Perovskites are a category of materials with a unique crystal structure that allows them to absorb sunlight efficiently. This efficiency is particularly high in the case of CH<sub>3</sub>NH<sub>3<...Perovskites are a category of materials with a unique crystal structure that allows them to absorb sunlight efficiently. This efficiency is particularly high in the case of CH<sub>3</sub>NH<sub>3</sub>Pb<sub>1-x</sub>Sn<sub>x</sub>I<sub>3</sub> mixed perovskites. The combination of lead (Pb) and tin (Sn) in this matrix provides a broad spectrum of sunlight absorption, enabling the generation of a larger voltage and, subsequently, increased power. The primary objective in solar cell development is to maximize the conversion of sunlight into electricity. Mixed perovskites like CH<sub>3</sub>NH<sub>3</sub>Pb<sub>1-x</sub>Sn<sub>x</sub>I<sub>3</sub> have demonstrated significant potential in this regard. Their tunable bandgap, courtesy of varying the Pb: Sn ratio, allows for the optimization of sunlight absorption. The result is solar cells that surpass many conventional counterparts in terms of energy efficiency. Another significant advantage of these mixed perovskite solar cells is their cost-effectiveness. They can be manufactured using solution-based processes, which are less expensive than the high-vacuum methods required for traditional silicon solar cells. While the prospects for mixed perovskite solar cells are undeniably promising, there are concerns about the toxicity of lead, a key component of these cells. Lead is known to have harmful effects on the environment and health. The aim of our work is to reduce or eliminate lead toxicity in the perovskite cell while maintaining its efficiency. Thus, in a theoretical and experimental approach, we obtained following efficiencies of samples: CH<sub>3</sub>NH<sub>3</sub>PbI<sub>3</sub> (22.49%) CH<sub>3</sub>NH<sub>3</sub>Pb<sub>0.75</sub>Sn<sub>0.25</sub>I<sub>3</sub> (22.72%), CH<sub>3</sub>NH<sub>3</sub>Pb<sub>0.5</sub>Sn<sub>0.5</sub>I<sub>3</sub> (23.00%) CH<sub>3</sub>NH<sub>3</sub>Pb<sub>0.25</sub>Sn<sub>0.75</sub>I<sub>3</sub> (22.61%), CH<sub>3</sub>NH<sub>3</sub>SnI<sub>3</sub> (22.38%). Doping with 50% tin gives the highest result (23.00%). By replacing a fraction of the lead with tin, the research aims to reduce the environmental footprint of the cells while maintaining their high performance. However, the challenge is to achieve a balance that does not compromise performance while reducing toxicity. .展开更多
The research on the influence of RE on the directional solidified microstructure of tin lead alloy reveals that the addition of RE can cause chopping and irregular lamellar and smaller lamellar spacing. When RE conte...The research on the influence of RE on the directional solidified microstructure of tin lead alloy reveals that the addition of RE can cause chopping and irregular lamellar and smaller lamellar spacing. When RE content increases, the microstructure changes to peritectic structure. Moreover, the eutectic point of Sn Pb alloy deviates because the affinity of RE for Sn, which results in the existence of primary Pb rich phases contained hypocutectic grown layers. Sn RE intermetallic compound has no effect on the solidification of Sn Pb alloy.展开更多
By employing the minimum energy theorem, the Potential energy controlling equation, which consists of surface energy and gravitational energy for molten meniscus, was investigated. The soder joint geometry of molten t...By employing the minimum energy theorem, the Potential energy controlling equation, which consists of surface energy and gravitational energy for molten meniscus, was investigated. The soder joint geometry of molten tin-lead soder alloy for chip component and thin quad flat package were simulated with finite element method. The simulation results 0f solder joint geometry are coincident well with the experimental results. The solder joint geometry was applied to study the solder joint reliability for chip component RC3216.The thermal cycling tests revealed that the solder joint geometry plays an important ro1e in solder joint reliability.展开更多
The temperature rise caused by plastic deformation during the quick upsetting of tin-lead alloy and mild steel was investigated via experiments and numerical simulations aiming at a better understanding of the heat ge...The temperature rise caused by plastic deformation during the quick upsetting of tin-lead alloy and mild steel was investigated via experiments and numerical simulations aiming at a better understanding of the heat generation mechanism in friction welding. The results show that the compression amount and deformation temperature influence significantly the temperature rise during the upsetting of tin-lead alloy. The temperature rise increases with increasing the compression but decreases with increasing the deformation temperature. The simulation results are in good agreement with the experimental inspection for Sn63A alloy. The simulation results of mild steel present a similar tendency with tin-lead alloy. Moreover, the temperature rise of mild steel at elevated temperatures is comparable to that of tin-lead alloy at low temperatures.展开更多
Copper serpentines used in gas heaters are currently coated with lead-tin alloy using hot-dip technology where copper is immersed in molten lead (98%)-Tin at about 400°C. The major drawback of this technique i...Copper serpentines used in gas heaters are currently coated with lead-tin alloy using hot-dip technology where copper is immersed in molten lead (98%)-Tin at about 400°C. The major drawback of this technique is the pollution resulted from lead vapors which cause much harm to the labors in the unit. The present work investigates an eco-friendly plating technique to replace the currently used technology. Electroless plating of copper samples with lead or Lead (98%)-Tin alloy is carried out from a plating bath contained lead salt, tin salt, reducing agent and stabilizing agent. The parameters affecting the coating quality such as the plating time, temperature and bath composition were optimized. The chemical analysis and coating morphology of the formed coatings are examined by XRD, SEM and EDS to reach the best bath composition as well as the best conditions to coat copper with lead or lead-tin electrolessly. The electrochemical properties of copper and copper coated samples are also examined using electrochemical impedance spectroscopy.展开更多
文摘Perovskites are a category of materials with a unique crystal structure that allows them to absorb sunlight efficiently. This efficiency is particularly high in the case of CH<sub>3</sub>NH<sub>3</sub>Pb<sub>1-x</sub>Sn<sub>x</sub>I<sub>3</sub> mixed perovskites. The combination of lead (Pb) and tin (Sn) in this matrix provides a broad spectrum of sunlight absorption, enabling the generation of a larger voltage and, subsequently, increased power. The primary objective in solar cell development is to maximize the conversion of sunlight into electricity. Mixed perovskites like CH<sub>3</sub>NH<sub>3</sub>Pb<sub>1-x</sub>Sn<sub>x</sub>I<sub>3</sub> have demonstrated significant potential in this regard. Their tunable bandgap, courtesy of varying the Pb: Sn ratio, allows for the optimization of sunlight absorption. The result is solar cells that surpass many conventional counterparts in terms of energy efficiency. Another significant advantage of these mixed perovskite solar cells is their cost-effectiveness. They can be manufactured using solution-based processes, which are less expensive than the high-vacuum methods required for traditional silicon solar cells. While the prospects for mixed perovskite solar cells are undeniably promising, there are concerns about the toxicity of lead, a key component of these cells. Lead is known to have harmful effects on the environment and health. The aim of our work is to reduce or eliminate lead toxicity in the perovskite cell while maintaining its efficiency. Thus, in a theoretical and experimental approach, we obtained following efficiencies of samples: CH<sub>3</sub>NH<sub>3</sub>PbI<sub>3</sub> (22.49%) CH<sub>3</sub>NH<sub>3</sub>Pb<sub>0.75</sub>Sn<sub>0.25</sub>I<sub>3</sub> (22.72%), CH<sub>3</sub>NH<sub>3</sub>Pb<sub>0.5</sub>Sn<sub>0.5</sub>I<sub>3</sub> (23.00%) CH<sub>3</sub>NH<sub>3</sub>Pb<sub>0.25</sub>Sn<sub>0.75</sub>I<sub>3</sub> (22.61%), CH<sub>3</sub>NH<sub>3</sub>SnI<sub>3</sub> (22.38%). Doping with 50% tin gives the highest result (23.00%). By replacing a fraction of the lead with tin, the research aims to reduce the environmental footprint of the cells while maintaining their high performance. However, the challenge is to achieve a balance that does not compromise performance while reducing toxicity. .
文摘The research on the influence of RE on the directional solidified microstructure of tin lead alloy reveals that the addition of RE can cause chopping and irregular lamellar and smaller lamellar spacing. When RE content increases, the microstructure changes to peritectic structure. Moreover, the eutectic point of Sn Pb alloy deviates because the affinity of RE for Sn, which results in the existence of primary Pb rich phases contained hypocutectic grown layers. Sn RE intermetallic compound has no effect on the solidification of Sn Pb alloy.
文摘By employing the minimum energy theorem, the Potential energy controlling equation, which consists of surface energy and gravitational energy for molten meniscus, was investigated. The soder joint geometry of molten tin-lead soder alloy for chip component and thin quad flat package were simulated with finite element method. The simulation results 0f solder joint geometry are coincident well with the experimental results. The solder joint geometry was applied to study the solder joint reliability for chip component RC3216.The thermal cycling tests revealed that the solder joint geometry plays an important ro1e in solder joint reliability.
文摘The temperature rise caused by plastic deformation during the quick upsetting of tin-lead alloy and mild steel was investigated via experiments and numerical simulations aiming at a better understanding of the heat generation mechanism in friction welding. The results show that the compression amount and deformation temperature influence significantly the temperature rise during the upsetting of tin-lead alloy. The temperature rise increases with increasing the compression but decreases with increasing the deformation temperature. The simulation results are in good agreement with the experimental inspection for Sn63A alloy. The simulation results of mild steel present a similar tendency with tin-lead alloy. Moreover, the temperature rise of mild steel at elevated temperatures is comparable to that of tin-lead alloy at low temperatures.
文摘Copper serpentines used in gas heaters are currently coated with lead-tin alloy using hot-dip technology where copper is immersed in molten lead (98%)-Tin at about 400°C. The major drawback of this technique is the pollution resulted from lead vapors which cause much harm to the labors in the unit. The present work investigates an eco-friendly plating technique to replace the currently used technology. Electroless plating of copper samples with lead or Lead (98%)-Tin alloy is carried out from a plating bath contained lead salt, tin salt, reducing agent and stabilizing agent. The parameters affecting the coating quality such as the plating time, temperature and bath composition were optimized. The chemical analysis and coating morphology of the formed coatings are examined by XRD, SEM and EDS to reach the best bath composition as well as the best conditions to coat copper with lead or lead-tin electrolessly. The electrochemical properties of copper and copper coated samples are also examined using electrochemical impedance spectroscopy.
