MEMS vacuum packaging is now the impediment of the MEMS appliance in some specified fields. The major problem of current packaging approach is that the packaging process cannot meet the requirement of the ultra low le...MEMS vacuum packaging is now the impediment of the MEMS appliance in some specified fields. The major problem of current packaging approach is that the packaging process cannot meet the requirement of the ultra low leak. But the process cannot be improved with the existing technology. We propose a novel approach for MEMS vacuum packaging which can remarkably lower the leak rate. This paper analyzed the vacuum maintaining time of the vacuum packaging and compared the current design and new packaging method.展开更多
基金the High-tech Research and Development Program of China under Grant No.2005AA404260
文摘MEMS vacuum packaging is now the impediment of the MEMS appliance in some specified fields. The major problem of current packaging approach is that the packaging process cannot meet the requirement of the ultra low leak. But the process cannot be improved with the existing technology. We propose a novel approach for MEMS vacuum packaging which can remarkably lower the leak rate. This paper analyzed the vacuum maintaining time of the vacuum packaging and compared the current design and new packaging method.
