SSA-over-array(SSoA):A stacked DRAM architecture for nearmemory computing

Aiming to enhance the bandwidth in near-memory computing,this paper proposes a SSA-over-array(SSoA)architecture.By relocating the secondary sense amplifier(SSA)from dynamic random access memory(DRAM)to the logic die and repositioning the DRAM-to-logic stacking interface closer to the DRAM core,the SSoA overcomes the layout and area limitations of SSA and master DQ(MDQ),leading to improvements in DRAM data-width density and frequency,significantly enhancing bandwidth density.The quantitative evaluation results show a 70.18 times improvement in bandwidth per unit area over the baseline,with a maximum bandwidth of 168.296 Tbps/Gb.We believe the SSoA is poised to redefine near-memory computing development strategies.

Vertically Integrated Electronics: New Opportunities from Emerging Materials and Devices

Vertical three-dimensional(3D)integration is a highly attractive strategy to integrate a large number of transistor devices per unit area.This approach has emerged to accommodate the higher demand of data processing capability and to circumvent the scaling limitation.A huge number of research efforts have been attempted to demonstrate vertically stacked electronics in the last two decades.In this review,we revisit materials and devices for the vertically integrated electronics with an emphasis on the emerging semiconductor materials that can be processable by bottom-up fabrication methods,which are suitable for future flexible and wearable electronics.The vertically stacked integrated circuits are reviewed based on the semiconductor materials:organic semiconductors,carbon nanotubes,metal oxide semiconductors,and atomically thin two-dimensional materials including transi-tion metal dichalcogenides.The features,device performance,and fabrication methods for 3D integration of the transistor based on each semiconductor are discussed.Moreover,we highlight recent advances that can be important milestones in the vertically integrated elec-tronics including advanced integrated circuits,sensors,and display systems.There are remaining challenges to overcome;however,we believe that the vertical 3D integration based on emerging semiconductor materials and devices can be a promising strategy for future electronics.

Vertical structure and dominating factors of sand body during Late Triassic Chang 9 time of Yanchang Formation in Ordos Basin, NW China

Based on a synthetic geological study of drilling, well logging and core observations, two main genetic types of Chang 9sand body in Odors Basin were recognized, which included two effects, that is, delta environment and tractive current effects that lead to the development of mouth bar, distal bar, sheet sand and other sand bodies of subaerial and subaqueous distributary channel,natural levee, flood fan and delta front, and shore-shallow lake environment and lake flow transformation effects that result in the development of sandy beach bar, sheet sand and other sand bodies. Chang 9 sand body mainly developed five basic vertical structures, namely box shape, campaniform, infundibuliform, finger and dentoid. The vertical stacking patterns of multilayer sand body was complex, and the common shapes included box shape + box shape, campaniform + campaniform, campaniform + box shape, infundibuliform + infundibuliform, campaniform + infundibuliform, box shape + campaniform, box shape + infundibuliform,and finger + finger. Based on the analysis on major dominating factors of vertical structure of sand body, sedimentary environment,sedimentary facies and rise, fall and cycle of base level are identified as the major geological factors that control the vertical structure of single sand body as well as vertical stacking patterns and distribution of multistory sand bodies.

Hanging Gardens in Modern High-Rise Apartment Buildings

Hanging gardens,which follow the concept of ecology and sustainable development, inherit the design ideas of many classic works in the history of afchitecture, ate an important means in improving tlie living envifonment of people when urban residential buildings in China afe graduaEy characterized by high density and high floor area ratio. Through the analysis of the origin and development of hanging gardens, author of this paper summarized three typical types of hanging gardens in higji-rise apartment buildings, analyzed advantages and factors affecting the design of hanging gardens,and concluded main design points of llie gardens. It is believed that in the process of planning, design, construction and management of tiie hanging gafdens in high-rise apartment buildings in China, demand characteristics of different use groups should be taken into account, much emphasis should be placed to service to people than, visual pursuit, and human behaviors should be combined with built environment, thereby achieving the blending of people and scenery.

Get it white: color-tunable AC/DC OLEDs

Organic light-emitting diodes(OLEDs)have gained considerable attention because of their use of inherently flexible materials and their compatibility with facile roll-to-roll and printing processes.In addition to high efficiency,flexibility and transparency,reliable color tunability of solid state light sources is a desirable feature in the lighting and display industry.Here,we demonstrate a device concept for highly efficient organic light-emitting devices whose emission color can be easily adjusted from deep-blue through cold-white and warm-white to saturated yellow.Our approach exploits the different polarities of the positive and negative half-cycles of an alternating current(AC)driving signal to independently address a fluorescent blue emission unit and a phosphorescent yellow emission unit which are vertically stacked on top of each other.The electrode design is optimized for simple fabrication and driving and allows for two-terminal operation by a single source.The presented concept for color-tunable OLEDs is compatible with application requirements and versatile in terms of emitter combinations.

Land 3D-Seismic Data: Preprocessing Quality Control Utilizing Survey Design Specifications, Noise Properties, Normal Moveout, First Breaks, and Offset

The recent proliferation of the 3D reflection seismic method into the near-surface area of geophysical applications, especially in response to the emergence of the need to comprehensively characterize and monitor near-surface carbon dioxide sequestration in shallow saline aquifers around the world, justifies the emphasis on cost-effective and robust quality control and assurance （QC/QA） workflow of 3D seismic data preprocessing that is suitable for near-surface applications. The main purpose of our seismic data preprocessing QC is to enable the use of appropriate header information, data that are free of noise-dominated traces, and/or flawed vertical stacking in subsequent processing steps. In this article, I provide an account of utilizing survey design specifications, noise properties, first breaks, and normal moveout for rapid and thorough graphical QC/QA diagnostics, which are easy to apply and efficient in the diagnosis of inconsistencies. A correlated vibroseis time-lapse 3D-seismic data set from a CO2-flood monitoring survey is used for demonstrating QC diagnostics. An important by-product of the QC workflow is establishing the number of layers for a refraction statics model in a data-driven graphical manner that capitalizes on the spatial coverage of the 3D seismic data.