The diffusion bonding was carried out to join Ti alloy （Ti-6Al-4V） and tin-bronze （ ZQSn10-10 ） with Ni and Ni ＋ Cu interlayer. The microstructures of the diffusion bonded joints were analyzed by scanning electr...The diffusion bonding was carried out to join Ti alloy （Ti-6Al-4V） and tin-bronze （ ZQSn10-10 ） with Ni and Ni ＋ Cu interlayer. The microstructures of the diffusion bonded joints were analyzed by scanning electron microscope （SEM）, energy dispersive spectroscopy （ EDS ） and X-ray diffraction （ XRD ）. The results show that when the interlayer is Ni or Ni ＋ Cu transition metals both could effectively prevent the diffusion between Ti and Cu and avoid the formation of the Cu-Ti intermetallic compounds （Cu3Ti, CuTi etc. ）. But the Ni-Ti intermetallic compounds （NiTi, Ni3Ti） are formed on the Ti-6Al-4V/Ni interface. When the interlayer is Ni, the optimum bonding parameters are 830 ℃/10 MPa/30 min. And when the interlayer is Ni ＋ Cu, the optimum bonding parameters are 850 ℃/10 MPa/20 min. With the optimum bonding parameters, the tensile strength of the joints with Ni and Ni ＋ Cu interlayer both are 155.8 MPa, which is 65 percent of the strength of ZQSn10-10 base metal.展开更多
基金The work was supported by National Natural Science Foundation of China(No50375065)State Key Laboratory of Advanced Welding Production Technology(No04005)
文摘The diffusion bonding was carried out to join Ti alloy （Ti-6Al-4V） and tin-bronze （ ZQSn10-10 ） with Ni and Ni ＋ Cu interlayer. The microstructures of the diffusion bonded joints were analyzed by scanning electron microscope （SEM）, energy dispersive spectroscopy （ EDS ） and X-ray diffraction （ XRD ）. The results show that when the interlayer is Ni or Ni ＋ Cu transition metals both could effectively prevent the diffusion between Ti and Cu and avoid the formation of the Cu-Ti intermetallic compounds （Cu3Ti, CuTi etc. ）. But the Ni-Ti intermetallic compounds （NiTi, Ni3Ti） are formed on the Ti-6Al-4V/Ni interface. When the interlayer is Ni, the optimum bonding parameters are 830 ℃/10 MPa/30 min. And when the interlayer is Ni ＋ Cu, the optimum bonding parameters are 850 ℃/10 MPa/20 min. With the optimum bonding parameters, the tensile strength of the joints with Ni and Ni ＋ Cu interlayer both are 155.8 MPa, which is 65 percent of the strength of ZQSn10-10 base metal.
