The thermal diffusion coefficient, thermal conductivity, and thermal expansion coefficient of CuCr alloy prepared by infiltration were measured by thermal constant tester and dilatometer before and after high pressure...The thermal diffusion coefficient, thermal conductivity, and thermal expansion coefficient of CuCr alloy prepared by infiltration were measured by thermal constant tester and dilatometer before and after high pressure heat treatment, at the same time, the effect of high pressure treatment on the thermal physical properties of CuCr alloy was discussed by the analysis of its microstructure. The experimental results show that high pressure heat treatment can increase the thermal diffusion coefficient and thermal conductivity of CuCr alloy, but it changes slightly in the pressure range of 1-6 GPa. As for thermal expansion coefficient, when the temperature is higher than 130 °C, it is obviously higher than that of the alloy without high pressure treatment after 1 GPa pressure treatment, and the higher the temperature is, the larger their differences are.展开更多
基金financially supported by the Natural Science Foundation of Hebei Province (CHN) (No. E2010001174)
文摘The thermal diffusion coefficient, thermal conductivity, and thermal expansion coefficient of CuCr alloy prepared by infiltration were measured by thermal constant tester and dilatometer before and after high pressure heat treatment, at the same time, the effect of high pressure treatment on the thermal physical properties of CuCr alloy was discussed by the analysis of its microstructure. The experimental results show that high pressure heat treatment can increase the thermal diffusion coefficient and thermal conductivity of CuCr alloy, but it changes slightly in the pressure range of 1-6 GPa. As for thermal expansion coefficient, when the temperature is higher than 130 °C, it is obviously higher than that of the alloy without high pressure treatment after 1 GPa pressure treatment, and the higher the temperature is, the larger their differences are.
