Considerable efforts are currently being devoted to investigation of metal-organic, organic-organic and organic-inorganic interfaces relevant to organic electronic devices such as organic light emitting diode (OLEDs),...Considerable efforts are currently being devoted to investigation of metal-organic, organic-organic and organic-inorganic interfaces relevant to organic electronic devices such as organic light emitting diode (OLEDs), organic photovoltaic solar cells, organic field effect transistors (OFETs), organic spintronic devices and organic-based Write Once Read Many times (WORM) memory devices on both rigid and flexible substrates in laboratories around the world. The multilayer structure of these devices makes interfaces between dissimilar materials in contact and plays a prominent role in charge transport and injection efficiency which inevitably affect device performance. This paper presents results of an initial study on how switching between voltage thresholds and chemical surface treatment affects adhesion properties of a metal-organic (Au-PEDOT:PSS) contact interface in a WORM device. Contact and Tapping-mode Atomic Force Microscopy (AFM) gave surface topography, phase imaging and interface adhesion properties in addition to SEM/EDX imaging which showed that surface treatment, switching and surface roughness all appeared to be key factors in increasing interface adhesion with implications for increased device performance.展开更多
This paper focuses on the simulation of the low-voltage arc with an opening contact. A controllable experiment setup with a rotating contact is designed to investigate the arc behaviour. Supported by the experiment, t...This paper focuses on the simulation of the low-voltage arc with an opening contact. A controllable experiment setup with a rotating contact is designed to investigate the arc behaviour. Supported by the experiment, the phenomena of arc elongation and commutation in the case of rotating contact are simulated with the dynamic grid technique introduced. Under the given condition of the external magnetic field and the contact rotating velocity, the stagnation and rapid jump of two arc roots are observed by the calculated and experimental arc root displacement. The voltage of arc column can be divided into four phases and its sharp rising progress comes from the increase of the displacement difference between two arc roots in x direction.展开更多
Power semiconductor devices are the key technology driver for all power electronic system engineering.The main development trend for power devices is going towards higher power handling capability at even smaller Sivo...Power semiconductor devices are the key technology driver for all power electronic system engineering.The main development trend for power devices is going towards higher power handling capability at even smaller Sivolume, faster switching performance,advanced ruggedness and reliability at elevated operating temperature and extended SOA diagrams.To cover all applications in the various fields of industry,consumer,computing and automotive the device optimization is different for low voltage power MOSFET,for high voltage MOSFET,for plasma modulated devices and components based on wide bandgap(WB) material.In the paper,the main development trends will be described and discussed.展开更多
To design a Double-Pole Four-Throw (DP4T) RF switch, measurement of device parameters is required. In this DP4T RF switch CMOS is a unit cell, so with a thin oxide layer of thickness 628 ? which is measured optically....To design a Double-Pole Four-Throw (DP4T) RF switch, measurement of device parameters is required. In this DP4T RF switch CMOS is a unit cell, so with a thin oxide layer of thickness 628 ? which is measured optically. Some of the material parameters were found by the curve drawn between Capacitance versus Voltage (C-V) and Capacitance versus Frequency (C-F) with the application of Visual Engineering Environment Programming (VEE Pro). To perform the measurement processing at a distance, from the hazardous room, we use VEE Pro software. In this research, to acquire a fine result for RF MOSFET, we vary the voltage with minor increments and perform the measurements by vary the applying voltage from +5 V to –5 V and then back to +5 V again and then save this result in a data sheet with respect to temperature, voltage and frequency using this program. We have investigated the characteristics of RF MOSFET, which will be used for the wireless telecommunication systems.展开更多
A study is conducted to evaluate 1.2 kV silicon-carbide(SiC)MOSFETs in a cascaded H-bridge(CHB)three-phase inverter for medium-voltage applications.The main purpose of this topology is to remove the need for a bulky 6...A study is conducted to evaluate 1.2 kV silicon-carbide(SiC)MOSFETs in a cascaded H-bridge(CHB)three-phase inverter for medium-voltage applications.The main purpose of this topology is to remove the need for a bulky 60 Hz transformer normally used to step up the output signal of a voltage source inverter to a medium-voltage level.Using SiC devices(1.2-6.5 kV SiC MOSFETs)which have a high breakdown voltage,enables the system to meet and withstand the medium-voltage stress using only a minimal number of cascaded modules.The SiC-based power electronics when used in the presented topology considerably reduce the complexity usually encountered when Si devices are used to meet the medium-voltage level and power scalability.Simulation and preliminary experimental results on a low-voltage prototype verifies the nine-level CHB topology presented in this study.展开更多
The modular multilevel converter(MMC)is a promising topology for medium-voltage drive applications due to its high-quality output waveforms,low device switching frequency and voltage rating.However,the large cell capa...The modular multilevel converter(MMC)is a promising topology for medium-voltage drive applications due to its high-quality output waveforms,low device switching frequency and voltage rating.However,the large cell capacitor voltage ripple is a severe challenge faced by MMC at low motor speeds.Recently,a hybrid MMC(HMMC)topology is proven to be a competitive solution because of its lower cell capacitor voltage ripple and not demonstrating a common-mode voltage(CMV)problem compared with other methods.However,the DC-link switch with IGBT limits HMMC from being applied in highvoltage applications.This paper uses a thyristor instead of IGBT as the DC-link switch.To ensure the thyristor can be softly turned on and safely turned off,a new control scheme is proposed.When using this proposed scheme,HMMC can also tolerate the failure of the thyristor being turned-off without shutting down the system,effectively improving its reliability.The cell capacitor voltage ripple analysis is presented considering the effects of the thyristor switching process.In addition,a decoupled energy balancing control is utilized to suppress the fluctuation of the DC current.Experimental results obtained from a 380 V/7.5 kW downscaled prototype validate the effectiveness of starting up a motor from the standby mode to rated speed applying full-torque.展开更多
基于电感电流临界导通模式(critical conduction mode,CRM)的控制型软开关技术可实现开关管零电压开通(zero voltage switching,ZVS),但传统恒定电流复位方法的反向电流大,开关管通态损耗高。文中以单相三电平中点箝位型(three-level ne...基于电感电流临界导通模式(critical conduction mode,CRM)的控制型软开关技术可实现开关管零电压开通(zero voltage switching,ZVS),但传统恒定电流复位方法的反向电流大,开关管通态损耗高。文中以单相三电平中点箝位型(three-level neutral point clamped,3L-NPC)逆变器为研究对象,提出一种具有最小电感复位电流的控制方法。首先,分析开关管ZVS的实现条件,建立谐振等效电路分析模型,推导出电感复位电流理论最小值,在保证整个工频周期内开关管ZVS的同时,降低复位电流导致的开关管通态损耗。然后,建立逆变器损耗分析模型,将文中方法与传统恒定电流复位方法进行损耗计算与对比。最后,搭建一台1 kW的单相3L-NPC逆变器样机进行实验,结果表明文中方法相比于传统恒定电流复位方法,降低了损耗,最高变换效率提升约0.5个百分点。展开更多
文摘Considerable efforts are currently being devoted to investigation of metal-organic, organic-organic and organic-inorganic interfaces relevant to organic electronic devices such as organic light emitting diode (OLEDs), organic photovoltaic solar cells, organic field effect transistors (OFETs), organic spintronic devices and organic-based Write Once Read Many times (WORM) memory devices on both rigid and flexible substrates in laboratories around the world. The multilayer structure of these devices makes interfaces between dissimilar materials in contact and plays a prominent role in charge transport and injection efficiency which inevitably affect device performance. This paper presents results of an initial study on how switching between voltage thresholds and chemical surface treatment affects adhesion properties of a metal-organic (Au-PEDOT:PSS) contact interface in a WORM device. Contact and Tapping-mode Atomic Force Microscopy (AFM) gave surface topography, phase imaging and interface adhesion properties in addition to SEM/EDX imaging which showed that surface treatment, switching and surface roughness all appeared to be key factors in increasing interface adhesion with implications for increased device performance.
基金the Science & Technology research key project of MOE (No.10518)National Natural Science Foundation of China (Nos.50477025,50537050 and 50525722)
文摘This paper focuses on the simulation of the low-voltage arc with an opening contact. A controllable experiment setup with a rotating contact is designed to investigate the arc behaviour. Supported by the experiment, the phenomena of arc elongation and commutation in the case of rotating contact are simulated with the dynamic grid technique introduced. Under the given condition of the external magnetic field and the contact rotating velocity, the stagnation and rapid jump of two arc roots are observed by the calculated and experimental arc root displacement. The voltage of arc column can be divided into four phases and its sharp rising progress comes from the increase of the displacement difference between two arc roots in x direction.
文摘Power semiconductor devices are the key technology driver for all power electronic system engineering.The main development trend for power devices is going towards higher power handling capability at even smaller Sivolume, faster switching performance,advanced ruggedness and reliability at elevated operating temperature and extended SOA diagrams.To cover all applications in the various fields of industry,consumer,computing and automotive the device optimization is different for low voltage power MOSFET,for high voltage MOSFET,for plasma modulated devices and components based on wide bandgap(WB) material.In the paper,the main development trends will be described and discussed.
文摘To design a Double-Pole Four-Throw (DP4T) RF switch, measurement of device parameters is required. In this DP4T RF switch CMOS is a unit cell, so with a thin oxide layer of thickness 628 ? which is measured optically. Some of the material parameters were found by the curve drawn between Capacitance versus Voltage (C-V) and Capacitance versus Frequency (C-F) with the application of Visual Engineering Environment Programming (VEE Pro). To perform the measurement processing at a distance, from the hazardous room, we use VEE Pro software. In this research, to acquire a fine result for RF MOSFET, we vary the voltage with minor increments and perform the measurements by vary the applying voltage from +5 V to –5 V and then back to +5 V again and then save this result in a data sheet with respect to temperature, voltage and frequency using this program. We have investigated the characteristics of RF MOSFET, which will be used for the wireless telecommunication systems.
文摘A study is conducted to evaluate 1.2 kV silicon-carbide(SiC)MOSFETs in a cascaded H-bridge(CHB)three-phase inverter for medium-voltage applications.The main purpose of this topology is to remove the need for a bulky 60 Hz transformer normally used to step up the output signal of a voltage source inverter to a medium-voltage level.Using SiC devices(1.2-6.5 kV SiC MOSFETs)which have a high breakdown voltage,enables the system to meet and withstand the medium-voltage stress using only a minimal number of cascaded modules.The SiC-based power electronics when used in the presented topology considerably reduce the complexity usually encountered when Si devices are used to meet the medium-voltage level and power scalability.Simulation and preliminary experimental results on a low-voltage prototype verifies the nine-level CHB topology presented in this study.
基金This work was supported by the National Natural Science Foundation of China under Grant 51720105008 and 52177173。
文摘The modular multilevel converter(MMC)is a promising topology for medium-voltage drive applications due to its high-quality output waveforms,low device switching frequency and voltage rating.However,the large cell capacitor voltage ripple is a severe challenge faced by MMC at low motor speeds.Recently,a hybrid MMC(HMMC)topology is proven to be a competitive solution because of its lower cell capacitor voltage ripple and not demonstrating a common-mode voltage(CMV)problem compared with other methods.However,the DC-link switch with IGBT limits HMMC from being applied in highvoltage applications.This paper uses a thyristor instead of IGBT as the DC-link switch.To ensure the thyristor can be softly turned on and safely turned off,a new control scheme is proposed.When using this proposed scheme,HMMC can also tolerate the failure of the thyristor being turned-off without shutting down the system,effectively improving its reliability.The cell capacitor voltage ripple analysis is presented considering the effects of the thyristor switching process.In addition,a decoupled energy balancing control is utilized to suppress the fluctuation of the DC current.Experimental results obtained from a 380 V/7.5 kW downscaled prototype validate the effectiveness of starting up a motor from the standby mode to rated speed applying full-torque.
文摘基于电感电流临界导通模式(critical conduction mode,CRM)的控制型软开关技术可实现开关管零电压开通(zero voltage switching,ZVS),但传统恒定电流复位方法的反向电流大,开关管通态损耗高。文中以单相三电平中点箝位型(three-level neutral point clamped,3L-NPC)逆变器为研究对象,提出一种具有最小电感复位电流的控制方法。首先,分析开关管ZVS的实现条件,建立谐振等效电路分析模型,推导出电感复位电流理论最小值,在保证整个工频周期内开关管ZVS的同时,降低复位电流导致的开关管通态损耗。然后,建立逆变器损耗分析模型,将文中方法与传统恒定电流复位方法进行损耗计算与对比。最后,搭建一台1 kW的单相3L-NPC逆变器样机进行实验,结果表明文中方法相比于传统恒定电流复位方法,降低了损耗,最高变换效率提升约0.5个百分点。