Mechanical properties and interfacial characteristics of 6061 Al alloy plates fabricated by hot-roll bonding

This work aims to investigate the mechanical properties and interfacial characteristics of 6061 Al alloy plates fabricated by hotroll bonding(HRB)based on friction stir welding.The results showed that ultimate tensile strength and total elongation of the hot-rolled and aged joints increased with the packaging vacuum,and the tensile specimens fractured at the matrix after exceeding 1 Pa.Non-equilibrium grain boundaries were formed at the hot-rolled interface,and a large amount of Mg_(2)Si particles were linearly precipitated along the interfacial grain boundaries(IGBs).During subsequent heat treatment,Mg_(2)Si particles dissolved back into the matrix,and Al_(2)O_(3) film remaining at the interface eventually evolved into MgO.In addition,the local IGBs underwent staged elimination during HRB,which facilitated the interface healing due to the fusion of grains at the interface.This process was achieved by the dissociation,emission,and annihilation of dislocations on the IGBs.

Interface analysis of 7B52 Al alloy laminated composite fabricated by hot-roll bonding

The bonding interface of 7B52 Al alloy laminated composite （ALC） fabricated by hot rolling was investigated using optical microscopy （OM）, transmission electron microscopy （TEM）, scanning electron microscopy （SEM）, ultrasonic flaw detection （UFD）, and bonding strength tests. The results show that metallurgical bonding is achieved at the interface after composite rolling. The TEM analysis and tensile tests indicate that the 7B52 ALC plate combines high strength of the hard individual layer and good toughness of the soft individual layer. However, UFD technology and SEM analysis prove that the defects （thick oxide films, acid washed residues, air, oil and coarse particles） existing in the bonding interface are harmful to the bonding strength. To sum up, the composite roiling process is suitable for 7B52 ALC plate, and the content and size of the defects should be controlled strictly. Advanced surface treatment of each individual layer would be beneficial to further improve the bonding quality.

Effect of Reduction on Bonding Interface of Hot-rolled Wear-resistant Steel BTW1/Q345R Cladding Plate

Wear-resistant cladding plates consisting of a substrate（Q345 R） and a clad layer（BTW1） were bonded through hot rolling at the temperature of 1 200 ℃ and a rolling speed of 0.5 m/s. The microhardness of the cladding plate was also tested after being heat treated. The microstructure evolution on the interface of BTW1/Q345 R sheets under various reduction rates was investigated with a scanning electron microscope（SEM） and EBSD. It is found that the micro-cracks and oxide films on the interface disappear when the reduction is 80%, whereas the maximum uniform diffusion distance reaches 10 μm. As a result, a wide range of metallurgical bonding layers forms, which indicates an improved combination between the BTW1 and the Q345 R. Additionally, it is discovered that the unbroken oxide films on the interface are composed of Mn, Si or Cr at the reductions of 50% and 65%. The SEM fractography of tensile specimen demonstrates that the BTW1 has significant dimple characteristics and possesses lower-sized dimples with the increment in reduction, suggesting that the toughness and bonding strength of the cladding plates would be improved by the increase of reduction. The results reveal that a high rolling reduction causes the interfacial oxide film broken and further forms a higher-sized composite metallurgical bonding interface. The peak microhardness is achieved near the interface.

Solid-state bonding between Al and Cu by vacuum hot pressing

Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at temperatures between 623 and 923 K through two thermal processes： hot compression under the deformation rate of 0.2 mrrdmin for 10 rain at pre-set temperatures, and additional pressing at 0.2 mm/min for 20 rain during furnace cooling. After analyzing interface, the feasible diffusion bonding temperature was suggested as 823 K. The three major intermetallic layers generated during diffusion bonding process were identified as AIECu, AlCu＋AlaCu4 and Al4Cu9. Furthermore, local hardness values ofAlECU, AlCu＋AlaCu4 and Al4Cu9 layers average at （4.97±0.05）, （6.33±0.00） and （6.06±0.18） GPa, respectively.

Effect of bonding temperature and heat treatment on microstructure and mechanical property of Mg−6Gd−3Y alloy vacuum diffusion bonded joints

Diffusion bonding of as-cast Mg−6Gd−3Y magnesium alloy was carried out at temperatures of 400−480℃ with bonding pressure of 6 MPa for 90 min.Diffusion bonded joints were solution treated at 495℃ for 14 h and then aged at 200℃ for 30 h.Microstructures and mechanical properties of joints were analyzed.The results showed that rare earth elements and their compounds gathering at bonding interface hindered the grain boundary migration crossing bonding interface.Tensile strength of as-bonded and as-solution treated joints increased firstly and then decreased with the bonding temperature increasing due to the combined effects of grain coarsening and solid-solution strengthening.As-bonded and solution-treated joints fractured at matrix except the joint bonded at 400℃,while aged joints fractured at bonding interface.The highest ultimate tensile strength of 279 MPa with elongation of 2.8%was found in joint bonded at 440℃ with solution treatment followed by aging treatment.

Micro thermal shear stress sensor based on vacuum anodic bonding and bulk-micromachining

This paper describes a micro thermal shear stress sensor with a cavity underneath, based on vacuum anodic bonding and bulk micromachined technology. A Ti/Pt alloy strip, 2μm×100μm, is deposited on the top of a thin silicon nitride diaphragm and functioned as the thermal sensor element. By using vacuum anodic bonding and bulk-si anisotropic wet etching process instead of the sacrificial-layer technique, a cavity, functioned as the adiabatic vacuum chamber, 200μm×200μm×400μm, is placed between the silicon nitride diaphragm and glass （Corning 7740）. This method totally avoid adhesion problem which is a major issue of the sacrificial-layer technique.

Study on process of roll bonding stainless and carbon steel under non-vacuum condition

The non-vacuum roll bonding method of nickel plating on the base materials is put forward in accordance with the primary problems existed in the roll bonding of stainless/carbon steel. After nickel plating test on the base materials, the microstructure of nickel cladding is observed by scanning electron microscopy （SEM） at high, and room temperature, and the results show that the nickel cladding on base material can be protected from oxidation in the high temperature. Non-vacuum roll bonding tests of nickel plating on base materials are done by the roll bonding equipment, and the roll bonding plates of stainless/carbon steel are obtained. The microstructure and the elements distribution of non-vacuum roll bonding interface are analyzed by optical microscope （OM） and SEM. The results reflect that the nickel plating layer and the base materials bond well.

Modeling and Simulation of a Bonding Process for Space Solar Cells

A bonding process for space solar cells implemented by an automated coating and bonding system was theoretically investigated for future parametric studies to achieve better bonding quality. First, the mechanical properties of silicone adhesive and the vacuum suction cup were experimentally analyzed. Based on the constitutive relationship of four parts in the bonding process, the dynamic bonding process was modeled systematically, and numerically simulated by a commercial finite element analysis code, Adina. The final bonding edge-alignment error and the thickness and uniformity of the adhesive layer were obtained from simulation and validated by experiments. A simulation platform was created for predicting the final bonding quality via adjusting bonding parameters when dimensions of the solar cells and adhesive were changed.

Study of Epoxy Bonding

Bonding is used widely when the optical glasses are connected with metal structures. It plays a very important role in the design of space telescope. Improper bonding may induce great surface figure error for optics in telescope. Milbond and EC2216 are the most popular epoxies that are used in optics. Bubbles usually exist in the epoxy when two components are mixed or translated to syringe. In this paper, the methods and experiments of adhesive mixture and injection in vacuum environment were explained to reduce the bonding surface figure of the mirror. The results show that adhesive mixture and injection in vacuum environment can dramatically decrease the bubble in the epoxy and greatly reduce the bonding surface figure error.

Effect of joining temperature on microstructure and properties of diffusion bonded Mg/Al joints

The joining of AZ31B Mg alloy to 6061 Al alloy was investigated at different joining temperatures by vacuum diffusion bonding method. The microstructures of Mg/Al dissimilar joints were studied by means of optical microscopy （OM）, scanning electron microscopy （SEM） and energy dispersive X-ray （EDX）. The results show that the thickness of each layer in the diffusion zone increases with the increase of joining temperature, and the microstructure changes obviously. At joining temperature of 440 °C, the diffusion zone is composed of Mg2Al3 layer and Mg17Al12 layer. At joining temperatures of 460 and 480 °C, the diffusion zone is composed of Mg2Al3 layer, Mg17Al12 layer, eutectic layer of Mg17Al12 and Mg-based solid solution. The width of high-hardness zone in the joint increases with increasing joining temperature, and the micro-hardnesses at different locations in the diffusion zone are significantly different. The joining temperature of 440 °C offers the highest tensile strength of 37 MPa, and the corresponding joint exhibits brittle fracture at the intermetallic compound layer of Mg17Al12.

Influence of Interfacial Diffusion on Mechanical Property of Vacuum Fusion Sinter (VFS) WC-Co Composite Coating

The WC-Co composite coatings bonded tightly to steel substrate have been made by vacuum fusion sinter （VFS）. The concentration distribution of some components were measured by the electron probe, and the microstructure and morphology of VFS coatings were observed and analyzed by SEM, X-ray diffractometer and microhardness tester. Diffusion coefficient of every element was calculated by using the experimental results. The influence of the interracial diffusion on the microstructure, Vickers hardness and interracial bond strength of the VFS coatings was studied in detail. The experimental results show that there is a metallurgical bond area between the VFS WC-Co coatings and the steel substrate. The VFS coatings are characterized by the gradient hardness of the interface and the high bond strength to the steel substate, both of which are beneficial to the improvement of the wear resistance and corrosion resistance.

Interfacial Microstructure and Properties of Ti(C, N)/Ni Bonded by Transient Liquid-phase Diffusion

Effects of the main process parameters（temperature and time） on microstructure and properties of Ti（C, N）/Ni interface bonded by （Cu＋Nb） interlayer in a vacuum diffusion bonding device were investigated. The interfacial microstructures consisted initially of Ni3Nb metallic compound and eutectic of Ni3Nb ＋ CuNiss, and finally transformed to （Ti, Nb） （C, N）＋Ni3Nb near Ti （C, N） and NiCuss ＋ Ni3Nb near Ni when diffusion bonding temperature was 1 523-1 573 K. It was clear that Cu was a constituent in the transient liquid phase （TLP） into which Ni was dissolved by forming Cu-Ni transition liquid. Nb was dissolved in Cu-Ni transition liquid rapidly. Ti （C, N） conld be wetted by resultant Ni-Nb-Cu transient liquid phase which was followed by a little （Ti, Nb） （C, N） solid solution formed at interface. This increased the interface combining capability. Ultimately the interface shear strength was able to reach 140 MPa. The theoretle analysis and experimental results show that the growth of interfacial reaction layer Ni3Nb accords with parabola law, and the activation energy of diffusion reaction is 115.0±0.5 kJ/mol, while the diffusion reaction speed constant is 12.53 mm/s^1/2.

Curing Process of Phenol Formaldehyde Resin for Plywood under Vacuum Conditions

The study characterized the curing behaviors of phenol formaldehyde(PF)resin under different vacuum degrees and explored the properties of 9-ply plywood panels hot-pressed under both vacuum and atmospheric conditions.The changes in core temperature and moisture content of the plywood mats during hot pressing were investigated as well.It was found that the gel times and gel temperatures of PF resin decreased with the increase of vacuum degree using a self-made device.FTIR spectra indicated the degree of polycondensation of hydroxymethyl gradu-ally increased with the increase in temperature.It was also observed that a higher degree of vacuum led to a slower polycondensation reaction rate of PF resin.During different hot-pressing processes,the bonding strengths in the innermost and uppermost gluelines of the vacuum hot-pressed plywood panels were up to 30%–50%higher than their counterparts of conventional hot-pressed products.A less difference in the bonding strengths between these two gluelines was also observed for vacuum hot-pressed products.In addition,the core of vacuum hot-pressed plywood was found to have a greater heating rate and higher temperature at thefinal stage of hot pressing,which was beneficial to cure the PF resin.The results from this study indicate a promising potential of introducing a vacuum during hot pressing to improve the quality and productivity of plywood products and provide a basis for adopting vacuum to hot press wood composites.

添加中间层的TC2钛合金/321不锈钢真空扩散焊研究

目的以Cu箔、Ni箔为中间层,使用真空扩散焊工艺实现TC2钛合金与321不锈钢的焊接。方法采用扫描电子显微镜、EDS能谱仪、X射线衍射仪、冲击韧性实验机、显微硬度计等仪器研究了焊接温度、典型中间层材料等工艺参数对TC2钛合金/321不锈钢焊接界面微观结构、界面元素扩散、接头力学性能的影响规律。结果在添加中间层的扩散焊接头中,是否会形成界面区和扩散区以及界面区和扩散区的宽度,受焊接温度的影响,也受中间层和母材成分及性能的影响。在以Ni为中间层的TC2钛合金与321不锈钢真空扩散焊接头中,扩散区会产生AlNi_(3)、NiTi等新物相,当以Cu为中间层时,扩散区中会产生Cu_(0.81)Ni_(0.19)等新物相。在实验条件下,使用铜箔作为中间层的TC2钛合金与321不锈钢真空扩散焊接头的力学性能优于使用镍箔作为中间层的真空扩散焊接头的力学性能。结论在实验条件下,添加中间层的TC2钛合金/321不锈钢真空扩散焊的最佳工艺参数如下:真空度为10^(-4)Pa,焊接温度为820℃,焊接压力为15MPa,焊接时间(即保温时间)为90min,保压时间为240min,以Cu作为中间层。

Mg/Al真空爆炸焊接微观形貌及力学性能

镁合金和铝合金因具有较高的化学活性,在常规焊接方式下,其表面的氧化物会掺杂到焊接接头内,使得复合板的结合性能下降。为了提高Mg/Al复合板的结合强度,采用真空爆炸焊接法制备了Mg-AZ31B/Al-6061复合板,并与常规空气环境下制备的相同参数复合板进行了对比。通过光学显微镜、扫描电子显微镜、能谱仪以及万能试验机,对结合界面的微观形貌、元素分布和力学性能进行分析。结果表明:由于气体冲击波压力不同,真空环境下复合材料的界面形貌与空气环境下有很大区别;真空环境有效抑制了镁、铝2种金属氧化,在熔化区未检测到金属氧化物。此外,还观察到真空环境下试样的剪切强度和拉伸强度显著增大。因此,真空爆炸焊接对Mg/Al复合板性能的提升起到了重要作用,可以作为一种有效的金属焊接方法。

添加铜中间层的钨真空扩散焊接研究

钨具备优良的物理化学特性,使其在国防军工等领域被广泛应用,但是普通焊接方式难以实现钨的可靠连接,限制了钨的应用。针对难熔金属钨高性能焊接制造的迫切需求,本工作采用铜箔作为中间过渡层,开展了W-W真空扩散焊接实验研究,详细研究了中间层厚度及轴向加载压力对接头力学性能的影响。利用电子万能试验机测试接头的剪切强度,并采用扫描电子显微镜、电子探针X射线显微分析仪分析观察扩散焊接头界面的微观组织、元素分布和断口形貌。结果表明:加入铜中间层可以实现W金属的可靠连接,增加中间层厚度可以使得W/Cu/W的结合界面接触更充分,更利于元素相互扩散,进而有利于提高接头的结合强度。

圆片级封装中的二次硅-玻璃键合工艺研究

针对MEMS谐振器真空封装更高的要求,将盖帽硅片、器件硅片(Si)和玻璃衬底通过二次Si—玻璃(D-SOG)阳极键合工艺,实现了MEMS谐振器加工的同时,完成MEMS谐振器的6in圆片级高真空度封装。通过优化两次键合工艺参数,第二次键合温度由第一次键合温度350℃调整到380℃,键合压力分别为800N(第二次键合)和600N(第一次键合);优化第二次键合封装密封环的键合面积宽度为700μm;达到良好的MEMS谐振器封装效果,器件的泄漏速率为3.85×10^(-9) Pa·m^(3)/s。该研究可以有效降低加工成本和工艺难度、提高器件可靠性,满足了MEMS器件对封装密封性的要求,后续可广泛应用到基于D-SOG的MEMS谐振器封装工艺中,具有良好的应用前景。

6061铝合金真空轧制复合工艺研究

对6061铝合金进行了真空轧制复合及热处理实验,采用光学显微镜、扫描电子显微镜、电子探针微量分析仪和电子万能试验机研究了轧制压下率对铝合金复合板连接界面处显微组织和力学性能的影响。结果表明,颗粒状Mg2Si相沿热轧态连接界面间断性析出,并在后续热处理过程中发生回溶。60%压下率的时效态界面存在富含Mg、O的未愈合缺陷,相应的固溶态和时效态拉伸断口均呈脆性断裂特征。80%压下率的连接界面表现出良好的愈合效果,并且时效态界面处Mg、O的富集被有效降低,热轧态、固溶态和时效态拉伸断口均呈韧性断裂特征,对应的抗拉强度分别为166、229、305MPa。

VCrAl_(1.21)Ni_(0.93)Co_(1.85)高熵合金中间层真空扩散连接TC4钛合金和T2铜

根据伪二元合金设计策略和共晶高熵合金设计理念,设计并制备了VCrAl_(1.21)Ni_(0.93)Co_(1.85)共晶高熵合金中间层用于真空扩散连接TC4钛合金和T2铜,研究了不同连接温度对TC4/T2扩散连接接头微观组织和力学性能的影响规律.结果表明,所有接头界面结合良好无缺陷产生,在TC4侧的连接界面附近发生了部分相变,由α-Ti向β-Ti进行转变,并且形成了部分魏氏体组织.Ti_(2)(Co,Ni),Ti_(2)(V,Cr,Al),Ti(V,Cr,Co)和(V,Cr)(Al,Ni,Co)相形成在TC4/VCrAl_(1.21)Ni_(0.93)Co_(1.85)界面上,而VCrAl_(1.21)Ni_(0.93)Co_(1.85)/T2界面上形成了(V,Cr)(Al,Ni,Co)和(V,Cr)(Cu,Ni,Co)_(3)相.界面上形成高熵微观组织结构起到高熵固溶强化作用,扩散层Ⅰ和Ⅱ对应的生长激活能分别为229 kJ/mol和191 kJ/mol,接头抗剪强度在880℃时达到最大为194 MPa,接头主要沿着BCC基体相和B2相交替位置断裂,断口表面出现河流花样特征,属于一种典型的解理断裂模式.

真空累积叠轧多层钢的组织与性能研究

以30CrMo和316L奥氏体不锈钢作为材料组元,利用真空累积叠轧工艺,制备出高强塑性的36、72、162、405层的多层钢复合材料。结果表明,多层钢界面实现了良好的冶金结合,30CrMo层主要为回复态的铁素体组织,316L层为变形态奥氏体组织。随着层数的增加,界面由平直变成波浪状,元素扩散明显加剧,扩散层形成马氏体组织,可有效提高材料强度;多层钢强度随着层数增加而增加,36层钢的抗拉强度为734 MPa,断裂伸长率为41.5%;405层钢表现出优异强塑性组合,抗拉强度为1125 MPa,伸长率为22.5%。多层钢的高界面结合强度有利于保持两组元协调变形,韧性层和多个强界面可有效约束脆性层的过早局部颈缩,提高材料的塑性。