Glass-ceramics have many excellent properties and are widely used in various fields. During the grinding process,the workpiece surface is typically subject to material removal by grit of incremental heights, which has...Glass-ceramics have many excellent properties and are widely used in various fields. During the grinding process,the workpiece surface is typically subject to material removal by grit of incremental heights, which has rarely been the focus of research. As such, it is necessary to study the material removal mechanism of glass-ceramics under consecutive incremental loading, which more closely reflects the actual grinding process. In this paper,to analyze the plastic deformation and residual stress of lithium aluminosilicate(LAS) glass-ceramics, a finite element model is established based on the Drucker–Prager yield criterion for ductile regimes. A nano-scratch test was also conducted and the test results show that both the residual depth and residual stress increase with an increase in the number of increments, and that consecutive incremental loading promotes the plastic deformation of glass-ceramics and increases the residual stress of the material in the ductile-regime process. These findings provide guidance for achieving higher dimensional accuracy in the actual grinding of glass-ceramics parts.展开更多
Single crystal silicon carbide(SiC)is widely used for optoelectronics applications.Due to the anisotropic characteristics of single crystal materials,the C face and Si face of single crystal SiC have different physica...Single crystal silicon carbide(SiC)is widely used for optoelectronics applications.Due to the anisotropic characteristics of single crystal materials,the C face and Si face of single crystal SiC have different physical properties,which may fit for particular application purposes.This paper presents an investigation of the material removal and associated subsurface defects in a set of scratching tests on the C face and Si face of 4H-SiC and 6H-SiC materials using molecular dynamics simulations.The investigation reveals that the sample material deformation consists of plastic,amorphous transformations and dislocation slips that may be prone to brittle split.The results showed that the material removal at the C face is more effective with less amorphous deformation than that at the Si face.Such a phenomenon in scratching relates to the dislocations on the basal plane(0001)of the SiC crystal.Subsurface defects were reduced by applying scratching cut depths equal to integer multiples of a half molecular lattice thickness,which formed a foundation for selecting machining control parameters for the best surface quality.展开更多
Vibration-assisted grinding is one of the most promising technologies for manufacturing optical components due to its efficiency and quality advantages.However,the damage and crack propagation mechanisms of materials ...Vibration-assisted grinding is one of the most promising technologies for manufacturing optical components due to its efficiency and quality advantages.However,the damage and crack propagation mechanisms of materials in vibration-assisted grinding are not well understood.In order to elucidate the mechanism of abrasive scratching during vibration-assisted grinding,a kinematic model of vibration scratching was developed.The influence of process parameters on the evolution of vibration scratches to indentation or straight scratches is revealed by displacement metrics and velocity metrics.Indentation,scratch and vibration scratch experiments were performed on quartz glass,and the results showed that the vibration scratch cracks are a combination of indentation cracks and scratch cracks.Vibration scratch cracks change from indentation cracks to scratch cracks as the indenter moves from the entrance to the exit of the workpiece or as the vibration frequency changes from high to low.A vertical vibration scratch stress field model is established for the first time,which reveals that the maximum principal stress and tensile stress distribution is the fundamental cause for inducing the transformation of the vibration scratch cracking system.This model provides a theoretical basis for understanding of the mechanism of material damage and crack propagation during vibration-assisted grinding.展开更多
Carbon fiber reinforced silicon carbide(C_(f)/SiC)composites are widely used in aerospace for their excellent mechanical properties.However,the quality of the machined surface is poor and unpredictable due to the mate...Carbon fiber reinforced silicon carbide(C_(f)/SiC)composites are widely used in aerospace for their excellent mechanical properties.However,the quality of the machined surface is poor and unpredictable due to the material heterogeneity induced by complex removal mechanism.To clarify the effects of fiber orientation on the grinding characteristics and removal mechanism,single grit scratch experiments under different fiber orientations are conducted and a three-phase numerical modelling method for 2.5D C_(f)/SiC composites is proposed.Three fiber cutting modes i.e.,transverse,normal and longitudinal,are defined by fiber orientation and three machining directions i.e.,MA(longitudinal and normal),MB(longitudinal and transverse)and MC(normal and transverse),are selected to investigate the effect of fiber orientation on grinding force and micro-morphology.Besides,a three-phase cutting model of 2.5D C_(f)/SiC composites considering the mechanical properties of the matrix,fiber and interface is developed.Corresponding simulations are performed to reveal the micro-mechanism of crack initiation and extension as well as the material removal mechanism under different fiber orientations.The results indicate that the scratching forces fluctuate periodically,and the order of mean forces is MA>MC>MB.Cracks tend to grow along the fiber axis,which results in the largest damage layer for transverse fibers and the smallest for longitudinal fibers.The removal modes of transverse fibers are worn,fracture and peel-off,in which normal fibers are pullout and outcrop and the longitudinal fibers are worn and push-off.Under the stable cutting condition,the change of contact area between fiber and grit leads to different removal modes of fiber in the same cutting mode,and the increase of contact area results in the aggravation of fiber fracture.展开更多
基金supported by the National Key Research and Development Program of China (No. 2018YFB1107602)the National Natural Science Foundation of China (Nos. 51875405 & 51375336)。
文摘Glass-ceramics have many excellent properties and are widely used in various fields. During the grinding process,the workpiece surface is typically subject to material removal by grit of incremental heights, which has rarely been the focus of research. As such, it is necessary to study the material removal mechanism of glass-ceramics under consecutive incremental loading, which more closely reflects the actual grinding process. In this paper,to analyze the plastic deformation and residual stress of lithium aluminosilicate(LAS) glass-ceramics, a finite element model is established based on the Drucker–Prager yield criterion for ductile regimes. A nano-scratch test was also conducted and the test results show that both the residual depth and residual stress increase with an increase in the number of increments, and that consecutive incremental loading promotes the plastic deformation of glass-ceramics and increases the residual stress of the material in the ductile-regime process. These findings provide guidance for achieving higher dimensional accuracy in the actual grinding of glass-ceramics parts.
基金financial support from National Natural Science Foundation of China(Grant No.51835004 and 51575197)Huaqiao University International Cultivation Program for Outstanding Postgraduates and Subsidized Projec for Postgraduates’Innovative Fund in Scientific Research of Huaqiao University(No.18011080010)。
文摘Single crystal silicon carbide(SiC)is widely used for optoelectronics applications.Due to the anisotropic characteristics of single crystal materials,the C face and Si face of single crystal SiC have different physical properties,which may fit for particular application purposes.This paper presents an investigation of the material removal and associated subsurface defects in a set of scratching tests on the C face and Si face of 4H-SiC and 6H-SiC materials using molecular dynamics simulations.The investigation reveals that the sample material deformation consists of plastic,amorphous transformations and dislocation slips that may be prone to brittle split.The results showed that the material removal at the C face is more effective with less amorphous deformation than that at the Si face.Such a phenomenon in scratching relates to the dislocations on the basal plane(0001)of the SiC crystal.Subsurface defects were reduced by applying scratching cut depths equal to integer multiples of a half molecular lattice thickness,which formed a foundation for selecting machining control parameters for the best surface quality.
基金co-supported by the National Natural Science Foundation of China(Nos.52275458,and 52275207)the Natural Science Foundation of Tianjin(No.22JCZDJC00050).
文摘Vibration-assisted grinding is one of the most promising technologies for manufacturing optical components due to its efficiency and quality advantages.However,the damage and crack propagation mechanisms of materials in vibration-assisted grinding are not well understood.In order to elucidate the mechanism of abrasive scratching during vibration-assisted grinding,a kinematic model of vibration scratching was developed.The influence of process parameters on the evolution of vibration scratches to indentation or straight scratches is revealed by displacement metrics and velocity metrics.Indentation,scratch and vibration scratch experiments were performed on quartz glass,and the results showed that the vibration scratch cracks are a combination of indentation cracks and scratch cracks.Vibration scratch cracks change from indentation cracks to scratch cracks as the indenter moves from the entrance to the exit of the workpiece or as the vibration frequency changes from high to low.A vertical vibration scratch stress field model is established for the first time,which reveals that the maximum principal stress and tensile stress distribution is the fundamental cause for inducing the transformation of the vibration scratch cracking system.This model provides a theoretical basis for understanding of the mechanism of material damage and crack propagation during vibration-assisted grinding.
基金supported by the National Natural Science Foundation of China(No.51922066)the Key Research and Development Plan of Shandong Province(Nos.2019JMRH0307,2020CXGC010204)。
文摘Carbon fiber reinforced silicon carbide(C_(f)/SiC)composites are widely used in aerospace for their excellent mechanical properties.However,the quality of the machined surface is poor and unpredictable due to the material heterogeneity induced by complex removal mechanism.To clarify the effects of fiber orientation on the grinding characteristics and removal mechanism,single grit scratch experiments under different fiber orientations are conducted and a three-phase numerical modelling method for 2.5D C_(f)/SiC composites is proposed.Three fiber cutting modes i.e.,transverse,normal and longitudinal,are defined by fiber orientation and three machining directions i.e.,MA(longitudinal and normal),MB(longitudinal and transverse)and MC(normal and transverse),are selected to investigate the effect of fiber orientation on grinding force and micro-morphology.Besides,a three-phase cutting model of 2.5D C_(f)/SiC composites considering the mechanical properties of the matrix,fiber and interface is developed.Corresponding simulations are performed to reveal the micro-mechanism of crack initiation and extension as well as the material removal mechanism under different fiber orientations.The results indicate that the scratching forces fluctuate periodically,and the order of mean forces is MA>MC>MB.Cracks tend to grow along the fiber axis,which results in the largest damage layer for transverse fibers and the smallest for longitudinal fibers.The removal modes of transverse fibers are worn,fracture and peel-off,in which normal fibers are pullout and outcrop and the longitudinal fibers are worn and push-off.Under the stable cutting condition,the change of contact area between fiber and grit leads to different removal modes of fiber in the same cutting mode,and the increase of contact area results in the aggravation of fiber fracture.
