为提高Exp-Golomb码的编解码效率,提出了一种基于快速"首位1检测"的Exp-Golomb编解码器硬件实现方法,降低了计算量并节省了硬件资源。该Exp-Golomb编解码器已通过RTL(Register Transfer Level)级仿真和综合,并在FPGA(Field Pr...为提高Exp-Golomb码的编解码效率,提出了一种基于快速"首位1检测"的Exp-Golomb编解码器硬件实现方法,降低了计算量并节省了硬件资源。该Exp-Golomb编解码器已通过RTL(Register Transfer Level)级仿真和综合,并在FPGA(Field Programmable Gate Array)开发平台进行了验证,在133 MHz时钟频率下编解码器的综合门数分别为765门和632门。该编解码器能满足Baseline档次(30帧/s),分辨率为352×288视频序列的实时编解码对质量和速度的要求。展开更多
The interconnect temperature of very large scale integration（VLSI） circuits keeps rising due to self-heating and substrate temperature, which can increase the delay and power dissipation of interconnect wires. The t...The interconnect temperature of very large scale integration（VLSI） circuits keeps rising due to self-heating and substrate temperature, which can increase the delay and power dissipation of interconnect wires. The thermal vias are regarded as a promising method to improve the temperature performance of VLSI circuits. In this paper, the extra thermal vias were used to decrease the delay and power dissipation of interconnect wires of VLSI circuits. Two analytical models were presented for interconnect temperature, delay and power dissipation with adding extra dummy thermal vias. The influence of the number of thermal vias on the delay and power dissipation of interconnect wires was analyzed and the optimal via separation distance was investigated. The experimental results show that the adding extra dummy thermal vias can reduce the interconnect average temperature, maximum temperature, delay and power dissipation. Moreover, this method is also suitable for clock signal wires with a large root mean square current.展开更多
基金Supported by the Guangdong Provincial Natural Science Foundation of China(2014A030313441)the Guangzhou Science and Technology Project(201510010169)+1 种基金the Guangdong Province Science and Technology Project(2016B090918071,2014A040401076)the National Natural Science Foundation of China(61072028)
文摘The interconnect temperature of very large scale integration（VLSI） circuits keeps rising due to self-heating and substrate temperature, which can increase the delay and power dissipation of interconnect wires. The thermal vias are regarded as a promising method to improve the temperature performance of VLSI circuits. In this paper, the extra thermal vias were used to decrease the delay and power dissipation of interconnect wires of VLSI circuits. Two analytical models were presented for interconnect temperature, delay and power dissipation with adding extra dummy thermal vias. The influence of the number of thermal vias on the delay and power dissipation of interconnect wires was analyzed and the optimal via separation distance was investigated. The experimental results show that the adding extra dummy thermal vias can reduce the interconnect average temperature, maximum temperature, delay and power dissipation. Moreover, this method is also suitable for clock signal wires with a large root mean square current.
