DIRECTIONALLY SOLIDIFIED MICROSTRUCTURE OF AN ULTRA-HIGH TEMPERATURE Nb-Si-Ti-Hf-Cr-Al ALLOY

The directionally solidified samples of an ultra-high temperature Nb-Si-Ti-Hf-Cr-Al alloy have been prepared with the use of an electron beam floating zone melting (EBFZM) furnace, and their microstructural characteristics have been analyzed. All the primary dendrites of Nb solid solution (Nbss), eutectic colonies of Nba, plus (Nb, Ti)3 Si/(Nb, Ti)5 Si3 and chains of (Nb, Ti)3 Si/(Nb, Ti)5 Si3 plates align along the growth direction of the samples. With increasing of the withdrawing rate, the microstructure is refined, and the amounts of Nbss+ (Nb, Ti)3 Si/(Nb, Ti)5 Si3 eutectic colonies and (Nb, Ti)3 Si/(Nb, Ti)5 Si3 plates increase. There appear nodes in the (Nb, Ti)3 Si/(Nb, Ti)5 Si3 plates.

Analytical prediction and field validation of transient temperature field in asphalt pavements

This work presented the development and validation of an analytical method to predict the transient temperature field in the asphalt pavement.The governing equation for heat transfer was based on heat conduction radiation and convection.An innovative time-dependent function was proposed to predict the pavement surface temperature with solar radiation and air temperature using dimensional analysis in order to simplify the complex heat exchange on the pavement surface.The parameters for the time-dependent pavement surface temperature function were obtained through the regression analysis of field measurement data.Assuming that the initial pavement temperature distribution was linear and the influence of the base course materials on the temperature of the upper asphalt layers was negligible,a close-form analytical solution of the temperature in asphalt layers was derived using Green's function.Finally,two numerical examples were presented to validate the model solutions with field temperature measurements.Analysis results show that the solution accuracy is in agreement with field data and the relative errors at a shallower depth are greater than those at a deeper one.Although the model is not sensitive to dramatic changes in climatic factors near the pavement surface,it is applicable for predicting pavement temperature field in cloudless days.

Transient Temperature Analysis for Industrial AC Arc Furnace Bottom

Heat losses from the furnaces depend on the design and size. The surface heat loss from the bottom of an industrial AC electric arc furnace (EAF) possesses an important fraction of overall losses. So in this study the transient temperature variation at the bottom of the EAF was investigated. The transient temperature analysis was carried out using MATLAB computer program. T=T(r, t) for different bottom lining layers was depicted.

Temperature dependence of the P-hit single event transient pulse width in a three-transistor inverter chain

A comparison of the temperature dependence of the P-hit single event transient （SET） in a two-transistor （2T） inverter with that in a three-transistor （3T） inverter is carried out based on a three-dimensional numerical simulation. Due to the significantly distinct mechanisms of the single event change collection in the 2T and the 3T inverters, the temperature plays different roles in the SET production and propagation. The SET pulse will be significantly broadened in the 2T inverter chain while will be compressed in the 3T inverter chain as temperature increases. The investigation provides a new insight into the SET mitigation under the extreme environment, where both the high temperature and the single event effects should be considered. The 3T inverter layout structure （or similar layout structures） will be a better solution for spaceborne integrated circuit design for extreme environments.

Parasitic bipolar amplification in a single event transient and its temperature dependence

Using three-dimensional technology computer-aided design （TCAD） simulation, parasitic bipolar amplification in a single event transient （SET） current of a single transistor and its temperature dependence are studied. We quantify the contributions of different current components in a SET current pulse, and it is found that the proportion of parasitic bipolar amplification in total collected charge is about 30% in both ]30-nm and 90-nm technologies. The temperature dependence of parasitic bipolar amplification and the mechanism of the SET pulse are also investigated and quantified. The results show that the proportion of charge induced by parasitic bipolar increases with rising temperature, which illustrates that the parasitic bipolar amplification plays an important role in the charge collection of a single transistor.

Temperature and drain bias dependence of single event transient in 25-nm FinFET technology

In this paper, we investigate the temperature and drain bias dependency of single event transient （SET） in 25-nm fin field-effect-transistor （FinFET） technology in a temperature range of 0-135 ℃ and supply voltage range of 0.4 V- 1.6 V. Technology computer-aided design （TCAD） three-dimensional simulation results show that the drain current pulse duration increases from 0.6 ns to 3.4 ns when the temperature increases from 0 to 135 ℃. The charge collected increases from 45.5 ℃ to 436.9 fC and the voltage pulse width decreases from 0.54 ns to 0.18 ns when supply voltage increases from 0.4 V to 1.6 V. Furthermore, simulation results and the mechanism of temperature and bias dependency are discussed.

The temperature-dependent fracture strength model for ultra-high temperature ceramics

Breaking down the entire structure of a material implies severing all the bonds between its atoms either by applying work or by heat transfer. Because bond-breaking is indifferent to either means, there is a kind of equivalence between heat energy and strain energy. Based on this equivalence, we assume the existence of a constant maximum storage of energy that includes both the strain energy and the corresponding equivalent heat energy. A temperaturedependent fracture strength model is then developed for ultrahigh temperature ceramics （UHTCs）. Model predictions for UHTCs, HfB2, TiC and ZrB2, are presented and compared with the experimental results. These predictions are found to be largely consistent with experimental results.

SIMULATION OF TEMPERATURE FIELD IN ULTRA-HIGH FREQUENCY INDUCTION HEATING AND VERIFICATION

An experimental and numerical study on the temperature field induced in the ultra-high frequency induction heating is carried out.With an aim of predicting the thermal history of the workpiece,the influence factors of temperature field,such as the induction frequency,the dimension of coil and the gap between coil and workpiece,are investigated considering temperature-dependent material properties by using FLUX 2Dsoftware.The temperature field characteristic in ultra-high induction heating is obtained and discussed.The numerical values are compared with the experimental results.A good agreement between them is observed with 7.9% errors.

Analysis of transient temperature field of the laminate composite membrane in space environment

The on-orhit transient temperature of reflector laminate film was analyzed by using finite element method （FEM）. Numerical simulation was used by FEM software ANSYS. Results reveal that the temperature levels of the laminate composite membrane alternate greatly in the orbital period, which is about±80℃. This range exceeds the material ＇ s operating temperature level. So it is necessary to put effective thermal control into effect to the laminate composite membrane. There is temperature gradient in the thickness direction of the laminate composite membrane; there is a light change in Kevlar/Epoxy layer. The temperature of the laminate composite membrane is obviously lower than the seam＇ s temperature. Results provide reference to the thermal control of the inflatable reflector with high precision requirement.

Analysis Method of Transient Temperature Field for Fuel Tank ofHigh-Altitude Large UAV

Based on the analysis of factors affecting transient temperature field of aircraft fuel tank and coupled heat transfer mechanism, a mathematical model of transient coupled heat transfer, including the dynamic- change of fuel quality, the internal heat transfer, the external aerodynamic convection and the radiation heat transfer, is established. Taking the aerodynamic convection and radiation heat transfer outside the tank as the third kinds of thermal boundary conditions for the thermal analysis of the fuel tank, calculation of internal and external coupling heat of fuel tank is decoupled. Ther^nal network method combined with hierarchical dynamic- grid is used to deal with the fuel consumption, and carry on the heat transfer analysis of the fuel tank. The numerical method for the transient temperature field of aircraft fuel tank is established. Through the simulation calculation, the transient temperature distribution of the fuel tank under different flight conditions is obtained, and the influence of the fuel mass and the external thermal environment on the temperature field is analyzed.

Fabrication and Thermal Structural Characteristics of Ultra-high Temperature Ceramic Struts in Scramjets

ZrB_2-SiC based ultra-high temperature ceramic（UHTC） struts were firstly proposed and fabricated with the potential application in the combustor of scramjets for fuel injection and flame-holding for their machinability and excellent oxidation/ablation resistance in the extreme harsh environment. The struts were machined with electrospark wire-electrode cutting techniques to form UHTC into the desired shape, and with laser drilling to drill tiny holes providing the channels for fuel injection. The integrated thermal-structural characteristic of the struts was evaluated in high-temperature combustion environment by the propane-oxygen free jet facility, subject to the heat flux of 1.5 MW/m^2 lasting for 300 seconds, and the struts maintained integrity during and after the first experiment. The experiments were repeated for verifying the reusability of the struts. Fracture occurred during the second repeated experiment with the crack propagating through the hole. Finite element analysis（FEA） was carried out to study the thermal stress distribution in the UHTC strut. The simulation results show a high thermal stress concentration occurs at the hole which is the crack initiation position. The phenomenon is in good agreement with the experimental results. The study shows that the thermal stress concentration is a practical key issue in the applications of the reusable UHTC strut for fuel injection structure in scramjets.

Analysis of transient temperature field in coke drums

One of the primary reasons leading to bulging and cracking in a coke drum is the severe temperature gradient due to cyclic temperature variation. Based on the twodimensional heat conduction theory, an analytical solution of the transient temperature field in the coke drum is obtained, which is different from the known FEM results. The length of the coke drum is considered finite. The dynamic boundary conditions caused by fluid uninterrupted rising in oiling and watering stages are simulated with the iteration method. Numerical results show that the present theoretical model can accurately describe basic features of the transient temperature field in the coke drum. Effects of the geometry of the coke drum and the rising velocity of quench water on the axial temperature gradient are also discussed.

The temperature dependence of single-event transients in 90-nm CMOS dual-well and triple-well NMOSFETs

This paper investigates the temperature dependence of single-event transients（SETs） in 90-nm complementary metat-oxide semiconductor（CMOS） dual-well and triple-well negative metal-oxide semiconductor field-effect transistors（NMOSFETs）.Technology computer-aided design（TCAD） three-dimensional（3D） simulations show that the drain current pulse duration increases from 85 ps to 245 ps for triple-well but only increases from 65 ps to 98 ps for dual-well when the temperature increases from-55℃ to 125℃,which is closely correlated with the NMOSFET sources.This reveals that the pulse width increases with temperature in dual-well due to the weakening of the anti-amplification bipolar effect while increases with temperature in triple-well due to the enhancement of the bipolar amplification.

TRANSIENT TEMPERATURE FIELDS AND RESIDUAL STRESS FIELDS OF METALLIC MATERIALS UNDER WELDING

Based on the situation of welding thermal conduction and thermo-elasto-platicity research, this paper explores some problems in this field. First, the boundary element method for nonlinear problems is improved by linearization of nonlinear problems and used in welding thermal conduction analysis. Second, the thermo-elasto-plastic finite element method is used for the welding stress calculation, in which the phase transformation is considered by the 'equivalent linear expansion coefficient method'. The comparison of the calculated results with experimental data shows that the methods provided in this paper are available.

ANALYSIS OF TRANSIENT CHARACTERISTICS OF ECL CIRCUIT AT LOW TEMPERATURE

Detailed analysis on transient characteristics of ECL circuits are performed in this paper, then a relatively exact propagation delay expression applied for all temperatures is presented. The cryogenic characteristics of some dominant parameters contributed to propagation delay are also discussed. The model achieved is suitable for optimum designs of high speed devices and circuits at all temperatures.

TRANSIENT CHARACTERISTIC ANALYSIS OF HIGH TEMPERATURE CMOS DIGITAL INTEGRATED CIRCUITS

This paper analyses the transient characteristics of high temperature CMOS inverters and gate circuits, and gives the computational formulas of their rise time, fall time and delay time. It may be concluded that the transient characteristics of CMOS inverters and gate circuits deteriorate due to the reduction of carrier mobilities and threshold voltages of MOS transistors and the increase of leakage currents of MOS transistors drain terminal pn junctions. The calculation results can explain the experimental phenomenon.

Rapid Directional Solidification with Ultra-High Temperature Gradient and Cellular Spacing Selection of Cu-Mn Alloy

The detailed laser surface remelting experiments of Cu-31.4 wt pct Mn and Cu-26.6 wt pct Mn alloys on a 5 kW CO2 laser were carried out to study the effects of processing parameters (scanning velocity, output power of laser) on the growth direction of microstructure in the molten pool and cellular spacing selection under the condition of ultra-high temperature gradient and rapid directional solidification. The experimental results show that the growth direction of microstructure is strongly affected by laser processing parameters. The ultra-high temperature gradient directional solidification can be realized on the surface of samples during laser surface remelting by controlling laser processing parameters, the temperature gradient and growth velocity can reach 106 K/m and 24.1 mm/s, respectively, and the solidification microstructure in the center of the molten pool grows along the laser beam scanning direction. There exists a distribution range of cellular spacings under the laser rapid solidification conditions, and the average spacing decreases with increasing of growth rate. The maximum, λmax, minimum, λmin, and average primary spacing, A, as functions of growth rate, Vb, can be given by,λmax=12.54Vb-0.61, λmin=4.47 Vb-0.52, λ=9.09Vb-0.62, respectively. The experimental results are compared with the current Hunt-Lu model for rapid cellular/dendritic growth, and a good agreement is found.

Temperature Effect on the Conformation Transition of Ultra-high Molecular Weight Polyethylene/Polypropylene Blends Undergoing Continuous Volume Extensional Flow:A Mesoscopic Simulation

Due to the multiformity and complexity of chain conformation under external flow and the challenge of systematically investigating the transient conformation and dynamic evolution process of polymer chains at the molecular level by means of present experimental techniques,a universal description of both chain conformation and dynamics with respect to continuous volume extensional flow(CVEF)is still absent.Taking into account the temperature effect,we performed dissipative particle dynamics(DPD)simulations with the particles corresponding to the repeat units of polymers over a wide temperature range and analyzed the correlation with the conformational properties of ultra-high molecular weight polyethylene/polypropylene(UHMWPE/PP)blend in response to the CVEF.With time evolution,the polymer chains become highly oriented parallel to the flow direction instead of the initial random coiling and self-aggregation.It is found that a high temperature is necessary for more substantial compactness to take place than low temperature.The low-k plateau and low-k peak in structure factor S(k)curves suggest a low degree of conformational diversity and a high degree of chain stretching.It is also concluded that the intra-molecular C-C bond interaction is the main driving force for the dynamics process of the chain conformations undergoing CVEF,where the motion of the alkyl chains is seriously restricted owing to the increase in bond interaction potential,resulting in a reduction of the difference in diffusion rates among alkyl chains.

Effects of mechanical boundary conditions on thermal shock resistance of ultra-high temperature ceramics

The effects of mechanical boundary conditions, often encountered in thermalstructural engineering, on the thermal shock resistance（TSR） of ultra-high temperature ceramics（UHTCs） are studied by investigating the TSR of a UHTC plate with various types of constraints under the first, second, and third type of thermal boundary conditions. The TSR of UHTCs is strongly dependent on the heat transfer modes and severity of the thermal environments. Constraining the displacement of the lower surface in the thickness direction can significantly decrease the TSR of the UHTC plate, which is subject to the thermal shock at the upper surface. In contrast, the TSR of the UHTC plate with simply supported edges or clamped edges around the lower surface is much better.

Porous Ultra-high Temperature Ceramics for Ultra-high Temperature Thermal Protection System

Ultra-high temperature ceramics(UHTCs)are a family of borides,carbides and nitrides of transition elements such as hafnium,zirconium,tantalum and niobium.They exhibit the highest known melting points,good mechanical strength,good chemical and thermal stability under certain conditions.In last decade,researchers dedicated to characterize porous UHTCs aiming to develop novel thermal insulating materials that could withstand temperatures over 2000℃.In this article,the preparation and characteristics of porous UHTCs were reviewed.Dry processing,colloidal processing and solution processing routes have been used to prepare porous UHTCs with porosities ranging from 5%to 97%and pore sizes ranging from hundreds of nanometers to hundreds of micrometers.The obtained porous UHTCs are chemically and dimensionally stable at temperatures up to 2000℃ during static state high-temperature thermal aging.