Low pressure sputtering with a controlled ratio of ion flux to deposited atom flux at the condensing surface is one of the main directions of development of magnetron sputtering methods. Unbalanced magnetron sputterin...Low pressure sputtering with a controlled ratio of ion flux to deposited atom flux at the condensing surface is one of the main directions of development of magnetron sputtering methods. Unbalanced magnetron sputtering, by producing dense secondary plasma around the substrate, provides a high ion current density. The closed-field unbalanced magnetron sputtering system （CFUBMS） has been established as a versatile technique for high-rate deposition high-quality metal, alloy, and ceramic thin films. The＇key factor in the CFUBMS system is the ability to transport high ion currents to the substrate, which can enhance the formation of full dense coatings at relatively low value homologous temperature. The investigation shows that the energy of ions incidenced at the substrate and the ratio of the flux of these ions to the flux of condensing atoms are the fundamental parameters in determining the structure and properties of films produced by ion-assisted deposition processes. Increasing ion bombardment during deposition combined with increasing mobility of the condensing atoms favors the formation of a dense microstructure and a smooth surface.展开更多
Metallic copper（Cu） films were deposited on a Si （100） substrate by unbalanced magnetron sputtering enhanced by radio-frequency plasma and external magnetic field confinement. The morphology and structure of the f...Metallic copper（Cu） films were deposited on a Si （100） substrate by unbalanced magnetron sputtering enhanced by radio-frequency plasma and external magnetic field confinement. The morphology and structure of the films were examined by scanning electron microscopy （SEM）, atomic force microscope （AFM） and X-ray diffraction （XRD）. The surface average roughness of the deposited Cu films was characterized by AFM data and resistivity was measured by a four-point probe. The results show that the Cu films deposited with radio-frequency discharge enhanced ionization and external magnetic field confinement have a smooth surface, low surface roughness and low resistivity. The reasons may be that the radio-frequency discharge and external magnetic field enhance the plasma density, which further improves the ion bombardment effect under the same bias voltage conditions. Ion bombardment can obviously influence the growth features and characteristics of the deposited Cu films.展开更多
Diamond-like carbon （DLC） films are deposited by the Hall ion source assisted by the mid-frequency unbalanced magnetron sputtering technique. The effects of the substrate voltage bias, the substrate temperature, the...Diamond-like carbon （DLC） films are deposited by the Hall ion source assisted by the mid-frequency unbalanced magnetron sputtering technique. The effects of the substrate voltage bias, the substrate temperature, the Hall discharging current and the argon/nitrogen ratio on the DLC film＇s performance were studied. The experimental results show that the film＇s surface roughness, the hardness and the Young＇s modulus increase firstly and then decrease with the bias voltage incrementally increases. Also when the substrate temperature rises, the surface roughness of the film varies slightly, but its hardness and Young＇s modulus firstly increase followed by a sharp decrease when the temperature surpassing 120 ℃. With the Hall discharging current incrementally rising, the hardness and Young＇s modulus of the film decrease and the surface roughness of the film on 316L stainless steel firstly decreased and then remains constant.展开更多
Carbon nitride films were deposited by a twinned microwave electron cyclotron resonance （ECR） plasma source enhanced unbalanced magnetron sputtering system. The results indicate that the structure of the films is se...Carbon nitride films were deposited by a twinned microwave electron cyclotron resonance （ECR） plasma source enhanced unbalanced magnetron sputtering system. The results indicate that the structure of the films is sensitive to the nitrogen content. The increase in the nitrogen flow ratio leads to an increase in the sp3 content and an improvement of the tribological properties.展开更多
ZrO2 thin films were deposited by r.f. reactive unbalanced magnetron sputtering. The influence of electromagnetic coil current on microstructure and optical properties of the films was investigated. At low coil curren...ZrO2 thin films were deposited by r.f. reactive unbalanced magnetron sputtering. The influence of electromagnetic coil current on microstructure and optical properties of the films was investigated. At low coil current of 0.2A, small grains are produced. With the increase of coil current, the deposition rate and surface roughness are decreased and the packing density in proportion to the refractive index is increased remarkably. The refractive index is as high as 2.236 (at X=600nm) at 0.4A. At the high coil current of 0.6A, grains appear to grow up due to thermal effects and therefore optical properties of the films are deteriorated a little.展开更多
Sputtering deposition is one of the most important processes in the vacuum coating, it is widely used in microeletronics industries, optical films, and metallurgical coatings industry et al. Sputtering deposition is, ...Sputtering deposition is one of the most important processes in the vacuum coating, it is widely used in microeletronics industries, optical films, and metallurgical coatings industry et al. Sputtering deposition is, in the vacuum conditions, sputtered particles from the target material deposit on the substrate using energetic ions to bombard surface of target to form a film.展开更多
The effect of unbalanced coefficient of magnetron （UCM） on the structure and tribological properties of CrNx hard coatings was studied.The CrNx coatings were deposited on both Si wafer and hardened tool steel substr...The effect of unbalanced coefficient of magnetron （UCM） on the structure and tribological properties of CrNx hard coatings was studied.The CrNx coatings were deposited on both Si wafer and hardened tool steel substrates using a closed-field unbalanced magnetron sputtering ion plating technique in a gas mixture of Ar＋N2 under different unbalanced magnetron conditions.The coatings were characterized by means of XRD,XPS,SEM,microhardness tester and pin-on-disc tribometer to study respectively their structure,chemical bonding state,microstructure,hardness and tribological properties.The experimental results show that the UCM has a profound effect on the structure,hardness and tribological properties of the CrNx coatings.With increasing the values of UCM,the dominant phases in the deposited coatings evolved from Cr＋Cr2N to Cr2N＋CrN,the microstructure became denser and the hardness increased;in addition,reduced coefficient of friction and improved wear resistance of CrNx coatings were also observed under a larger UCM.展开更多
The principle of magnetron sputtering is introduced andthe balanced and unbalanced magnetrons are compared andthe necessity of unbalanced magnetrons is explained as well. Several recent developments in plasma magnetro...The principle of magnetron sputtering is introduced andthe balanced and unbalanced magnetrons are compared andthe necessity of unbalanced magnetrons is explained as well. Several recent developments in plasma magnetron sputtering, i.e., unbalanced magnetron sputtering, pulsed magnetron sputtering and ion assisted sputtering, are discussed. The recent developments of unbalanced magnetron systems and their incorporation with ion sources result in an understanding in growingimportance of the magnetron sputtering technology, which makes the technology an applicable deposition process for a variety of important films, such as wear-resistant films and decorative films.展开更多
The implantation of Cu into Si substrate was carried out by plasma based ion implantation (PBII) using unbalanced magnetron sputtering (UBMS) cathode as the metal plasma source. The different pulse bias ( U p) and the...The implantation of Cu into Si substrate was carried out by plasma based ion implantation (PBII) using unbalanced magnetron sputtering (UBMS) cathode as the metal plasma source. The different pulse bias ( U p) and the distance between the cathode and the samples ( d s-t ) were chosen to research the characteristics of this method. The results show that the implantation of metal ions can be realized by the metal plasma source of UBMS cathode. The physical process such as the metal ion pure implantation, the gas ion implantation, the recoil implantation of the metal atoms, the deposition of the metal particles and the re sputtering of the metal film depend on the energy, dose and deposition rate of the ions (Cu +, Ar +). The metal plasma based ion implantation of Cu into Si substrate is favored by selecting higher U p (60 kV) and larger d s-t (200 mm). [展开更多
文摘Low pressure sputtering with a controlled ratio of ion flux to deposited atom flux at the condensing surface is one of the main directions of development of magnetron sputtering methods. Unbalanced magnetron sputtering, by producing dense secondary plasma around the substrate, provides a high ion current density. The closed-field unbalanced magnetron sputtering system （CFUBMS） has been established as a versatile technique for high-rate deposition high-quality metal, alloy, and ceramic thin films. The＇key factor in the CFUBMS system is the ability to transport high ion currents to the substrate, which can enhance the formation of full dense coatings at relatively low value homologous temperature. The investigation shows that the energy of ions incidenced at the substrate and the ratio of the flux of these ions to the flux of condensing atoms are the fundamental parameters in determining the structure and properties of films produced by ion-assisted deposition processes. Increasing ion bombardment during deposition combined with increasing mobility of the condensing atoms favors the formation of a dense microstructure and a smooth surface.
基金National Natural Science Foundation of China(Nos.50277003,10505005)
文摘Metallic copper（Cu） films were deposited on a Si （100） substrate by unbalanced magnetron sputtering enhanced by radio-frequency plasma and external magnetic field confinement. The morphology and structure of the films were examined by scanning electron microscopy （SEM）, atomic force microscope （AFM） and X-ray diffraction （XRD）. The surface average roughness of the deposited Cu films was characterized by AFM data and resistivity was measured by a four-point probe. The results show that the Cu films deposited with radio-frequency discharge enhanced ionization and external magnetic field confinement have a smooth surface, low surface roughness and low resistivity. The reasons may be that the radio-frequency discharge and external magnetic field enhance the plasma density, which further improves the ion bombardment effect under the same bias voltage conditions. Ion bombardment can obviously influence the growth features and characteristics of the deposited Cu films.
文摘Diamond-like carbon （DLC） films are deposited by the Hall ion source assisted by the mid-frequency unbalanced magnetron sputtering technique. The effects of the substrate voltage bias, the substrate temperature, the Hall discharging current and the argon/nitrogen ratio on the DLC film＇s performance were studied. The experimental results show that the film＇s surface roughness, the hardness and the Young＇s modulus increase firstly and then decrease with the bias voltage incrementally increases. Also when the substrate temperature rises, the surface roughness of the film varies slightly, but its hardness and Young＇s modulus firstly increase followed by a sharp decrease when the temperature surpassing 120 ℃. With the Hall discharging current incrementally rising, the hardness and Young＇s modulus of the film decrease and the surface roughness of the film on 316L stainless steel firstly decreased and then remains constant.
基金supported by National Natural Science Foundation of China (No.50390060)
文摘Carbon nitride films were deposited by a twinned microwave electron cyclotron resonance （ECR） plasma source enhanced unbalanced magnetron sputtering system. The results indicate that the structure of the films is sensitive to the nitrogen content. The increase in the nitrogen flow ratio leads to an increase in the sp3 content and an improvement of the tribological properties.
基金supported by the“985”program of the Ministry of Education
文摘ZrO2 thin films were deposited by r.f. reactive unbalanced magnetron sputtering. The influence of electromagnetic coil current on microstructure and optical properties of the films was investigated. At low coil current of 0.2A, small grains are produced. With the increase of coil current, the deposition rate and surface roughness are decreased and the packing density in proportion to the refractive index is increased remarkably. The refractive index is as high as 2.236 (at X=600nm) at 0.4A. At the high coil current of 0.6A, grains appear to grow up due to thermal effects and therefore optical properties of the films are deteriorated a little.
文摘Sputtering deposition is one of the most important processes in the vacuum coating, it is widely used in microeletronics industries, optical films, and metallurgical coatings industry et al. Sputtering deposition is, in the vacuum conditions, sputtered particles from the target material deposit on the substrate using energetic ions to bombard surface of target to form a film.
基金Funded by the National High-technology Research and Development Programm of China(No.2005AA33H010)
文摘The effect of unbalanced coefficient of magnetron （UCM） on the structure and tribological properties of CrNx hard coatings was studied.The CrNx coatings were deposited on both Si wafer and hardened tool steel substrates using a closed-field unbalanced magnetron sputtering ion plating technique in a gas mixture of Ar＋N2 under different unbalanced magnetron conditions.The coatings were characterized by means of XRD,XPS,SEM,microhardness tester and pin-on-disc tribometer to study respectively their structure,chemical bonding state,microstructure,hardness and tribological properties.The experimental results show that the UCM has a profound effect on the structure,hardness and tribological properties of the CrNx coatings.With increasing the values of UCM,the dominant phases in the deposited coatings evolved from Cr＋Cr2N to Cr2N＋CrN,the microstructure became denser and the hardness increased;in addition,reduced coefficient of friction and improved wear resistance of CrNx coatings were also observed under a larger UCM.
基金supported by the National Natural Science Foundation of China (No. 50475057)the Tribology Science Fund of the State Key-laboratory of Tribology (No. Kf04.02)
文摘The principle of magnetron sputtering is introduced andthe balanced and unbalanced magnetrons are compared andthe necessity of unbalanced magnetrons is explained as well. Several recent developments in plasma magnetron sputtering, i.e., unbalanced magnetron sputtering, pulsed magnetron sputtering and ion assisted sputtering, are discussed. The recent developments of unbalanced magnetron systems and their incorporation with ion sources result in an understanding in growingimportance of the magnetron sputtering technology, which makes the technology an applicable deposition process for a variety of important films, such as wear-resistant films and decorative films.
文摘The implantation of Cu into Si substrate was carried out by plasma based ion implantation (PBII) using unbalanced magnetron sputtering (UBMS) cathode as the metal plasma source. The different pulse bias ( U p) and the distance between the cathode and the samples ( d s-t ) were chosen to research the characteristics of this method. The results show that the implantation of metal ions can be realized by the metal plasma source of UBMS cathode. The physical process such as the metal ion pure implantation, the gas ion implantation, the recoil implantation of the metal atoms, the deposition of the metal particles and the re sputtering of the metal film depend on the energy, dose and deposition rate of the ions (Cu +, Ar +). The metal plasma based ion implantation of Cu into Si substrate is favored by selecting higher U p (60 kV) and larger d s-t (200 mm). [
