1.Introduction In recent years,China's semiconductor equipment industry has made considerable progress,some key equipment have been developed,achieving a revolutionary breakthrough.Meanwhile,a great number of dome...1.Introduction In recent years,China's semiconductor equipment industry has made considerable progress,some key equipment have been developed,achieving a revolutionary breakthrough.Meanwhile,a great number of domestic equipment have been applied to large mass production lines,indicating new progress in industrialization.From the policy perspective,the state has continuously introduced policies to support the localization of the semiconductor industry,and has invested more than 100 billion yuan to boost the development of the semiconductor industry chain since 2014.展开更多
In response to the growing complexity and performance of integrated circuit(IC),there is an urgent need to enhance the testing and stability of IC test equipment.A method was proposed to predict equipment stability us...In response to the growing complexity and performance of integrated circuit(IC),there is an urgent need to enhance the testing and stability of IC test equipment.A method was proposed to predict equipment stability using the upper side boundary value of normal distribution.Initially,the K-means clustering algorithm classifies and analyzes sample data.The accuracy of this boundary value is compared under two common confidence levels to select the optimal threshold.A range is then defined to categorize unqualified test data.Through experimental verification,the method achieves the purpose of measuring the stability of qualitative IC equipment through a deterministic threshold value and judging the stability of the equipment by comparing the number of unqualified data with the threshold value,which realizes the goal of long-term operation monitoring and stability analysis of IC test equipment.展开更多
随着集成电路规模不断扩大,芯片的集成度和密度越来越高,SiP系统集成封装技术应用越来越广泛,在ATE(Automatic Test Equipment,自动测试设备)上面临着更多的挑战。多芯片封装的同时也带来了巨大的测试量,研究和优化测试方法、缩短测试时...随着集成电路规模不断扩大,芯片的集成度和密度越来越高,SiP系统集成封装技术应用越来越广泛,在ATE(Automatic Test Equipment,自动测试设备)上面临着更多的挑战。多芯片封装的同时也带来了巨大的测试量,研究和优化测试方法、缩短测试时间,提升测试效率具有现实意义。针对SiP的电路结构和测试需求,提出一种基于ATE的SiP测试优化方案,满足测试要求,应用于多种可编程逻辑器件测试,对其他电路也具有较强的通用性。展开更多
文摘1.Introduction In recent years,China's semiconductor equipment industry has made considerable progress,some key equipment have been developed,achieving a revolutionary breakthrough.Meanwhile,a great number of domestic equipment have been applied to large mass production lines,indicating new progress in industrialization.From the policy perspective,the state has continuously introduced policies to support the localization of the semiconductor industry,and has invested more than 100 billion yuan to boost the development of the semiconductor industry chain since 2014.
基金the National Natural Science Foundation of China(61306046,61640421)the Yicheng Elite Project(202371)+3 种基金the Open Project of National Local Joint Engineering Laboratory of RF Integration and Micro-assembly Technology(KFJJ20230101)the National Key Laboratory of Integrated Chips and Systems Project(SLICS-K202316)the Anhui University Research Project(2023AH050481)the Research on Testing Methods and Accuracy of High Frequency Signal Chips(2023AH050500)。
文摘In response to the growing complexity and performance of integrated circuit(IC),there is an urgent need to enhance the testing and stability of IC test equipment.A method was proposed to predict equipment stability using the upper side boundary value of normal distribution.Initially,the K-means clustering algorithm classifies and analyzes sample data.The accuracy of this boundary value is compared under two common confidence levels to select the optimal threshold.A range is then defined to categorize unqualified test data.Through experimental verification,the method achieves the purpose of measuring the stability of qualitative IC equipment through a deterministic threshold value and judging the stability of the equipment by comparing the number of unqualified data with the threshold value,which realizes the goal of long-term operation monitoring and stability analysis of IC test equipment.
文摘随着集成电路规模不断扩大,芯片的集成度和密度越来越高,SiP系统集成封装技术应用越来越广泛,在ATE(Automatic Test Equipment,自动测试设备)上面临着更多的挑战。多芯片封装的同时也带来了巨大的测试量,研究和优化测试方法、缩短测试时间,提升测试效率具有现实意义。针对SiP的电路结构和测试需求,提出一种基于ATE的SiP测试优化方案,满足测试要求,应用于多种可编程逻辑器件测试,对其他电路也具有较强的通用性。
