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Diffusion welding of SiCp/2014Al composites using Ni as interlayer 被引量:1
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作者 Tao Feng Xizhang Chen +1 位作者 Luhai Wu Songnian Lou 《Journal of University of Science and Technology Beijing》 CSCD 2006年第3期267-271,共5页
SiCp/2014Al composites were bonded with the vacuum diffusion welding technique using Ni as the interlayer metal. Ni and Al were interdiffused and there were intermetallic compounds formed in the inter transition layer... SiCp/2014Al composites were bonded with the vacuum diffusion welding technique using Ni as the interlayer metal. Ni and Al were interdiffused and there were intermetallic compounds formed in the inter transition layer, which was composed of Ni3Al//NiAl//NiAl3. The relation between the diffusion distance and the element concentration was calculated according to Fick's second law. The relations of the diffusion concentration and the diffusion welding technique parameters were calculated. 展开更多
关键词 aluminum matrix composite diffusion bonding interface diffusion vacuum diffusion welding
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Interfacial Microstructure and Properties of Ti(C, N)/Ni Bonded by Transient Liquid-phase Diffusion
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作者 周世权 熊惟皓 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2009年第3期432-439,共8页
Effects of the main process parameters(temperature and time) on microstructure and properties of Ti(C, N)/Ni interface bonded by (Cu+Nb) interlayer in a vacuum diffusion bonding device were investigated. The in... Effects of the main process parameters(temperature and time) on microstructure and properties of Ti(C, N)/Ni interface bonded by (Cu+Nb) interlayer in a vacuum diffusion bonding device were investigated. The interfacial microstructures consisted initially of Ni3Nb metallic compound and eutectic of Ni3Nb + CuNiss, and finally transformed to (Ti, Nb) (C, N)+Ni3Nb near Ti (C, N) and NiCuss + Ni3Nb near Ni when diffusion bonding temperature was 1 523-1 573 K. It was clear that Cu was a constituent in the transient liquid phase (TLP) into which Ni was dissolved by forming Cu-Ni transition liquid. Nb was dissolved in Cu-Ni transition liquid rapidly. Ti (C, N) conld be wetted by resultant Ni-Nb-Cu transient liquid phase which was followed by a little (Ti, Nb) (C, N) solid solution formed at interface. This increased the interface combining capability. Ultimately the interface shear strength was able to reach 140 MPa. The theoretle analysis and experimental results show that the growth of interfacial reaction layer Ni3Nb accords with parabola law, and the activation energy of diffusion reaction is 115.0±0.5 kJ/mol, while the diffusion reaction speed constant is 12.53 mm/s^1/2. 展开更多
关键词 vacuum diffusion bonding transient liquid phase (TLP) diffusion bonding interlayer activation energy
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