强度;500℃以上受热应力与矿物分解共同控制,500℃以上升降温过程中的最大热应力基本超过灰岩的抗拉强度,且菱镁矿、白云母、白云石等矿物逐渐分解,逐渐增多的内部缺陷为应力集中提供有利条件,加剧了热破裂的发育;当温度达到800℃时,热破裂发育程度很高,且白云石和方解石快速分解,生成CaO,部分CaO在冷却过程中与空气接触生成Ca(OH)2,热裂纹与主体矿物分解共同导致试样结构的破碎。研究成果可为岩体破裂和地质结构演化分析奠定基础。

氧化铝耐火材料制备中热应力有限元分析

氧化铝耐火材料在制备过程中所产生的裂纹等轻微损伤,是潜在的安全风险。为提高材料的使用性能,研究了在烧成过程中模型尺寸、热处理温度、升温速率、降温速率以及气孔率等因素对氧化铝耐火材料裂纹产生的影响。结果表明:在模型尺寸增大时,对应的最大热应力值也随之增大,产生裂纹的风险也越大;最大热应力峰值出现在1200~1600℃温度区间内;只改变1000~1350℃温度区间内的升温速率时,升温速率越大对应的最大热应力值越大;窑炉从1600℃降到室温时,降温初期最大热应力值迅速增大,且降温速率越大对应的最大热应力值越大;对于气孔率分别为5%、7%和10%的氧化铝砖坯,在相同的烧成条件下,气孔率10%砖坯的最大热应力值于1200℃、1300℃、1400℃及1500℃均最小,因此气孔率为10%比5%和7%更有利于降低烧成过程中裂纹产生的风险。

冷热原油顺序输送管道热应力与疲劳寿命分析

近年来,随着国外原油进口量的持续攀升以及国内油田产量的下降,管道输送出现了不同油品需要用同一条输油管线共同输送的情况。以庆铁四线管道为例,结合实际参数,应用ANSYS有限元分析方法,采用六面体结构性网格对管壁进行离散化处理,对埋地管道热结构耦合问题进行求解,分别计算了直管段和弯管段在不同温度下的热应力;基于断裂力学理论,计算了不同服役寿命下的年循环周期极限,分析了温度交替变化对管道疲劳寿命的影响。实验结果为冷热原油管道安全输送提供了理论依据。

寒冷地区堆石混凝土坝温度应力仿真分析——以东庄二道坝为例

针对寒区堆石混凝土坝内外温差引起坝体裂缝问题,以东庄二道坝为依托,基于工程图纸进行网格划分和三维建模,进行三维有限元模型计算,对堆石混凝土重力坝温度应力场进行仿真分析,并结合工程实测数据进行参数反演标定。结果表明:施工期坝体拉应力在冬季呈现较高水平,拉应力主要出现在坝体上下游面一定厚度的表层区,尤以中下部高程的抗冲耐磨混凝土拉应力最大;在冬季内部拉应力明显高于坝的两侧,两个坝段宽度方向均出现超过允许应力的情况。建议将短缝加深四层有限元单元,坝体稳定性得到较大提高,工程量相对较小,既安全又经济,为最优方案。

多层瓷介电容器手工焊接质量提升

手工焊接后的多层瓷介电容器在温度循环试验过程中发生烧毁故障,故障原因为焊接过程中热应力较大导致器件本体生成裂纹。设计手工焊接试验,并经验证得出结论:在手工焊接过程中,通过降低手工焊接温度,增加焊接前印制电路板(PCB)的预热,可以避免器件本体产生裂纹;在产品设计阶段,避免选用较大尺寸封装,为PCB设计非接地焊盘,可以提高手工焊接的工艺窗口,从而提升多层瓷介电容器手工焊接质量。

一维六方准晶非周期平面内中心开口裂纹的平面热弹性问题

考虑裂纹内部介质的热传导率,研究了一维六方准晶非周期平面内含中心开口裂纹的平面热弹性问题.利用Fourier积分变换技术,得到了热应力、裂纹尖端处的热应力强度因子和应变能密度因子的封闭解.数值结果讨论了裂纹内部介质的热传导率、外载荷及声子场-相位子场耦合系数对热应力强度因子和应变能密度因子的影响.结果表明,声子场-相位子场耦合系数对裂纹扩展影响较大.当声子场载荷较小或热流密度较大时,裂纹不易扩展,热流密度在裂纹尖端处会出现集中热效应.随着裂纹内部介质热传导率的增大,热流密度逐渐增加而热应力强度因子逐渐减小.该文所得结果为准晶热力学性质的实际应用提供了理论依据,进而可用于优化准晶元器件的设计和制备.

锅炉吹灰孔水冷壁管开裂原因分析

某热电机组锅炉吹灰孔处SA-210C水冷壁管发生开裂泄露,通过维氏硬度、金相分析、扫描电镜形貌与能谱分析等方法进行了原因分析。结果表明,水冷壁管吹灰位置的封板割缝根部结构尖锐,锅炉启停及负荷瞬时波动造成了水冷壁管及封板局部温度差异较大,产生循环热应力,导致水冷壁管的封板割缝根部的尖锐位置在热应力作用下发生开裂,形成启裂源,并在循环热应力的作用下发生疲劳开裂,造成水冷壁管开裂泄漏。

脉冲电流下对AL6061合金进行熔孔止裂与愈合的仿真研究

Al6061铝合金常应用于航空航天领域蒙皮制造,因其中等硬度与低强度的弱点,在承受复杂载荷时容易出现微裂纹,进而影响服役安全可靠性。脉冲电流是一种极速、非平衡的金属材料微小裂纹修复工艺,可以克服该材料不易焊接修复的短板。在既有的实验基础上建立单边预制裂纹缺口模型,采用有限元仿真手段,进行了热-电-力三场耦合数值模拟,计算不同参数下裂纹区域的电场、温度场和应力场分布。使用“生死单元”法模拟止裂熔孔的产生,并获得了不同几何、物理参数下止裂熔孔尺寸变化的规律。结果表明:焦耳热形成的止裂熔孔降低裂尖的集中应力,抑制裂纹扩展,裂纹区域高温区与基体常温区形成温度梯度相互约束产生巨大的热压应力促使裂纹宽度减小,进而直至愈合;初始熔孔尺寸与裂纹长度成正比、与板厚成反比,最佳尺寸直径为0.1 mm以内;电流值和电流加载时间均能控制熔孔生长,电流值一定时,当时间达到0.12 s形成的熔孔尺寸超出最佳止裂尺寸范围。研究成果为特定金属材料的裂纹止裂与愈合提供了机理参考和仿真方法。

陶瓷介质滤波器焊接工艺技术研究

针对陶瓷介质滤波器装配焊接过程中出现介质胚体开裂的问题,通过对裂纹特征观察和材料物理性质分析,在金属屏蔽罩装接、印制板焊盘设计和回流焊工艺等方面进行改进。对焊接后的器件进行温度和力学等可靠性试验,产品测试合格率为100%,破坏性物理分析(DPA)剖样观察到介质滤波器不存在开裂或微裂纹的失效隐患。结果表明,该焊接工艺能解决陶瓷介质滤波器的焊接裂纹问题,实现了较高的产品可靠性。

TA2合金燃滑油散热器裂纹分析

TA2合金燃滑油散热器在试验两个小时后,滑油进口处出现泄露现象。经检查,发现管接嘴焊接的位置附近有一条明显的裂纹存在。通过对裂纹进行检查、断口宏观分析和微观分析、金相组织检查、能谱分析及氢含量测定,确定了裂纹的性质及产生原因。结果表明:TA2合金燃滑油散热器的材质正常,裂纹的性质为一次性热应力裂纹,裂纹在试验过程中有轻微的扩展现象;裂纹产生的原因主要是与焊接过程中产生的热应力有关,校正时应力对裂纹的产生也有一定的影响。

奥氏体不锈钢四通阀S接管开裂失效分析及对策

四通阀是制冷设备的核心部件,其可靠性直接影响产品的使用寿命。本文针对四通阀S接管的开裂失效样件,通过金相分析、材料成分测试、扫描电镜及能谱分析等方法,结合相关文献对S接管喇叭口发生开裂的原因及机理进行深入分析,得出S接管的开裂失效机理为“铜脆”,并提出相应的解决措施。