Ti foil and Ti/Ni/Ti multiple interlayers were selected for the bonding of tungsten to copper and CuCrZr alloy.Theeffects of processing conditions on the microstructures and shear strength of the joints were investiga...Ti foil and Ti/Ni/Ti multiple interlayers were selected for the bonding of tungsten to copper and CuCrZr alloy.Theeffects of processing conditions on the microstructures and shear strength of the joints were investigated.When Tifoil is used for bonding of tungsten to pure copper but not transformed into liquid solution during the holding time,the strength of the joints is relatively low because of the multiple compound layers with brittleness formed in thebonding zone.The strength of the joints increases significantly if the Ti foil is transformed into liquid solution and ismostly extruded out of the bonding zone.The same phenomena are found in the case when Ti/Ni/Ti multi-interlayersare used for bonding tungsten to CuCrZr alloy.展开更多
Diffusion bonding between tungsten and 0Cr13Al stainless steel using a Cu/90W-10Ni powder mixtures/Ni multi-interlayer was carried out in vacuum at 1150 °C with a pressure of 5 MPa for 60 min. The microstructures...Diffusion bonding between tungsten and 0Cr13Al stainless steel using a Cu/90W-10Ni powder mixtures/Ni multi-interlayer was carried out in vacuum at 1150 °C with a pressure of 5 MPa for 60 min. The microstructures, composition distribution and fracture characteristics of the joint were studied by SEM and EDS. Joint properties were evaluated by shear experiments and thermal shock tests. The results showed that the joints comprised tungsten/Cu-Ni sub-layer/W-Ni composites sub-layer/Ni sub-layer/0Cr13Al stainless steel. The W-Ni composites sub-layer with a homogeneous and dense microstructure was formed by solid phase sintering of 90W-10Ni powder mixtures. Sound bonding between tungsten base material and W-Ni composites sub-layer was realized based on transient liquid phase (TLP) diffusion bonding mechanism. Joints fractured at bonding zone of W-Ni composites sub-layer and Ni sub-layer during shear testing, and the average strength was 256 MPa. Thermal shock tests showed that joints could withstood 60 thermal cycles quenching from 700 °C to room temperature.展开更多
With CuMn alloy as interlayer, the transient liquid phase (TLP) diffusion bonding of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti) was studied. The results show that the bonding pressure, time and temperature and...With CuMn alloy as interlayer, the transient liquid phase (TLP) diffusion bonding of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti) was studied. The results show that the bonding pressure, time and temperature and the content of Mn in CuMn alloy have great effects on the strength of bonding interface; when they are 1 MPa, 40 min, 1 223 K and 30% respectively, the maximum joint strength of 487 MPa is attained. The fracture occurring at the bonding interface is a plastic one and the effect of Mn has been analyzed.展开更多
CuAlBe alloy is an attractive shape memory alloy with many important usages in industrial field, in order to spread its range of application it is desirable to be able to join CuAlBe soundly with other metallic materi...CuAlBe alloy is an attractive shape memory alloy with many important usages in industrial field, in order to spread its range of application it is desirable to be able to join CuAlBe soundly with other metallic materials, for example stainless steel; however the weldability between CuAlBe alloy and stainless steel has never been studied, therefore an experimental investigation of different transition metals was carried out in the diffusion bonding joints of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti). The microstructure and phase composition of the joint were analyzed by SEM, EPMA and X ray diffraction. The following conclusions have been drawn: 1) The joint strength with Ni interlayer is higher than that with Cu interlayer when the welding parameters are the same; 2) When Ni interlayer is thinner, Al will interact with Ni and Fe, and the intermetallic compounds such as Fe 3Al are formed in the interface, which decreases the strength of the joints; 3) When the bonding temperature is higher, because the diffusion of Cu in Ni is faster than Ni in Cu, a Kirkendall effect occurs, which also decreases the strength of the joints.展开更多
The experimental investigation of different transition metals was carried out in the diffusion bonding joints of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti). The microstructure of the joint was analyzed with mi...The experimental investigation of different transition metals was carried out in the diffusion bonding joints of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti). The microstructure of the joint was analyzed with microscopic examination, SEM, EPMA and X ray diffraction. Following conclusions have been drawn: (1) The joint strength with the Ni interlayer was higher than that with Cu interlayer when the welding parameters were same;(2)When Ni interlayer was thinner,Al could interact with Ni and Fe,and the intermetallic compounds,such as Fe 3Al etc,were formed in the interface,which decreased the strength of the joints;(3)When the bonding temperature was higher,because of the diffusion of Cu in Ni being faster than Ni in Cu,a Kirkendall effect was produced,which also decreased the strength of the joints.展开更多
In many circumstances,dissimilar metals have to be bonded together and the resulting joint interfaces must typically sustain mechanical and/or electrical forces without failure,which is not possible by fusion welding ...In many circumstances,dissimilar metals have to be bonded together and the resulting joint interfaces must typically sustain mechanical and/or electrical forces without failure,which is not possible by fusion welding processes.The melting points of magnesium(Mg)and copper(Cu)have a significant difference(nearly 400℃)and this may lead to a large difference in the microstructure and joint performance of Mg-Cu joints.However,diffusion bonding can be used to join these alloys without much difficulty.This work analyses the effect of parameters on diffusion layer thickness,hardness and strength of magnesium-copper dissimilar joints.The experiments were conducted using three-factor,five-level,central composite rotatable design matrix.Empirical relationships were developed to predict diffusion layer thickness,hardness and strength using response surface methodology.It is found that bonding temperature has predominant effect on bond characteristics.Joints fabricated at a bonding temperature of 450℃, bonding pressure of 12 MPa and bonding time of 30 min exhibited maximum shear strength and bonding strength of 66 and 81 MPa, respectively.展开更多
Diffusion bonding between Al and Cu was successfully performed by hot isostatic pressing(HIP). To improve the strength of diffusion bonding joint, pure nickel foils with different thickness were used as intermediate l...Diffusion bonding between Al and Cu was successfully performed by hot isostatic pressing(HIP). To improve the strength of diffusion bonding joint, pure nickel foils with different thickness were used as intermediate layer. Microstructure of the interface between Al and Cu was investigated by X-ray diffraction(XRD) technique, secondary electron microscopy(SEM), and nano-indentation tests. When the temperature was 500 ℃ and held for 3 h with a processing pressure of 50 MPa, Al and Cu could be bonded with its interface formed by several diffusion layers. With the addition of Ni interlayer, the diffusion of aluminum atoms was effectively hindered, and the interface became smoother. The tensile strength of bonded joints increases with increasing the thickness of Ni interlayer, which contributes to a reduction in the thickness of intermetallic compounds(IMCs) and well bonding quality of Al-Cu joints.展开更多
文摘Ti foil and Ti/Ni/Ti multiple interlayers were selected for the bonding of tungsten to copper and CuCrZr alloy.Theeffects of processing conditions on the microstructures and shear strength of the joints were investigated.When Tifoil is used for bonding of tungsten to pure copper but not transformed into liquid solution during the holding time,the strength of the joints is relatively low because of the multiple compound layers with brittleness formed in thebonding zone.The strength of the joints increases significantly if the Ti foil is transformed into liquid solution and ismostly extruded out of the bonding zone.The same phenomena are found in the case when Ti/Ni/Ti multi-interlayersare used for bonding tungsten to CuCrZr alloy.
基金Project(51075205)supported by the National Natural Science Foundation of China
文摘Diffusion bonding between tungsten and 0Cr13Al stainless steel using a Cu/90W-10Ni powder mixtures/Ni multi-interlayer was carried out in vacuum at 1150 °C with a pressure of 5 MPa for 60 min. The microstructures, composition distribution and fracture characteristics of the joint were studied by SEM and EDS. Joint properties were evaluated by shear experiments and thermal shock tests. The results showed that the joints comprised tungsten/Cu-Ni sub-layer/W-Ni composites sub-layer/Ni sub-layer/0Cr13Al stainless steel. The W-Ni composites sub-layer with a homogeneous and dense microstructure was formed by solid phase sintering of 90W-10Ni powder mixtures. Sound bonding between tungsten base material and W-Ni composites sub-layer was realized based on transient liquid phase (TLP) diffusion bonding mechanism. Joints fractured at bonding zone of W-Ni composites sub-layer and Ni sub-layer during shear testing, and the average strength was 256 MPa. Thermal shock tests showed that joints could withstood 60 thermal cycles quenching from 700 °C to room temperature.
文摘With CuMn alloy as interlayer, the transient liquid phase (TLP) diffusion bonding of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti) was studied. The results show that the bonding pressure, time and temperature and the content of Mn in CuMn alloy have great effects on the strength of bonding interface; when they are 1 MPa, 40 min, 1 223 K and 30% respectively, the maximum joint strength of 487 MPa is attained. The fracture occurring at the bonding interface is a plastic one and the effect of Mn has been analyzed.
文摘CuAlBe alloy is an attractive shape memory alloy with many important usages in industrial field, in order to spread its range of application it is desirable to be able to join CuAlBe soundly with other metallic materials, for example stainless steel; however the weldability between CuAlBe alloy and stainless steel has never been studied, therefore an experimental investigation of different transition metals was carried out in the diffusion bonding joints of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti). The microstructure and phase composition of the joint were analyzed by SEM, EPMA and X ray diffraction. The following conclusions have been drawn: 1) The joint strength with Ni interlayer is higher than that with Cu interlayer when the welding parameters are the same; 2) When Ni interlayer is thinner, Al will interact with Ni and Fe, and the intermetallic compounds such as Fe 3Al are formed in the interface, which decreases the strength of the joints; 3) When the bonding temperature is higher, because the diffusion of Cu in Ni is faster than Ni in Cu, a Kirkendall effect occurs, which also decreases the strength of the joints.
文摘The experimental investigation of different transition metals was carried out in the diffusion bonding joints of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti). The microstructure of the joint was analyzed with microscopic examination, SEM, EPMA and X ray diffraction. Following conclusions have been drawn: (1) The joint strength with the Ni interlayer was higher than that with Cu interlayer when the welding parameters were same;(2)When Ni interlayer was thinner,Al could interact with Ni and Fe,and the intermetallic compounds,such as Fe 3Al etc,were formed in the interface,which decreased the strength of the joints;(3)When the bonding temperature was higher,because of the diffusion of Cu in Ni being faster than Ni in Cu,a Kirkendall effect was produced,which also decreased the strength of the joints.
基金support rendered through a Major Research Project No. F-31-51/2005(SR)
文摘In many circumstances,dissimilar metals have to be bonded together and the resulting joint interfaces must typically sustain mechanical and/or electrical forces without failure,which is not possible by fusion welding processes.The melting points of magnesium(Mg)and copper(Cu)have a significant difference(nearly 400℃)and this may lead to a large difference in the microstructure and joint performance of Mg-Cu joints.However,diffusion bonding can be used to join these alloys without much difficulty.This work analyses the effect of parameters on diffusion layer thickness,hardness and strength of magnesium-copper dissimilar joints.The experiments were conducted using three-factor,five-level,central composite rotatable design matrix.Empirical relationships were developed to predict diffusion layer thickness,hardness and strength using response surface methodology.It is found that bonding temperature has predominant effect on bond characteristics.Joints fabricated at a bonding temperature of 450℃, bonding pressure of 12 MPa and bonding time of 30 min exhibited maximum shear strength and bonding strength of 66 and 81 MPa, respectively.
基金Funded by National Science and Technology Major Project(No.2017-Ⅵ-0009-0080)Science and Technology Planning Project of Wuhan(No.2018010401011281).
文摘Diffusion bonding between Al and Cu was successfully performed by hot isostatic pressing(HIP). To improve the strength of diffusion bonding joint, pure nickel foils with different thickness were used as intermediate layer. Microstructure of the interface between Al and Cu was investigated by X-ray diffraction(XRD) technique, secondary electron microscopy(SEM), and nano-indentation tests. When the temperature was 500 ℃ and held for 3 h with a processing pressure of 50 MPa, Al and Cu could be bonded with its interface formed by several diffusion layers. With the addition of Ni interlayer, the diffusion of aluminum atoms was effectively hindered, and the interface became smoother. The tensile strength of bonded joints increases with increasing the thickness of Ni interlayer, which contributes to a reduction in the thickness of intermetallic compounds(IMCs) and well bonding quality of Al-Cu joints.
