Thermoelastic stress analysis of multilayered films in a micro-thermoelectric cooling device

This paper presents an analytical solution for the thermoelastic stress in a typical in-plane＇s thin-film micro- thermoelectric cooling device under different operating con- ditions. The distributions of the permissible temperature fields in multilayered thin-films are analytically obtained, and the characteristics, including maximum temperature dif- ference and maximum refrigerating output of the thermo- electric device, are discussed for two operating conditions. Analytical expressions of the thermoelastic stresses in the layered thermoelectric thin-films induced by the tempera- ture difference are formulated based on the theory of mul- tilayer system. The results demonstrate that, the geometric dimension is a significant factor which remarkably affects the thermoelastic stresses. The stress distributions in layers of semiconductor thermoelements, insulating and support- ing membrane show distinctly different features. The present work may profitably guide the optimization design of high- efficiency micro-thermoelectric cooling devices.

A general White–Box strategy for designing thermoelectric cooling system

Thermoelectric cooling(TEC)is critically important in thermal management of laser modules or chips and potentially for personalized thermoregulation.The formulae for efficiency in standard textbooks can only describe the performance of a TEC module with ideal thermal conditions,that is,fixed terminal temperatures,but are unable to deal with a real TEC system where heat transfer at its interfaces with the heat source and sink are finite and with thermal resistances.Here,we define the TEC system-level performance indices,that is,the maximum cooling power,temperature difference,and coefficient of performance,by introducing a set of explicit formulae.The external heat transfer conditions are taken into account as dimensionless thermal resistance parameters.With these formulae,the TEC system performances are evaluated elegantly with errors well within±5%over broad operating conditions.We further optimize the cooling power and the coefficient of performance in practical scenarios and establish a general White–Box design procedure for TEC systems,which enables a transparent design process and straightforward analysis of performance bottlenecks.A set of cooling experiments are performed to validate the analytical model and to illustrate the dependence of system design on realistic thermal conditions.By choosing the suitable TEC module parameter under given external heat transfer conditions,the cooling power can be improved by more than 100%.This work sheds some light on the integral design of TEC systems for broad applications to take full advantage of the advanced thermoelectric materials in the cooling field.

STUDY ON SYNTHESIS PROPERTIES STRUCTURES AND APPLICATIONS OF CERAMIC SEMICONDUCTOR COOLING MATERIALS (CFCC)

Pseudoternary system (Bi2Te3-Sb2Te3-Sb2Se3) ceramic smeiconductor cooling materials were prepared in solid stare reaction with conventional techniques of sintering ceramics. The effect of doping on the properties of the material was studied. X-ray diffraction analysis showed that n-p-type materials were solid solutions based on Bi2Te3 and Sb2Te3 respectively. SEM photographs proved that the both types of materials were inhomogeneous and layer structure. The values of fingure of merit for n-type and p-type materials were 3.4 X 10(-3) K-1, respectively. The fabricated thermoelectric modules made of the materials provided excellent cooling effect.

Comprehensive energy, economic, environmental assessment of a building integrated photovoltaic-thermoelectric system with battery storage for net zero energy building

To realize the goal of net zero energy building(NZEB),the integration of renewable energy and novel design of buildings is needed.The paths of energy demand reduction and additional energy supply with renewables are separated.In this study,those two are merged into one integration.The concept is based on the combination of photovoltaic,thermoelectric modules,energy storage and control algorithms.Five types of building envelope systems,namely PV+TE(S1),Grid+TE(S2),PV+Grid+TE(S3),PV+Battery+TE(S4)and PV+Grid+Battery+TE(S5)are studied,from aspects of energy,economic and environmental(E3)performance.The new envelope systems can achieve thermal load reduction while providing additional cooling/heating supply,which can promote advance of NZEBs.It is found that there is a typical optimum setting of thermal energy load for each one of them with minimum annual power consumption.Except for the S1 system,the rest can realize negative accumulated power consumption in a year-round operation,which means the thermal load of building envelope could be zero.The uniform annual cost for S1 to S5 under interest rate of 0.04 are 19.78,14.77,23.83,60.53,64.94$/m2,respectively.The S5 system has the highest environmental effect with 3.04 t/m2 reduction of CO_(2) over 30 years of operation.

System-level Pareto frontiers for on-chip thermoelectric coolers

The continuous rise in heat dissipation of integrated circuits necessitates advanced thermal solutions to ensure system reliability and efficiency. Thermoelectric coolers are among the most promising techniques for dealing with localized on-chip hot spots. This study focuses on establishing a holistic optimization methodol- ogy for such thermoelectric coolers, in which a thermo- electric element＇s thickness and the electrical current are optimized to minimize source temperature with respect to ambient, when the thermal and electrical parasitic effects are considered. It is found that when element thickness and electrical current are optimized for a given system architecture, a ＂heat flux vs. temperature difference＂ Pareto frontier curve is obtained, indicating that there is an optimum thickness and a corresponding optimum current that maximize the achievable temperature reduc- tion while removing a particular heat flux. This methodol- ogy also provides the possible system level AT＇s that can be achieved for a range of heat fluxes, defining the upper limits of thermoelectric cooling for that architecture. In this study, use was made of an extensive analytical model, which was verified using commercially available finite element analysis software. Through the optimization process, 3 pairs of master curves were generated, which were then used to compose the Pareto frontier for any given system architecture. Finally, a case study wasperformed to provide an in-depth demonstration of the optimization procedure for an example application.